Method of manufacturing high permittivity low leakage capacitor and energy storing device

• US 9,928,958 B2
• Filed: 03/25/2015
• Issued: 03/27/2018
• Est. Priority Date: 10/05/2007
• Status: Active Grant

• Current Assignee: Carver Scientific Inc.
• Original Assignee: Carver Scientific Inc.
• Inventors: Carver, David Reginald
• Primary Examiner(s): McNally, Daniel
• Application Number:
  US14/668,768
• Publication Number:
  US 20150206659A1
• Time in Patent Office: 1,098 Days
• CPC Class Codes: H01G 13/00 Apparatus specially adapted for manufacturing capacitors; Processes specially adapted for manufacturing capacitors not provided for in groups H01G4/00 - H01G11/00
• CPC Class Codes: H01G 4/018 Dielectrics
• CPC Class Codes: H01G 4/04 Liquid dielectrics
• CPC Class Codes: H01G 4/206 inorganic and synthetic material
• CPC Class Codes: H02J 7/345 using capacitors as storage or buffering devices

Abstract

A method is provided for making a high permittivity dielectric material for use in capacitors. Several high permittivity materials in an organic nonconductive media with enhanced properties and methods for making the same are disclosed. A general method for the formation of thin films of some particular dielectric material is disclosed, wherein organic polymers are utilized to produce low conductivity dielectric coatings. Additionally, a method whereby the formation of certain transition metal salts as salt or oxide matrices is demonstrated at low temperatures utilizing mild reducing agents. Further, a circuit structure and associated method of operation for the recovery and regeneration of the leakage current from the long-term storage capacitors is provided in order to enhance the manufacturing yield and utility performance of such devices.

Claims

1. A method, comprising:

providing a first solution comprising a polymer;

combining the first solution with an organic material, wherein the organic material itself exhibits a permittivity upon exposure to a permittivity enhancing field that is enhanced by about 5% or more relative to the permittivity of the organic material not exposed to the permittivity enhancing field;

mixing the first solution with the organic material to create a second solution or slurry; and

spreading the second solution or slurry onto the first substrate thereby forming a film of a dielectric material on the first substrate.

2. The method of claim 1, further comprising:

enhancing permittivity of the organic material by applying a permittivity enhancing field across the first substrate and the second solution or slurry, the permittivity enhancing field comprising

an electric field generated by a voltage source, or

a magnetic field provided by placing the first substrate and the second solution or

slurry between magnetic north and south poles of a magnetic source.

3. The method of claim 2, wherein the permittivity enhancing field is an electric field having a strength greater than 100 V/cm.

4. The method of claim 2, wherein the permittivity enhancing field is a magnetic field having a strength greater than 1 Gauss.

5. The method of claim 1, further comprising adding a reducing agent to the first solution.

6. The method of claim 5, wherein the reducing agent comprises sodium borohydride.

7. The method of claim 1, wherein the polymer comprises poly-p-xylylene, or shellac, or zein, or silicone oil, or any combination thereof.

8. The method of claim 1, further comprising adding an iron salt to the first solution.

9. The method of claim 1, wherein the first solution comprises particulate matter impurities and the method further comprising removing the particulate matter impurities from the first solution.

10. The method of claim 1, wherein the organic material is a protein.

11. A method, comprising:

providing a first solution comprising a polymer selected from shellac, or silicone oil, or poly-p-xylylene, or any combination thereof;

combining the first solution with a protein;

mixing the first solution with the protein to create a second solution or slurry; and

spreading the second solution or slurry onto the first substrate thereby forming a dielectric film on the first substrate.

12. The method of claim 11, further comprising enhancing permittivity of the second solution or slurry by applying a permittivity enhancing field across the first substrate and the second solution or slurry.

13. The method of claim 12, wherein the permittivity enhancing field comprises an electric field generated by a voltage source.

14. The method of claim 12, wherein the permittivity enhancing field comprises a magnetic field provided by placing the first substrate and the second solution or slurry between magnetic north and south poles of a magnetic source.