Electric circuit on flexible substrate

• US 9,930,793 B2
• Filed: 03/27/2014
• Issued: 03/27/2018
• Est. Priority Date: 03/27/2014
• Status: Active Grant

• Current Assignee: Intel Corporation
• Original Assignee: Intel Corporation
• Inventors: Hu, Chuan, Kumar, Siddarth
• Primary Examiner(s): Milakovich, Nathan
• Application Number:
  US14/227,779
• Publication Number:
  US 20150282341A1
• Time in Patent Office: 1,461 Days
• CPC Class Codes: H01L 21/56 Encapsulations, e.g. encapsulation layers, coatings
• CPC Class Codes: H01L 2224/05111 Tin [Sn] as principal constituent
• CPC Class Codes: H01L 2224/05113 Bismuth [Bi] as principal constituent
• CPC Class Codes: H01L 2224/05116 Lead [Pb] as principal constituent
• CPC Class Codes: H01L 2224/05118 Zinc [Zn] as principal constituent
• CPC Class Codes: H01L 2224/05124 Aluminium [Al] as principal constituent
• CPC Class Codes: H01L 2224/05139 Silver [Ag] as principal constituent
• CPC Class Codes: H01L 2224/05611 Tin [Sn] as principal constituent
• CPC Class Codes: H01L 2224/05613 Bismuth [Bi] as principal constituent
• CPC Class Codes: H01L 2224/05616 Lead [Pb] as principal constituent
• CPC Class Codes: H01L 2224/05618 Zinc [Zn] as principal constituent
• CPC Class Codes: H01L 2224/05624 Aluminium [Al] as principal constituent
• CPC Class Codes: H01L 2224/05639 Silver [Ag] as principal constituent
• CPC Class Codes: H01L 2224/05644 Gold [Au] as principal constituent
• CPC Class Codes: H01L 2224/05647 Copper [Cu] as principal constituent
• CPC Class Codes: H01L 2224/131 with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
• CPC Class Codes: H01L 2224/13124 Aluminium [Al] as principal constituent
• CPC Class Codes: H01L 2224/13139 Silver [Ag] as principal constituent
• CPC Class Codes: H01L 2224/13144 Gold [Au] as principal constituent
• CPC Class Codes: H01L 2224/13147 Copper [Cu] as principal constituent
• CPC Class Codes: H01L 2224/1319 : with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
• CPC Class Codes: H01L 2224/1329 : with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
• CPC Class Codes: H01L 2224/16225 : the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/291 : with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
• CPC Class Codes: H01L 2224/29124 : Aluminium [Al] as principal constituent
• CPC Class Codes: H01L 2224/29139 : Silver [Ag] as principal constituent
• CPC Class Codes: H01L 2224/29144 : Gold [Au] as principal constituent
• CPC Class Codes: H01L 2224/29147 : Copper [Cu] as principal constituent
• CPC Class Codes: H01L 2224/2919 : with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
• CPC Class Codes: H01L 2224/2929 : with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
• CPC Class Codes: H01L 2224/32225 : the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/45099 : Material
• CPC Class Codes: H01L 2224/48091 : Arched
• CPC Class Codes: H01L 2224/48227 : connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/73203 : Bump and layer connectors
• CPC Class Codes: H01L 2224/73265 : Layer and wire connectors
• CPC Class Codes: H01L 2224/81101 : as prepeg comprising a bump connector, e.g. provided in an insulating plate member
• CPC Class Codes: H01L 2224/83101 : as prepeg comprising a layer connector, e.g. provided in an insulating plate member
• CPC Class Codes: H01L 2224/83851 : being an anisotropic conductive adhesive
• CPC Class Codes: H01L 2225/0651 : Wire or wire-like electrical connections from device to substrate
• CPC Class Codes: H01L 2225/06517 : Bump or bump-like direct electrical connections from device to substrate
• CPC Class Codes: H01L 2225/06572 : Auxiliary carrier between devices, the carrier having an electrical connection structure
• CPC Class Codes: H01L 23/3135 : Double encapsulation or coating and encapsulation
• CPC Class Codes: H01L 24/13 : of an individual bump connector
• CPC Class Codes: H01L 24/16 : of an individual bump connector
• CPC Class Codes: H01L 24/29 : of an individual layer connector
• CPC Class Codes: H01L 24/32 : of an individual layer connector
• CPC Class Codes: H01L 24/48 : of an individual wire connector
• CPC Class Codes: H01L 25/0652 : the devices being arranged next and on each other, i.e. mixed assemblies
• CPC Class Codes: H01L 2924/00 : Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 : Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/014 : Solder alloys
• CPC Class Codes: H01L 2924/0781 : being an ohmic electrical conductor
• CPC Class Codes: H05K 1/0326 : containing O
• CPC Class Codes: H05K 1/0393 : Flexible materials H05K1/038 takes precedence; specific organic compositions are classified in H05K1/0313 and subgroups
• CPC Class Codes: H05K 1/115 : Via connections; Lands around holes or via connections H05K1/112 takes precedence
• CPC Class Codes: H05K 1/181 : associated with surface mounted components
• CPC Class Codes: H05K 2201/0195 : Dielectric or adhesive layers comprising a plurality of layers, e.g. in a multilayer structure
• CPC Class Codes: H05K 3/303 : Surface mounted components, e.g. affixing before soldering, aligning means, spacing means H05K3/32 takes precedence
• CPC Class Codes: H05K 5/0095 : hermetically-sealed
• CPC Class Codes: H05K 5/065 : sealed by encapsulation, e.g. waterproof resin forming an integral casing, injection moulding
• CPC Class Codes: Y10T 29/49146 : with encapsulating, e.g., potting, etc.

