Electromagnetic interference shield

• US 9,918,416 B2
• Filed: 01/27/2015
• Issued: 03/13/2018
• Est. Priority Date: 12/26/2014
• Status: Active Grant

• Current Assignee: II-VI Delaware, Inc. (Coherent Corp.)
• Original Assignee: Finisar Corporation (II-VI Incorporated)
• Inventors: Mao, Yandong, Zeng, Xiaojun, Zhao, Niles
• Primary Examiner(s): Torres, Juan A
• Application Number:
  US14/606,721
• Publication Number:
  US 20160192545A1
• Time in Patent Office: 1,141 Days
• Field of Search: 398136
• CPC Class Codes: G02B 6/4246 Bidirectionally operating package structures
• CPC Class Codes: G02B 6/4277 Protection against electromagnetic interference [EMI], e.g. shielding means shielding of electric apparatus H05K9/00, of instruments G12B17/00
• CPC Class Codes: G02B 6/4292 the light guide being disconnectable from the opto-electronic element, e.g. mutually self aligning arrangements
• CPC Class Codes: H04B 10/40 Transceivers
• CPC Class Codes: H05K 9/0058 specially adapted for optoelectronic applications

Abstract

An electromagnetic interference (EMI) shield may include a first shield section configured to be positioned on a first portion of an optical subassembly and a second shield section configured to be positioned on a second portion of the optical subassembly. The first shield section may be configured to contact the second shield section such that the first shield section and the second shield section are held in place when the first shield section and the second shield section are positioned, respectively, on the first portion and the second portion of the optical subassembly.

Claims

1. An electromagnetic interference (“

EMI”

) shield, comprising;

a first shield section configured to be positioned on a first portion of an optical subassembly including a laser; and

a second shield section configured to be positioned on a second portion of the optical subassembly, wherein the laser of the optical assembly is located between the first shield section and the second shield section,

wherein;

the first shield section is configured to contact the second shield section such that the first shield section and the second shield section are held in place when the first shield section and the second shield section are positioned, respectively, on the first portion and the second portion of the optical subassembly,

the first shield section includes a first base and a first pair of arms located on the first base, the first pair of arms being configured to be at least partially positioned on opposite sides of the optical subassembly,

the second shield section includes a second base and a second pair of arms located on the second base, the second pair of arms being configured to be at least partially positioned on the opposite sides of the optical subassembly,

the first shield section further includes a first pair of flanges located on the first base, the first pair of flanges configured to be at least partially positioned on a front and a back of the optical subassembly, and

the second shield section further includes a second pair of flanges located on the second base, the second pair of flanges configured to be at least partially positioned on the front and the back of the optical subassembly,

the first shield section further includes a first plurality of fingers located on the first pair of arms, the first plurality of fingers being positioned over the first pair of flanges, and

the second shield section further includes a second plurality of fingers located on the second pair of arms, the second plurality of fingers being positioned over the second pair of flanges.

2. The EMI shield of claim 1, wherein the first shield section and the second shield section each comprise a conductive material.

3. The EMI shield of claim 1, wherein the optical subassembly includes a transmitter optical subassembly (TOSA).

4. The EMI shield of claim 1, wherein the first shield section and the second shield section are configured to be held in place by a press fit between the first shield section and the second shield section.

5. The EMI shield of claim 1, wherein the first shield section and the second shield section are configured to be further held together by a shell and a cover of an optoelectronic transceiver module configured to house the optical subassembly.

6. The EMI shield of claim 1, wherein the first shield section includes a first stamping of pressformed sheet metal and the second shield section includes a second stamping of pressformed sheet metal.

7. An optoelectronic transceiver module, comprising:

a transceiver body that includes a shell and a cavity formed in the shell;

a transmitter optical subassembly (TOSA) connected to the transceiver body by way of a connector block;

a cover configured to cover the cavity and attach to the shell; and

an electromagnetic interference (“

EMI”

) shield at least partially covering the TOSA, the EMI shield including;

a first shield section configured to be positioned on a first portion of the TOSA; and

a second shield section configured to be positioned on a second portion of the TOSA,

wherein a laser of the TOSA is located between the first shield section and the second shield section, and

wherein the first shield section is configured to contact the second shield section such that the first shield section and the second shield section are held in place when the first shield section and the second shield section are positioned, respectively, on the first portion and the second portion of the TOSA,

the first shield section includes a first base and a first pair of arms located on the first base, the first pair of arms being configured to be at least partially positioned on opposite sides of the optical subassembly,

the second shield section includes a second base and a second pair of arms located on the second base, the second pair of arms being configured to be at least partially positioned on the opposite sides of the optical subassembly,

the first shield section further includes a first pair of flanges located on the first base, the first pair of flanges configured to be at least partially positioned on a front and a back of the optical subassembly, and

the second shield section further includes a second pair of flanges located on the second base, the second pair of flanges configured to be at least partially positioned on the front and the back of the optical subassembly,

the first shield section further includes a first plurality of fingers located on the first pair of arms, the first plurality of fingers being positioned over the first pair of flanges, and

the second shield section further includes a second plurality of fingers located on the second pair of arms, the second plurality of fingers being positioned over the second pair of flanges.

8. The optoelectronic transceiver module of claim 7, wherein the first shield section and the second shield section comprise a conductive material.

9. The optoelectronic transceiver module of claim 7, wherein the first shield section and the second shield section are configured to be further held together, at least in part, by the shell and the cover.

10. The optoelectronic transceiver module of claim 7, wherein the first shield section includes a first stamping of pressformed of stamped sheet metal and the second shield section includes a second stamping of pressformed sheet metal.

11. An electromagnetic interference (“

EMI”

) shield, comprising;

a first shield section configured to be positioned on a first portion of an optical subassembly including a photodiode, the first shield section including;

a first base;

a first pair of arms located on the first base, the first pair of arms being configured to be at least partially positioned on opposite sides of the optical subassembly;

a first pair of flanges located on the first base, the first pair of flanges configured to be at least partially positioned on a front and a back of the optical subassembly; and

a first plurality of fingers located on the first pair of arms, the first plurality of fingers being positioned over the first pair of flanges; and

a second shield section configured to be positioned on a second portion of the optical subassembly, wherein the photodiode of the optical subassembly is located between the first shield section and the second shield section, the second shield section including;

a second base;

a second pair of arms located on the second base, the second pair of arms being configured to be at least partially positioned on the opposite sides of the optical subassembly;

a second pair of flanges located on the second base, the second pair of flanges configured to be at least partially positioned on the front and the back of the optical subassembly; and

a second plurality of fingers located on the second pair of arms, the second plurality of fingers being positioned over the second pair of flanges,

wherein the first shield section and the second shield section are together configured to form a press fit.

12. The EMI shield of claim 11, wherein the optical subassembly includes a transmitter optical subassembly (TOSA) including a laser configured to generate an optical signal and wherein the photodiode is configured to monitor the optical signal.

13. The EMI shield of claim 11, wherein the first shield section and the second shield section comprise a conductive material.

14. The EMI shield of claim 11, wherein the first shield section includes a first stamping of pressformed sheet metal and the second shield section includes a second stamping of pressformed sheet metal.