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Processing of a direct-bandgap chip after bonding to a silicon photonic device

  • US 9,923,105 B2
  • Filed: 10/08/2014
  • Issued: 03/20/2018
  • Est. Priority Date: 10/09/2013
  • Status: Active Grant
First Claim
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1. A method for fabricating a composite device for splitting functionality across two or more materials, the method comprising:

  • providing a composite device, the composite device comprising;

    a platform, wherein;

    the platform comprises a wall forming a part of a recess; and

    the platform comprises a first material;

    a chip, wherein;

    the chip is bonded in the recess of the platform; and

    the chip comprises a second material; and

    a material between the wall and the chip forming an optical bridge;

    masking the composite device to define an area on the chip to etch;

    etching the chip to form a waveguide on the chip, after the chip is bonded to the platform; and

    etching the material between the wall and the chip concurrently with etching the chip to form a waveguide on the optical bridge, which is aligned with the waveguide on the chip to guide light from the chip to the platform.

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