LED package having mushroom-shaped lens with volume diffuser

• US 9,929,326 B2
• Filed: 05/01/2015
• Issued: 03/27/2018
• Est. Priority Date: 10/29/2004
• Status: Active Grant

• Current Assignee: Ledengin, Inc. (Ams-Osram AG)
• Original Assignee: Ledengin, Inc. (Ams-Osram AG)
• Inventors: Yan, Xiantao
• Primary Examiner(s): Sun, Yu-Hsi D
• Application Number:
  US14/702,650
• Publication Number:
  US 20150236227A1
• Time in Patent Office: 1,061 Days
• Field of Search: 257 79- 84
• CPC Class Codes: H01L 2224/29101 the principal constituent melting at a temperature of less than 400°C
• CPC Class Codes: H01L 2224/2929 with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
• CPC Class Codes: H01L 2224/29393 with a principal constituent of the material being a solid not provided for in groups H01L2224/293 - H01L2224/29391, e.g. allotropes of carbon, fullerene, graphite, carbon-nanotubes, diamond
• CPC Class Codes: H01L 2224/32013 the layer connector being larger than the bonding area, e.g. bond pad
• CPC Class Codes: H01L 24/29 of an individual layer connector
• CPC Class Codes: H01L 24/83 using a layer connector
• CPC Class Codes: H01L 24/97 the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 25/0753 the devices being arranged next to each other
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/014 Solder alloys
• CPC Class Codes: H01L 2924/0665 Epoxy resin
• CPC Class Codes: H01L 2933/0058 relating to optical field-shaping elements
• CPC Class Codes: H01L 33/486 adapted for surface mounting
• CPC Class Codes: H01L 33/507 the elements being in intimate contact with parts other than the semiconductor body or integrated with parts other than the semiconductor body
• CPC Class Codes: H01L 33/54 having a particular shape
• CPC Class Codes: H01L 33/58 Optical field-shaping elements

Abstract

According to some embodiments of the invention, a light-emitting device package includes a body including top and bottom surfaces and a cavity in the body, the cavity extending from the top surface towards the bottom surface and having a floor. The light-emitting device package also includes a plurality of LED (light-emitting-diode) dies disposed on the floor of the cavity. A socket is formed over the plurality of LED dies. The socket includes a top surface, a socket sidewall, and a bottom surface, the socket sidewall disposed between the top surface and the bottom surface of the socket. A lens is disposed over the over the socket. The lens includes two or more optical materials with different indices of refraction. The lens includes a cap and a plug. The cap has an upper surface and a lower surface, and the plug has a lower surface and a plug sidewall between the lower surface of the plug and the lower surface of the cap.

Claims

1. A light-emitting device package comprising:

a body including top and bottom surfaces;

a cavity in the body, the cavity extending from the top surface towards the bottom surface and having a floor;

one or more LED (light-emitting-diode) dies disposed on the floor of the cavity;

an encapsulation layer disposed within the cavity over the one or more LED dies;

a socket formed over the encapsulation layer, the socket including a top surface, a socket sidewall, and a bottom surface, the socket sidewall disposed between the top surface and the bottom surface of the socket;

a lens disposed over the over the socket, the lens comprising two or more optical materials with different indices of refraction, the lens including a cap and a plug, the cap having an upper surface that has a spherical vertical cross-section and a lower surface, the plug having a planar bottom surface and a plug sidewall between the lower surface of the plug and the lower surface of the cap, the plug disposed within the socket, and the lower surface of the cap disposed adjacent the top surface of the socket; and

an adhesive layer disposed to attach the lower surface of the cap to the top surface of the socket, wherein a portion the adhesive layer is disposed between the encapsulation layer and the lower surface of the plug.

2. The light-emitting device package of claim 1, wherein the lens comprises at least one glass material.

3. The light-emitting device package of claim 1, wherein the lens comprises a mixture of two or more glass materials with different indices of refraction.

4. The light-emitting device package of claim 3, wherein the two or more glass materials are selected from glass materials having trade names Schott FK54, Schott FK3, Schott SF58, Schott, SF59, BK7, BK10, or BK6.

5. The light-emitting device package of claim 1, wherein the lens comprises a uniform mixture of two or more optical materials with different indices of refraction.

6. The light-emitting device package of claim 1, wherein a portion the adhesive layer is disposed between the lower surface of the cap and the top surface of the package.

7. The light-emitting device package of claim 1, wherein a portion of the adhesive layer is disposed between the sidewall of the cap and the sidewall of the socket.

8. The light-emitting device package of claim 1, wherein the lower surface of the cap is a flat surface, and the top surface of the package is a flat surface.

9. The light-emitting device package of claim 1, wherein a portion of the adhesive layer is disposed between the encapsulation layer and the lower surface of the plug.

10. The light-emitting device package of claim 1, wherein the encapsulation layer comprises a thermal insulation layer.

11. The light-emitting device package of claim 1, wherein the encapsulation layer comprises a luminescent layer.

12. The light-emitting device package of claim 1, wherein the package comprises a ceramic material.

13. A light-emitting device package comprising:

a body including top and bottom surfaces;

a cavity in the body, the cavity extending from the top surface towards the bottom surface and having a floor;

a plurality of LED (light-emitting-diode) dies disposed on the floor of the cavity;

a socket formed over the plurality of LED dies, the socket including a top surface, a socket sidewall, and a bottom surface, the socket sidewall disposed between the top surface and the bottom surface of the socket; and

a lens disposed over the over the socket, the lens comprising a mixture of a silicone material and TiO2 particles, the lens including a cap and a plug, the cap having an upper surface that has a spherical vertical cross-section and a lower surface, the plug having a planar bottom surface and a plug sidewall between the lower surface of the plug and the lower surface of the cap, the plug disposed within the socket, and the lower surface of the cap disposed adjacent the top surface of the socket.

14. The light-emitting device package of claim 13, wherein the lens comprises a uniform mixture of two or more optical materials with different indices of refraction.

15. The light-emitting device package of claim 13, further comprising an encapsulation layer disposed within the cavity over the plurality of LED dies.

16. The light-emitting device package of claim 15, further comprising an adhesive layer disposed to attach the lower surface of the cap to the top surface of the socket, wherein a portion the adhesive layer is disposed between the encapsulation layer and the lower surface of the plug.

17. The light-emitting device package of claim 13, wherein the shape of the lens comprises a mushroom shape.

18. The light-emitting device package of claim 13, wherein the plug sidewall is substantially perpendicular to the lower surface of the plug.

19. A light-emitting device package comprising:

a body including top and bottom surfaces;

a cavity in the body, the cavity extending from the top surface towards the bottom surface and having a floor;

a plurality of LED (light-emitting-diode) dies disposed on the floor of the cavity;

a socket formed over the plurality of LED dies, the socket including a top surface, a socket sidewall, and a bottom surface, the socket sidewall disposed between the top surface and the bottom surface of the socket; and

a glass lens disposed over the over the socket, the glass lens comprising a mixture of two or more glass materials with different indices of refraction, the lens including a cap and a plug, the cap having an upper surface that has a spherical vertical cross-section and a lower surface, the plug having a planar bottom surface and a plug sidewall between the lower surface of the plug and the lower surface of the cap, the plug disposed within the socket, and the lower surface of the cap disposed adjacent the top surface of the socket.