Stacking and bonding methods for forming multi-layer, three-dimensional, millimeter scale and microscale structures

• US 9,919,472 B1
• Filed: 05/16/2014
• Issued: 03/20/2018
• Est. Priority Date: 05/07/2002
• Status: Active Grant

• Current Assignee: Microfabrica Incorporated (Technoprobe S.P.A.)
• Original Assignee: Microfabrica Incorporated (Technoprobe S.P.A.)
• Inventors: Cohen, Adam L., Lockard, Michael S., Larsen, III, Rulon J., Frodis, Uri, Kim, Kieun, Smalley, Dennis R.
• Primary Examiner(s): Stoner, Kiley
• Application Number:
  US14/280,517
• Time in Patent Office: 1,404 Days
• CPC Class Codes: B23K 20/00 Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
• CPC Class Codes: B23K 20/10 making use of vibrations, e.g. ultrasonic welding
• CPC Class Codes: B23K 2101/40 Semiconductor devices
• CPC Class Codes: B23K 2103/04 Steel or steel alloys
• CPC Class Codes: B23K 2103/14 Titanium or alloys thereof
• CPC Class Codes: B23K 2103/26 Alloys of Nickel and Cobalt and Chromium
• CPC Class Codes: B23K 2103/50 Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
• CPC Class Codes: B23K 26/0624 using ultrashort pulses, i.e. pulses of 1ns or less
• CPC Class Codes: B23K 26/18 using absorbing layers on the workpiece, e.g. for marking or protecting purposes
• CPC Class Codes: B23K 26/38 by boring or cutting
• CPC Class Codes: B23K 26/40 taking account of the properties of the material involved
• CPC Class Codes: G01R 1/06738 related to tip portion
• CPC Class Codes: G01R 1/06744 Microprobes, i.e. having dimensions as IC details
• CPC Class Codes: G01R 3/00 Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments , e.g. of probe tips

Abstract

Embodiments are directed to methods of producing devices using modified multi-layer, multi-material electrochemical fabrication processes and/or using a laser cutting processes wherein individual layers or layer groups are formed and then stacked and bonded to produce prototypes or production parts. The methods can reduce the cost and lead time of prototyping when compared with previous multi-layer, multi-material electrochemical fabrication processes and can also reduce the lead time of production quantities, by allowing multiple layers of a multilayer device to be formed simultaneously, e.g. in parallel on the same wafer. Additionally, these methods may be used to extend the maximum height to which parts may practically be made. Finally, the methods allow geometries that are impossible, impractical or difficult to release (e.g. microfluidic devices such as pumps or parts with long, narrow channels) to be fabricated in multiple pieces and then joined after full or partial release.

Claims

1. A method for forming at least a portion of a multi-layer three-dimensional part having a desired configuration, comprising:

a. forming at least first and second portions of a structure where each is formed from at least one multi-material layer comprising at least one structural material and at least one sacrificial material, where the first portion has a first surface and the second portion has a second surface where the first and second surfaces are separated from one another during formation of the layers but which are to be located in contact, or in proximity, to one another in the desired configuration;

b. separating the at least first and second portions of the structure from any sacrificial material that would hinder the bringing of the at least first and second portions into contact, or into proximity, or which would be effectively trapped if in place when the at least first and second portions are brought together; and

c. moving at least one of the at least first and second portions relative to the other to bring the at least first and second surfaces into contact or into proximity to a multi-portion stack of layers of the multi-layer three-dimensional part,

wherein the forming comprises depositing at least one of the at least one structural material or the at least one sacrificial material selectively onto a substrate or previously deposited material via one or more openings in a masking material that is adhered to the substrate or previously deposited material, and

wherein after bringing at least two of the least first and second portions into contact or into proximity, bonding at least the first and second portions together by using

an adhesion material on at least one of the first and second surfaces and then pressing and heating the surfaces to cause bonding, and

forming holes in one or more portions and depositing material into the holes to cause bonding of the portions.

