Isolation rings for packages and the method of forming the same

• US 9,929,070 B2
• Filed: 12/22/2016
• Issued: 03/27/2018
• Est. Priority Date: 05/31/2012
• Status: Active Grant

• Current Assignee: Taiwan Semiconductor Manufacturing Company Limited
• Original Assignee: Taiwan Semiconductor Manufacturing Company Limited
• Inventors: Chang, Chih-Horng, Kuo, Tin-Hao, Tsai, Tsung-Fu, Ku, Min-Feng
• Primary Examiner(s): Sandvik, Benjamin
• Assistant Examiner(s): RAMALLO, GUSTAVO G
• Application Number:
  US15/388,572
• Publication Number:
  US 20170103933A1
• Time in Patent Office: 460 Days
• CPC Class Codes: H01L 21/304 Mechanical treatment, e.g. grinding, polishing, cutting H01L21/30625 takes precedence
• CPC Class Codes: H01L 21/56 Encapsulations, e.g. encapsulation layers, coatings
• CPC Class Codes: H01L 21/561 Batch processing
• CPC Class Codes: H01L 21/565 Moulds
• CPC Class Codes: H01L 21/78 with subsequent division of the substrate into plural individual devices cutting to change the surface-physical characteristics or shape of semiconductor bodies H01L21/304
• CPC Class Codes: H01L 21/82 to produce devices, e.g. integrated circuits, each consisting of a plurality of components
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 23/293 Organic, e.g. plastic
• CPC Class Codes: H01L 23/3121 a substrate forming part of the encapsulation
• CPC Class Codes: H01L 23/3135 Double encapsulation or coating and encapsulation
• CPC Class Codes: H01L 23/49822 Multilayer substrates multilayer metallisation on monolayer substrate H01L23/498
• CPC Class Codes: H01L 23/49827 Via connections through the substrates, e.g. pins going through the substrate, coaxial cables H01L23/49822, H01L23/49833, H01L23/4985, H01L23/49861 take precedence
• CPC Class Codes: H01L 23/49838 Geometry or layout
• CPC Class Codes: H01L 23/564 Details not otherwise provided for, e.g. protection against moisture getters H01L23/26
• CPC Class Codes: H01L 24/97 the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 25/0657 Stacked arrangements of devices
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/12042 LASER
• CPC Class Codes: H01L 2924/181 Encapsulation
• CPC Class Codes: H01L 2924/1815 Shape

Abstract

A device includes a first package component, and a second package component underlying, and bonded to, the first package component. A molding material is disposed under the first package component and molded to the first and the second package components, wherein the molding material and the first package component form an interface. An isolation region includes a first edge, wherein the first edge of the isolation region contacts a first edge of the first package component and a first edge of the molding material. The isolation has a bottom lower than the interface.

Claims

1. A package comprising:

a first package component;

a second package component underlying, and bonded to, the first package component;

an encapsulating material encapsulating the second package component, wherein the encapsulating material and the first package component form an interface; and

an isolation region comprising;

a first edge, wherein the first edge of the isolation region contacts an edge of the first package component and an edge of the encapsulating material; and

a second edge opposite to the first edge of the isolation region, and the second edge of the isolation region is a part of an outer edge of the package.

2. The package of claim 1, wherein the isolation region comprises a top portion, and a middle portion underlying the top portion, wherein the top portion extends laterally farther toward a center of the package than the middle portion.

3. The package of claim 2, wherein the top portion is higher than the interface, and the middle portion comprises a portion at a same level as a portion of the first package component, and a portion at a same level as a portion of the encapsulating material.

4. The package of claim 2, wherein the isolation region further comprises a bottom portion underlying and connected to the middle portion, and the bottom portion extends farther toward the center of the package than the middle portion.

5. The package of claim 1, wherein the isolation region forms a ring encircling the first package component.

6. The package of claim 1, wherein the isolation region comprises four inner edges contacting four edges of the first package component.

7. The package of claim 1, wherein the first package component comprises a laminate substrate, and wherein the encapsulating material comprises a molding compound.

8. The package of claim 1, wherein the isolation region has a density higher than a density of the encapsulating material.

9. The package of claim 1, wherein the isolation region extends lower than a bottom surface of the second package component.

10. A package comprising:

a package substrate;

a device die underlying, and bonded to, the package substrate;

an encapsulating material under the package substrate and encapsulating the device die; and

a polymer-comprising material encircling, and contacting edges of, the package substrate, wherein the polymer-comprising material comprises a top portion and a lower portion lower than the top portion, with each of the top portion and lower portion extending from edges of the package toward a center of the package, and the top portion extends more toward the center than the lower portion.

11. The package of claim 10, wherein the polymer-comprising material further comprises a bottom portion underlying and connected to the lower portion, and the bottom portion further extends further toward the center than the lower portion.

12. The package of claim 11, wherein the top portion has a bottom surface higher than a top surface of the encapsulating material, and the bottom portion has a top surface lower than the top surface of the encapsulating material.

13. The package of claim 10, wherein the polymer-comprising material has a density greater than a density of the encapsulating material.

14. The package of claim 10, wherein the polymer-comprising material is configured to be dispensed in a form of liquid, and is configured to be cured to a solid form from the liquid.

15. The package of claim 10, wherein the polymer-comprising material comprises outer edges opposite to inner edges of the polymer-comprising material that contact the package substrate, and wherein the outer edges of the polymer-comprising material are aligned to edges of the encapsulating material.

16. A package comprising:

a package substrate;

a device die underlying and bonded to the package substrate;

an encapsulating material under the package substrate, wherein the encapsulating material is in contact with a bottom surface of the package substrate, and wherein the device die is encapsulated in the encapsulating material; and

a polymer ring encircling the package substrate and a top portion of the encapsulating material, wherein the package comprises an edge, with the edge of the package being vertical and straight, and the edge of the package comprises;

an outer edge of the polymer ring; and

an edge of the encapsulating material.

17. The package of claim 16, wherein the polymer ring comprises:

a wide portion; and

a narrow portion narrower than the wide portion, wherein the narrow portion is underlying, and connected to, the wide portion.

18. The package of claim 17, wherein each of the wide portion and the narrow portion forms a ring encircling a portion of the package substrate.

19. The package of claim 17, wherein the wide portion extends further toward a center of the package than the narrow portion.

20. The package of claim 16, wherein the polymer ring has a density higher than a density of the encapsulating material.