Semiconductor package with multiple compartments

• US 9,932,221 B1
• Filed: 03/02/2017
• Issued: 04/03/2018
• Est. Priority Date: 03/02/2017
• Status: Active Grant

• Current Assignee: Amkor Technology Singapore Holding Pte., Ltd. (Amkor Technology Incorporated)
• Original Assignee: Amkor Technology Incorporated
• Inventors: Natan, Lawrence Prestousa, Arcedera, Adrian, Lledo-Reyes, Roveluz, Torrefranca, Sarah Christine-Sanchez
• Primary Examiner(s): Prenty, Mark
• Application Number:
  US15/448,177
• Time in Patent Office: 397 Days
• CPC Class Codes: B81B 2201/0235 Accelerometers
• CPC Class Codes: B81B 2201/0242 Gyroscopes
• CPC Class Codes: B81B 2201/0257 Microphones or microspeakers
• CPC Class Codes: B81B 2201/0278 Temperature sensors
• CPC Class Codes: B81B 2201/0292 Sensors not provided for in B81B2201/0207 - B81B2201/0285
• CPC Class Codes: B81B 2203/0127 Diaphragms, i.e. structures separating two media that can control the passage from one medium to another; Membranes, i.e. diaphragms with filtering function
• CPC Class Codes: B81B 2203/0315 Cavities
• CPC Class Codes: B81B 2207/012 the micromechanical device and the control or processing electronics being separate parts in the same package
• CPC Class Codes: B81B 2207/07 Interconnects
• CPC Class Codes: B81B 2207/097 Interconnects arranged on the substrate or the lid, and covered by the package seal
• CPC Class Codes: B81B 7/0074 3D packaging, i.e. encapsulation containing one or several MEMS devices arranged in planes non-parallel to the mounting board
• CPC Class Codes: B81C 1/00333 Aspects relating to packaging of MEMS devices, not covered by groups B81C1/00269 - B81C1/00325
• CPC Class Codes: B81C 2203/019 characterised by the material or arrangement of seals between parts
• CPC Class Codes: B81C 2203/0792 Forming interconnections between the electronic processing unit and the micromechanical structure
• CPC Class Codes: G01P 1/023 for acceleration measuring devices
• CPC Class Codes: H01L 2224/48228 the bond pad being disposed in a recess of the surface of the item
• CPC Class Codes: H01L 2224/48471 the other connecting portion not on the bonding area being a ball bond, i.e. wedge-to-ball, reverse stitch
• CPC Class Codes: H01L 2224/48479 on the semiconductor or solid-state body
• CPC Class Codes: H01L 2924/19107 off-chip wires

Abstract

A semiconductor device may include a first substrate, a first electrical component, a lid, a second substrate, and a second electrical component. The first substrate may include an upper surface, a lower surface, and an upper cavity in the upper surface. The first electrical component may reside in the upper cavity of the first substrate. The lid may cover the upper cavity and may include a port that permits fluid to flow between an environment external to the semiconductor device and the upper cavity. The second substrate may include the second electrical component mounted to an upper surface of the second substrate. The lower surface of the first substrate and the upper surface of the second substrate may fluidically seal the second electrical component from the upper cavity.

Claims

1. A semiconductor device comprising:

a first substrate comprising an upper surface, a lower surface, and an upper cavity in the upper surface;

a first electrical component residing in the upper cavity of the first substrate;

a lid covering the upper cavity, the lid comprising at least one port that permits fluid to flow between an environment external to the semiconductor device and the upper cavity;

a second substrate comprising an upper surface; and

a second electrical component mounted to the upper surface of the second substrate;

wherein the lower surface of the first substrate and the upper surface of the second substrate fluidically seal the second electrical component from the upper cavity.

2. The semiconductor device of claim 1, wherein the first electrical component is configured to sense properties of the external environment based on being fluidically-exposed to the external environment.

3. The semiconductor device of claim 1, wherein the second electrical component is configured to sense properties of the external environment while being fluidically-sealed from the external environment.

4. The semiconductor device of claim 1, further comprising an interposer assembly residing in the upper cavity, wherein the first electrical component is mounted to the interposer assembly.

5. The semiconductor device of claim 4, wherein the interposer assembly comprises a plurality of subassemblies that are electrically coupled to one another to form the interposer assembly.