Abstract

Generally discussed herein are systems and apparatuses that can include a flexible substrate with a hermetic seal formed thereon. The disclosure also includes techniques of making and using the systems and apparatuses. According to an example a technique of making a hermetic seal on a flexible substrate can include (1) forming an interconnect on a flexible substrate, (2) situating a device on the substrate near the interconnect, or (3) selectively depositing a first hermetic material on the device or interconnect so as to hermetically seal the device within the combination of the interconnect and first hermetic material.

Claims

1. An apparatus comprising:

a first glass island on a first surface of a flexible substrate;

a first metal contact including a first portion in contact with the flexible substrate and a second portion on a first side of the first glass island and on a surface of the first glass island;

a second metal contact including a first portion on the flexible substrate and a second portion on a second side of the first glass island and on the surface of the first glass island, the second side of the first glass island opposite the first side of the first glass island;

a first device situated on the first glass island and electrically coupled, using wire bonds, to the first and second metal contacts;

a first layer of glass over the first device and in contact with the first and second metal contacts, such that the first layer of glass, the first glass island, and the first and second metal contacts form a hermetic seal for the first device;

a second glass island on a second surface of the flexible substrate, the second surface opposite the first surface;

a third metal contact including a first portion on the second surface and including a second portion on the second glass island;

a fourth metal contact completely on the second glass island;

a second device situated on the second glass island and electrically coupled, using a flip chip interconnect, to the third metal contact near a first side of the second device; and

a second layer of glass in contact with the second glass island so as to form a continuous glass structure, the second layer of glass covering a second side of the second device, covering a surface of the second device facing away from the second glass island, and covering the first side of the second device, the second side of the second device opposite the first side of the second device, the second layer of glass in contact with the third metal contact, such that the glass structure, and the third metal contact hermetically seal the second device.

2. The apparatus of claim 1, further comprising:

a dielectric layer over the first layer of glass.

3. The apparatus of claim 1, wherein the first glass island is less than about ten microns thick.

4. The apparatus of claim 1, further comprising an adhesive between and coupling the first device to the first glass island.

5. The apparatus of claim 1, wherein the flexible substrate includes Polydimethylsiloxane (PDMS).