Semiconductor device for transmitting electrical signals between two circuits
First Claim
Patent Images
1. A semiconductor device, comprising:
- a substrate provided with a circuit region including at least one transistor;
a multi-level interconnect structure provided over the substrate, the multi-level interconnect structure formed by alternately stacking insulation layers and interconnect layers, all circuits formed by the multi-level interconnect structure occupying an area over the substrate when seen in a planar view; and
a first inductor provided at a periphery of a first layer of the multi-level interconnect structure so as to enclose an entirety of the circuit region in the planar view.
3 Assignments
0 Petitions
Accused Products
Abstract
A semiconductor device sends and receives electrical signals. The semiconductor device includes a first substrate provided with a first circuit region containing a first circuit; a multi-level interconnect structure provided on the first substrate; a first inductor provided in the multi-level interconnect structure so as to include the first circuit region; and a second inductor provided in the multi-level interconnect structure so as to include the first circuit region, wherein one of the first inductor and the second inductor is connected to the first circuit and the other of the first inductor and the second inductor is connected to a second circuit.
-
Citations
15 Claims
-
1. A semiconductor device, comprising:
- a substrate provided with a circuit region including at least one transistor;
a multi-level interconnect structure provided over the substrate, the multi-level interconnect structure formed by alternately stacking insulation layers and interconnect layers, all circuits formed by the multi-level interconnect structure occupying an area over the substrate when seen in a planar view; and
a first inductor provided at a periphery of a first layer of the multi-level interconnect structure so as to enclose an entirety of the circuit region in the planar view. - View Dependent Claims (5, 6, 7, 8, 15)
- a substrate provided with a circuit region including at least one transistor;
-
2. A semiconductor device, comprising:
-
a substrate provided with a circuit region; a multi-level interconnect structure provided over the substrate, the multi-level interconnect structure formed by alternately stacking insulation layers and interconnect layers, all circuits formed by the multi-level interconnect structure occupying an area over the substrate when seen in a planar view; a first inductor provided at a periphery of a first layer of the multi-level interconnect structure so as to enclose an entirety of the circuit region in the planar view; a plurality of external connection terminals; and a second inductor in a second layer of the multi-level interconnect structure different from the first layer occupied by the first inductor, the second inductor provided at a periphery of the second layer and overlapping the first inductor in the first layer, wherein all of said external connection terminals are located within a region enclosed by the second inductor. - View Dependent Claims (3, 4)
-
-
9. A semiconductor device, comprising:
-
a substrate provided with a circuit region; a multi-level interconnect structure provided over the substrate, the multi-level interconnect structure formed by alternately stacking insulation layers and interconnect layers, all circuits formed by the multi-level interconnect structure occupying an area over the substrate when seen in a planar view; a first inductor provided at a periphery of a first layer of the multi-level interconnect structure so as to enclose an entirety of the circuit region in the planar view; a second inductor located within a second layer of the multi-level interconnect structure above the first layer of the first inductor, and extending along a perimeter of the multi-level interconnect structure in the planar view such that the second inductor overlaps the first inductor. - View Dependent Claims (10, 11, 12, 13, 14)
-
Specification