6. The semiconductor device of claim 5, wherein the first substrate comprises a plurality of compartments, each compartment sized to receive a respective one of the plurality of subassemblies.

7. The semiconductor device of claim 1, further comprising one or more package terminals that are electrically coupled to one or more ground pads on the upper surface of the second substrate;

wherein the first substrate further comprises one or more ground traces passing between the upper surface and the lower surface of the first substrate; and

wherein the one or more ground traces electrically couple the lid to the one or more ground pads.

8. The semiconductor device of claim 1, wherein:

the first electrical component comprises a micro-electro mechanical systems (MEMS) environment sensor device; and

the second electrical component comprises a MEMS inertial measurement sensor device.

9. The semiconductor device of claim 1, wherein the first electrical component comprises a micro-electro mechanical systems (MEMS) microphone device having an input port aligned with the at least one port in the lid and a diaphragm that vibrates in response to sound waves received via the at least one port in the lid.

10. The semiconductor device of claim 9, wherein:

the upper cavity comprises a compartment having a mounting surface to receive the first electrical component; and

the mounting surface further comprising a cavity aligned with the diaphragm to provide the microphone device with a backing volume.

11. A semiconductor device comprising:

a first substrate comprising an upper surface, a lower surface, an upper cavity in the upper surface, and a lower cavity in the lower surface;

an interposer assembly in the upper cavity of the first substrate, the interposer assembly comprising a first micro-electro mechanical systems (MEMS) device;

a lid covering the upper cavity, the lid comprising a port that permits fluid to flow between an environment external to the semiconductor device and the upper cavity;

a second substrate comprising an upper surface; and

a second MEMS device mounted to the upper surface of the second substrate;

wherein the lower cavity receives the second MEMS device; and

wherein the lower surface of the first substrate and the upper surface of the second substrate seal the second MEMS device within the lower cavity.

12. The semiconductor device of claim 11, wherein:

the first MEMS device is configured to sense properties of the external environment based on being fluidically-exposed to the external environment; and

the second MEMS device is configured to sense properties of the external environment while being fluidically-sealed from the external environment.

13. The semiconductor device of claim 11, wherein:

the second substrate comprises a plurality of bond pads;

the first substrate further comprises a pass-through aligned with the plurality of bond pads; and

a plurality of bond wires traverse the pass-through and electrically couple the interposer assembly to the plurality of bond pads of the second substrate.

14. The semiconductor device of claim 13, wherein the interposer assembly comprises a plurality of subassemblies that are electrically coupled to one another to form the interposer assembly.

15. The semiconductor device of claim 14, wherein:

the first substrate comprises a plurality of compartments;

each compartment is sized to receive a respective one of the plurality of subassemblies; and

each compartment comprises a mounting surface at a depth defined to receive the respective one of the plurality of subassemblies.

16. The semiconductor device of claim 11, further comprising one or more package terminals that are electrically coupled to one or more ground pads on the upper surface of the second substrate;

wherein the first substrate further comprises one or more ground traces passing between the upper surface and the lower surface of the first substrate; and

wherein the one or more ground traces electrically couple the lid to the one or more ground pads.

17. The semiconductor device of claim 11, wherein:

the first MEMS device comprises an environment sensor device; and

the second MEMS device comprises an inertial measurement sensor device.

18. The semiconductor device of claim 11, wherein the first MEMS device comprises microphone device having an input port aligned with the port in the lid and a diaphragm that vibrates in response to sound waves received via the port in the lid.

19. The semiconductor device of claim 18, wherein:

the upper cavity comprises a compartment having a mounting surface to receive the first MEMS device; and

the mounting surface further comprising a cavity aligned with the diaphragm to provide the microphone device with a backing volume.

20. A method of fabricating a semiconductor device, comprising:

placing a first electrical component in an upper cavity of a first substrate comprising an upper surface, a lower surface, and the upper cavity in the upper surface;

covering the upper cavity with a lid comprising at least one port that permits fluid to flow between an environment external to the semiconductor device and the upper cavity;

mounting a second electrical component to an upper surface of a second substrate; and

affixing the first substrate to the second substrate such that the lower surface of the first substrate and the upper surface of the second substrate fluidically seal the second electrical component from the upper cavity.