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Electrical component having presoldered surface with flux reservoirs

  • US 9,925,611 B2
  • Filed: 07/24/2014
  • Issued: 03/27/2018
  • Est. Priority Date: 07/31/2013
  • Status: Active Grant
First Claim
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1. An electrical component comprising:

  • a terminal pad having a terminal pad surface;

    a layer of lead free solder consisting of 66% to 90% indium, 4% to 25% tin, 0.5% to 9% silver, 0.1% to 8% antimony, 0.03% to 4% copper, 0.03% to 4% nickel, and 0.2% to 6% zinc by weight on the terminal pad surface, the layer of solder having a solder surface opposite the terminal pad surface with flux wells formed in the solder surface configured to protectively store and retain flux therein, the flux wells having a lateral dimension of at least 0.05 mm and a depth of at least 0.023 mm; and

    a layer of flux on at least a portion of the solder surface and filling at least a portion of the flux reservoirs.

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