Wavelength conversion film and light emitting device package including the same

• US 9,929,320 B2
• Filed: 12/16/2015
• Issued: 03/27/2018
• Est. Priority Date: 12/18/2014
• Status: Active Grant

• Current Assignee: Samsung Electronics Co. Ltd.
• Original Assignee: Samsung Electronics Co. Ltd.
• Inventors: Lee, Joon Sub
• Primary Examiner(s): Malsawma, Lex
• Application Number:
  US14/971,551
• Publication Number:
  US 20160181485A1
• Time in Patent Office: 832 Days
• Field of Search: None
• CPC Class Codes: H01L 2224/16245 the item being metallic
• CPC Class Codes: H01L 2933/0091 Scattering means in or on the semiconductor body or semiconductor body package H01L33/22 takes precedence
• CPC Class Codes: H01L 33/486 adapted for surface mounting
• CPC Class Codes: H01L 33/505 characterised by the shape, e.g. plate or foil
• CPC Class Codes: H01L 33/507 the elements being in intimate contact with parts other than the semiconductor body or integrated with parts other than the semiconductor body
• CPC Class Codes: H01L 33/60 Reflective elements

Abstract

A wavelength conversion film is provided and may include a first layer including a wavelength conversion material and an encapsulant encapsulating the wavelength conversion material, and a second layer attached to the first layer and having a refractive index less than a refractive index of the encapsulant and greater than a refractive index of air.

Claims

1. A light emitting device package comprising:

a package body;

a light emitting device coupled to at least a first portion of the package body; and

a wavelength conversion film disposed on the light emitting device so that light emitted by the light emitting device passes through the wavelength conversion film,

wherein the wavelength conversion film comprises a wavelength conversion material that changes a wavelength of the light emitted by the light emitting device,

the wavelength conversion film includes a first layer disposed to be adjacent to the light emitting device and having a first refractive index, and a second layer attached to the first layer and having a second refractive index less than the first refractive index of the first layer and greater than a third refractive index of air, and

the package body includes a reflective wall attached to a side surface of the light emitting device.

2. The light emitting device package of claim 1, wherein a second thickness of the second layer is less than a first thickness of the first layer.

3. The light emitting device package of claim 1, wherein the wavelength conversion film includes an unevenness structure formed on at least a second portion of a surface of the second layer.

4. The light emitting device package of claim 3, wherein a height of the unevenness structure is less than a thickness of the second layer.

5. The light emitting device package of claim 3, wherein the unevenness structure comprises a plurality of unevenness structures that have at least one of a polypyramidal shape, a conical shape, and a hemispherical shape.

6. The light emitting device package of claim 1, wherein the first layer includes the wavelength conversion material, and an encapsulant encapsulating the wavelength conversion material and having the first refractive index.

7. The light emitting device package of claim 1, wherein at least a second portion of the first layer is attached to a first upper surface of the light emitting device and a second upper surface of the reflective wall.

8. The light emitting device package of claim 7, wherein the first upper surface of the light emitting device and the second upper surface of the reflective wall are coplanar.

9. The light emitting device package of claim 1, wherein the reflective wall has substantially the same width in a height direction of the reflective wall.