Methods and devices for securing and transporting singulated die in high volume manufacturing

• US 9,929,031 B2
• Filed: 10/17/2016
• Issued: 03/27/2018
• Est. Priority Date: 12/28/2013
• Status: Active Grant

• Current Assignee: Intel Corporation
• Original Assignee: Intel Corporation
• Inventors: Johnson, John C., Moret, Eric J., Palanuk, Lawrence M., Stone, Gregory A.
• Primary Examiner(s): DIALLO, MAMADOU L
• Application Number:
  US15/295,943
• Publication Number:
  US 20170032991A1
• Time in Patent Office: 526 Days
• CPC Class Codes: H01L 21/67265 of substrates stored in a container, a magazine, a carrier, a boat or the like
• CPC Class Codes: H01L 21/67309 characterized by the substrate support
• CPC Class Codes: H01L 21/67333 Trays for chips magazine for components H05K13/0084
• CPC Class Codes: H01L 21/67356 specially adapted for containing chips, dies or ICs
• CPC Class Codes: H01L 21/67363 specially adapted for containing substrates other than wafers H01L21/67356, H01L21/67359 take precedence
• CPC Class Codes: H01L 21/67383 characterised by substrate supports
• CPC Class Codes: H01L 21/67769 Storage means
• CPC Class Codes: H01L 21/67772 involving removal of lid, door, cover
• CPC Class Codes: H01L 21/67778 involving loading and unloading of wafers
• CPC Class Codes: H01L 21/68 for positioning, orientation or alignment
• CPC Class Codes: H01L 21/6833 Details of electrostatic chucks
• CPC Class Codes: H01L 21/68764 characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel
• CPC Class Codes: H01L 21/68771 characterised by supporting more than one semiconductor substrate
• CPC Class Codes: H01L 21/78 with subsequent division of the substrate into plural individual devices cutting to change the surface-physical characteristics or shape of semiconductor bodies H01L21/304
• CPC Class Codes: H05K 13/0084 Containers and magazines for components, e.g. tube-like magazines

Abstract

A method includes identifying a wafer position for a plurality of die on a wafer, storing the wafer position for each of the plurality of die in a database, dicing the wafer into a plurality of singulated die, positioning each of the singulated die in a die position location on a tray, and storing the die position on the tray for each of the singulated die in the database. The database includes information including the wafer position associated with each die position. The tray is transported to a processing tool, and at least one of the plurality of singulated die is removed from the die position on the tray and processed in the processing tool. The processed singulated die is replaced in the same defined location on the tray that the singulated die was positioned in prior to the processing. Other embodiments are described and claimed.

Claims

1. An assembly configured to hold a plurality of singulated die, comprising:

a tray configured to support a plurality of singulated die, the tray including a raised step at an outer region thereof; and

a lid adapted to cover the singulated die on the tray, wherein an outer edge of the lid engages an inner edge of the step.

2. The assembly of claim 1, wherein the tray includes a plurality of pockets defined on an upper surface thereof, wherein the pockets are each sized accept a single die therein.

3. The assembly of claim 2, wherein the lid includes a plurality of pedestal structures protruding in a downward direction on a lower surface of the lid, wherein the pedestal structures are sized to extend a distance into the pockets when the lid is positioned on the tray.

4. The assembly of claim 1, the tray including an identifying feature thereon to distinguish the tray from another tray.

5. The assembly of claim 4, the identifying feature is selected from the group consisting of a two dimensional physical mark and an RFID tag.

6. The assembly of claim 1, the lid including an upper surface, the upper surface including a structure extending outward therefrom, the structure adapted to engage an external surface and transmit a force to hold the lid on the tray.

7. The assembly of claim 6, wherein the structure is selected from the group consisting of a dome structure and a spring structure.

8. The assembly of claim 1, further comprising an adhesive layer on the tray.

9. The assembly of claim 1, the lid including an inner surface, further comprising a structure extending from the inner surface towards the tray when the lid is positioned on the tray.

10. An assembly comprising:

a tray configured to support a plurality of singulated die;

an adhesive layer on the tray; and

a lid configured to cover any singulated die on the tray.

11. The assembly of claim 10, further comprising an identifying feature on the tray to distinguish the tray from another tray.

12. The assembly of claim 11, wherein the identifying feature is selected from the group consisting of a two dimensional physical mark and an RFID tag.

13. The assembly of claim 10, the lid including a structure extending outward therefrom, the structure adapted to engage an external surface and transmit a force to hold the lid on the tray.

14. The assembly of claim 13, the structure selected from the group consisting of a dome structure and a spring structure.

15. The assembly of claim 10, wherein the adhesive layer comprises a tape.

16. The assembly of claim 10, the lid including an interior surface from which a plurality of structures extend towards the tray.

17. An assembly comprising:

a tray configured to support a plurality of singulated die;

a plurality of pockets on the tray, each pocket configured to accept a die therein;

a lid configured to cover any singulated die in the pockets on the tray; and

an identifying feature on the tray to distinguish the tray from another tray.

18. The assembly of claim 17, wherein the lid includes a lower surface including a plurality of structures extending therefrom.

19. The assembly of claim 17, wherein the lid includes a plurality of pedestal structures protruding in a downward direction on a lower surface of the lid, wherein the pedestal structures are sized to extend a distance into the pockets when the lid is positioned on the tray.

20. An assembly comprising:

a tray configured to support a plurality of singulated die;

a plurality of pockets on the tray, each pocket configured to accept a die therein; and

a lid configured to cover any singulated die in the pockets on the tray, the lid including a structure extending outward therefrom, the structure adapted to engage an external surface and transmit a force to hold the lid on the tray.

21. An assembly for use in a carrier, comprising:

a tray configured to support a plurality of singulated die thereon;

the tray including an adhesive layer thereon;

the tray including a surface configured to engage rails in a carrier

an identifying feature on the tray to distinguish the tray from another tray; and

a lid configured to cover the tray.

22. The assembly of claim 21, the lid including a structure extending outward therefrom, the structure adapted to engage an external surface and transmit a force to hold the lid on the tray.