Method and system for MEMS devices with dual damascene formed electrodes
First Claim
1. A manufacturing method, the method comprising:
- forming first and second dielectric layers on a semiconductor substrate, said semiconductor substrate comprising a conductive layer at least partially covered by the first dielectric layer;
removing a defined portion of the second dielectric layer;
forming vias through the second dielectric layer, said via extending to the conductive layer, wherein the vias provide electrical interconnections through the second dielectric layer between devices in the semiconductor substrate and the conductive layer;
forming electrodes by filling the vias, and the defined portion of the second dielectric layer, with a first metal; and
coupling a micro-electro-mechanical systems (MEMS) substrate to the semiconductor substrate;
forming a metal pad on the at least one electrode by depositing a second metal on the at least one electrode and removing portions of the second metal, wherein a first gap between the semiconductor substrate and the MEMS substrate is between a first electrode that does not have the metal pad and a standoff formed in the MEMS substrate.
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Accused Products
Abstract
Methods and systems for MEMS devices with dual damascene formed electrodes is disclosed and may include forming first and second dielectric layers on a semiconductor substrate that includes a conductive layer at least partially covered by the first dielectric layer; removing a portion of the second dielectric layer; forming vias through the second dielectric layer and at least a portion of the second dielectric layer, where the via extends to the conductive layer; forming electrodes by filling the vias and a volume that is the removed portion of the second dielectric layer with a first metal; and coupling a micro-electro-mechanical systems (MEMS) substrate to the semiconductor substrate. A third dielectric layer may be formed between the first and second dielectric layers. A metal pad may be formed on at least one electrode by depositing a second metal on the electrode and removing portions of the second metal, which may be aluminum.
5 Citations
14 Claims
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1. A manufacturing method, the method comprising:
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forming first and second dielectric layers on a semiconductor substrate, said semiconductor substrate comprising a conductive layer at least partially covered by the first dielectric layer; removing a defined portion of the second dielectric layer; forming vias through the second dielectric layer, said via extending to the conductive layer, wherein the vias provide electrical interconnections through the second dielectric layer between devices in the semiconductor substrate and the conductive layer; forming electrodes by filling the vias, and the defined portion of the second dielectric layer, with a first metal; and coupling a micro-electro-mechanical systems (MEMS) substrate to the semiconductor substrate; forming a metal pad on the at least one electrode by depositing a second metal on the at least one electrode and removing portions of the second metal, wherein a first gap between the semiconductor substrate and the MEMS substrate is between a first electrode that does not have the metal pad and a standoff formed in the MEMS substrate. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14)
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Specification