Method for producing an LED module and LED module

• US 9,923,129 B2
• Filed: 08/07/2013
• Issued: 03/20/2018
• Est. Priority Date: 08/31/2012
• Status: Active Grant

• Current Assignee: Optotronic GmbH (Inventronics (Hangzhou), Inc.)
• Original Assignee: OSRAM GmbH (Ams-Osram AG)
• Inventors: Reiss, Martin, Schwalenberg, Simon
• Primary Examiner(s): HO, HOANG QUAN TRAN
• Application Number:
  US14/421,153
• Publication Number:
  US 20160380166A1
• Time in Patent Office: 1,686 Days
• Field of Search: None
• CPC Class Codes: H01L 25/0753 the devices being arranged next to each other
• CPC Class Codes: H01L 25/50 Multistep manufacturing processes of assemblies consisting of devices, each device being of a type provided for in group H01L27/00 or H01L29/00 H01L21/50 takes precedence
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 2933/005 relating to encapsulations
• CPC Class Codes: H01L 2933/0058 relating to optical field-shaping elements
• CPC Class Codes: H01L 2933/0066 relating to arrangements for conducting electric current to or from the semiconductor body
• CPC Class Codes: H01L 2933/0091 Scattering means in or on the semiconductor body or semiconductor body package H01L33/22 takes precedence
• CPC Class Codes: H01L 33/486 adapted for surface mounting
• CPC Class Codes: H01L 33/54 having a particular shape
• CPC Class Codes: H01L 33/56 Materials, e.g. epoxy or silicone resin
• CPC Class Codes: H01L 33/58 Optical field-shaping elements
• CPC Class Codes: H01L 33/62 Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls

Abstract

Various embodiments may relate to a method for producing an LED module, including providing a housing implemented as a hollow body, having an opening on a light exit side of the LED module, wherein the housing has a base side, arranged opposite to the light exit side, arranging a circuit board having one LED on the base side of the housing, pouring in one first base layer made of a curable material in a non-cured state through the opening into the housing, and pouring in a scattering layer made of a curable material in a non-cured state through the opening into the housing. The scattering layer is poured in onto the first base layer. The first base layer is not cured during the pouring in of the scattering layer, and after the pouring in of the scattering layer, the one first base layer and the scattering layer are cured.

Claims

1. A method for producing an LED module comprising:

providing a housing, which is implemented as a hollow body, which has an opening on a light exit side of the LED module, wherein the housing has a base side, which is arranged opposite to the light exit side;

arranging a circuit board having at least one LED on the base side of the housing;

pouring a second base layer made of a curable material in a non-cured state into the housing;

curing the second base layer;

then, thereafter,

pouring in at least one first base layer made of a curable material in a non-cured state through the opening into the housing onto the cured second base layer;

and

pouring in a scattering layer made of a curable material in a non-cured state through the opening into the housing;

wherein the scattering layer is poured in onto the first base layer, wherein the first base layer is not cured during the pouring in of the scattering layer, and after the pouring in of the scattering layer, the at least one first base layer and the scattering layer are cured.

2. The method as claimed in claim 1,

wherein during the pouring in of the first base layer, a sufficient amount of curable material is poured in that a surface of the poured-in base layer assumes a curvature pre-definable by a filling quantity.

3. The method as claimed in claim 1,

wherein, during the providing of the housing, a notch, which extends at a distance to the base side of the housing, is at least regionally introduced in a delimitation side of the housing, which is arranged on the base side and extends from the base side up to the light exit side of the LED module, wherein the base side and the delimitation side define the hollow body having the opening.

4. The method as claimed in claim 1,

wherein a material is used for the scattering layer, which comprises a base material having scattering particles, wherein the base material has the same properties as those of the first base layer, so that a phase boundary does not form during the curing of the first base layer and the scattering layer.

5. The method as claimed in claim 1,

wherein the LED has a light exit side, which defines an upper edge of the LED, and the at least one first base layer is poured in such that a surface of the first base layer opposite to the base side of the housing after the pouring in has a distance to the light exit side of the LED module which is less than a distance of the upper edge of the LED from the light exit side of the LED module.

6. The method as claimed in claim 5,

wherein the second base layer is poured in at most up to the upper edge of the LED.

7. The method as claimed in claim 1, wherein the second base layer contains a white pigmentation wherein the white pigmentation reflects back-reflected light.

8. The method as claimed in claim 1, further comprising fixing the at least one LED arranged on the circuit board by an adhesive onto the base side of the housing.

9. The method as claimed in claim 8, wherein the adhesive is dispensed in a defined layer thickness into the housing.

10. The method as claimed in claim 1, further comprising linearly arranging a plurality of LEDs on the circuit board.

11. The method of claim 1, further comprising forming the second base layer from a transparent matrix material.

12. The method of claim 8, further comprising curing the adhesive such that no bubbles are formed in the adhesive.

13. The method of claim 1, further comprising pouring the second base layer up to, at most, an upper edge of the LED.

14. The method of claim 11, further comprising including a reflective pigmentation in the second base layer.

15. The method of claim 1, further comprising arranging the second base layer, the first base layer and the scattering layer such that the LED is enclosed, and contacting a delimitation side of the housing, which is arranged on the base side and extends from the base side up to the light exit side of the LED module, wherein the base side and the delimitation side define the hollow body having an opening.

16. The method of claim 2, further comprising pouring the first base layer up to an upper edge of the housing such that an outwardly bulging, convex shape of the surface of the poured-in base layer is formed.

17. The method of claim 1, wherein the second base layer reflects a back-reflected light.

18. The method of claim 2, wherein the sufficient amount of curable material is poured such that the thickness of the scattering layer having a smaller distance to a delimitation side of the housing is less than the thickness of the scattering layer having a greater distance to the delimitation side of the housing, wherein the delimitation side of the housing is arranged on the base side and extends from the base side up to the light exit side of the LED module.

19. The method of claim 1, further comprising arranging the first base layer and the scattering layer such that they share a virtual intermediate surface.