2. The method of claim 1 wherein the at least first and second portions comprise at least first, second, and third portions.

3. The method of claim 2 wherein the first and second portions are stacked and bonded prior to adding the third portion to the stack and bonding.

4. The method of claim 2 wherein the first, second, and third portions are stacked prior to bonding any of them and thereafter bonding of the first to the second and the second to the third occurs.

5. The method of claim 1 wherein the first and second portions are formed on the same substrate in the same fabrication process.

6. The method of claim 1 wherein the first and second portions are formed on different substrates.

7. The method of claim 1 wherein the at least one structural material or the at least one sacrificial material forming a multi-material layer of the first or second portion is formed by electrodeposition.

8. The method of claim 7 wherein the electrodeposition comprises a selective electrodeposition into at least one opening in a dielectric masking material.

9. The method of claim 1 wherein the at least one structural material on the first or second portion is formed from a sheet material.

10. The method of claim 9 wherein the at least one structural material that is formed from a sheet of material is patterned by laser cutting.

11. The method of claim 1 wherein formation of a multi-material layer results in formation of at least parts of multiple portions of the three-dimensional structure.

12. The method of claim 1 wherein alignment of stacked layers comprises use of at least one alignment pin.

13. The method of claim 12 wherein the at least one alignment pin comprises a plurality of alignment pins.

14. The method of claim 12 wherein an insertion location for the at least one alignment pin includes an opening in at least one structural region of at least two portions of a part being formed.

15. The method of claim 14 wherein the insertion is temporary and the pin is removed prior to putting the part into service.

16. The method of claim 14 wherein the insertion is permanent and the pin remains with the part as the part is put into service.

17. The method of claim 1 wherein alignment of stacked layers comprises use of at least one edge surface of a die or die group.

18. The method of claim 17 wherein the edge surface comprises at least two edge surfaces.

19. A method for forming at least a portion of a three-dimensional structure having a desired configuration, comprising:

a. forming at least first and second portions of a structure from a plurality of adhered layers of at least one structural material where the first portion has a first surface and the second portion has a second surface where the first and second surfaces are separated from one another during formation of the layers but which are to be located in contact or in proximity to one another in the desired configuration; and

b. moving at least one of the first and second portions relative to the other to bring the first and second surfaces into contact or into proximity,

i. wherein the forming comprises depositing at least one material selectively onto a substrate or previously deposited material via one or more openings in a masking material that is adhered to the substrate or previously deposited material, and

ii. wherein the forming comprises forming one or more alignment structures which aid in locating the first and second surfaces in proximity or in contact and/or which aid in guiding the first and second surfaces in proximity or in contact,

wherein after bringing the at first and second surfaces into contact or into proximity, bonding at least the first and second portions together by using an adhesion material on at least one of the first and second surfaces and then pressing and heating the surfaces to cause bonding, and forming holes in one or more portions and depositing material into the holes to cause bonding of the portions.

20. A method for forming at least a portion of a three-dimensional structure having a desired configuration, comprising:

a. forming at least first, second, and third portions of a structure from a plurality of adhered layers of at least one structural material where the first portion has a first surface and the second portion has a second surface and the third portion has a third surface, where the first and second surfaces are separated from one another during formation of the layers but which are to be located in contact or in proximity to one another in the desired configuration, and wherein the third surface is separated from the first and second portions during formation but is to be located in contact or in proximity to a surface of one of the first or second portions in the desired configuration; and

b. moving at least one of the first and second portions relative to the other to bring the first and second surfaces into contact or into proximity,

c. moving at least one of the third or contacting or proximate first and second portions relative to one another to bring the first, second, and third and portions into contact or into proximity,

wherein after bringing the at first and second surfaces into contact or into proximity, bonding at least the first and second portions together by using an adhesion material on at least one of the first and second surfaces and then pressing and heating the surfaces to cause bonding, and forming holes in one or more portions and depositing material into the holes to cause bonding of the portions.