Segmented focal plane array architecture
First Claim
1. A system comprising:
- a focal plane array (FPA) comprising;
a first die comprising an array of active bolometers adapted to receive infrared (IR) radiation from a scene and a selected portion of a read-out integrated circuit (ROIC) for the array of active bolometers, the selected portion of the ROIC comprising analog circuitry configured to provide analog signals in response to the IR radiation received by the array of active bolometers;
a second die comprising a remainder of the ROIC for the array of active bolometers such that components of the ROIC are distributed between the first and the second die, the first die stacked on top of the second die to expose the array of active bolometers for receiving the IR radiation;
a plurality of inter-die connections adapted to pass signals between the first die and the second die, wherein the passed signals are used to generate output values corresponding to the IR radiation received at the array of active bolometers; and
a bias correction circuit implemented on the first die and a low-dropout regulator (LDO) implemented on the second die and configured to provide a regulated voltage to the bias correction circuit via one or more of the plurality of inter-die connections, wherein the bias correction circuit is configured to provide the bias voltage to the array of active bolometers in response to the regulated voltage from the LDO.
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Accused Products
Abstract
Various techniques are provided for implementing a segmented focal plane array (FPA) of infrared sensors. In one example, a system includes a segmented FPA. The segmented FPA includes a top die having an array of infrared sensors (e.g., bolometers). The top die may also include a portion of a read-out integrated circuit (ROIC). The segmented FPA also includes a bottom die having at least a portion of the ROIC. The top and the bottom dies are electrically coupled via inter-die connections. Advantageously, the segmented FPA may be fabricated with a higher yield and a smaller footprint compared with conventional FPA architectures. Moreover, the segmented FPA may be fabricated using different semiconductor processes for each die.
117 Citations
24 Claims
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1. A system comprising:
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a focal plane array (FPA) comprising; a first die comprising an array of active bolometers adapted to receive infrared (IR) radiation from a scene and a selected portion of a read-out integrated circuit (ROIC) for the array of active bolometers, the selected portion of the ROIC comprising analog circuitry configured to provide analog signals in response to the IR radiation received by the array of active bolometers; a second die comprising a remainder of the ROIC for the array of active bolometers such that components of the ROIC are distributed between the first and the second die, the first die stacked on top of the second die to expose the array of active bolometers for receiving the IR radiation; a plurality of inter-die connections adapted to pass signals between the first die and the second die, wherein the passed signals are used to generate output values corresponding to the IR radiation received at the array of active bolometers; and a bias correction circuit implemented on the first die and a low-dropout regulator (LDO) implemented on the second die and configured to provide a regulated voltage to the bias correction circuit via one or more of the plurality of inter-die connections, wherein the bias correction circuit is configured to provide the bias voltage to the array of active bolometers in response to the regulated voltage from the LDO. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
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9. A method comprising:
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fabricating a first die comprising an array of active bolometers adapted to receive infrared (IR) radiation from a scene and a selected portion of a read-out integrated circuit (ROIC) for the array of active bolometers, the selected portion of the ROIC comprising analog circuitry configured to provide analog signals in response to the IR radiation received by the array of active bolometers; fabricating a second die comprising a remainder of the ROIC for the array of active bolometers such that components of the ROIC are distributed between the first and the second die; forming a plurality of inter-die connections adapted to pass signals between the first die and the second die, wherein the passed signals are used to generate output values corresponding to the IR radiation received at the array of active bolometers; stacking the first die on top of the second die to expose the array of active bolometers for receiving the IR radiation; wherein the first die, the second die, and the inter-die connections are part of a focal plane array (FPA); the fabricating of the first die comprises implementing, on the first die, a bias correction circuit configured to provide a bias voltage to the array of active bolometers; the fabricating of the second dies comprises implementing, on the second die, a low-dropout regulator (LDO) configured to provide a regulated voltage to the bias correction circuit via one or more of the plurality of inter-die connections; and the bias correction circuit is configured to provide the bias voltage to the array of active bolometers in response to the regulated voltage from the LDO. - View Dependent Claims (10, 11, 12, 13, 14, 15, 16)
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17. A method comprising:
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receiving infrared (IR) radiation from a scene at a focal plane array (FPA) comprising; a first die comprising an array of active bolometers and a selected portion of a read-out integrated circuit (ROIC) for the array of active bolometers, the selected portion of the ROIC comprising analog circuitry configured to provide analog signals in response to the IR radiation received by the array of active bolometers, a second die comprising a remainder of the ROIC for the array of active bolometers such that components of the ROIC are distributed between the first and the second die, the first die stacked on top of the second die to expose the array of active bolometers for receiving the IR radiation, and a plurality of inter-die connections between the first die and the second die; passing signals between the first die and the second die through the inter-die connections; and generating output values corresponding to the IR radiation received at the array of active bolometers, wherein the passed signals are used to perform the generating; providing a bias voltage to the array of active bolometers by a bias correction circuit implemented on the first die, providing a regulated voltage from a low-dropout regulator (LDO) implemented on the second die to the bias correction circuit via one or more of the plurality of inter-die connections, wherein the providing of the bias voltage by the bias correction circuit is in response to receiving the regulated voltage from the LDO. - View Dependent Claims (18, 19, 20, 21, 22, 23, 24)
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Specification