Capacitive touch sensitive housing and method for making the same
First Claim
1. A cover for an electronic device, comprising:
- a surface; and
at least one array of capacitive touch sensor pads formed on the surface as an input to the electronic device,wherein each capacitive touch sensor pad comprises an active metal layer made from an active metal capable of catalytically initiating the forming of a metal layer on the active metal layer.
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Accused Products
Abstract
A method for making a capacitive touch sensitive housing, comprises: forming a non-patterned active metal layer on a housing wall; patterning the non-patterned active metal layer on the housing wall by laser ablation such that the non-patterned active metal layer is formed into a patterned active metal layer including a plurality of plating portions separated from each other, and a plurality of non-plating portions separated from the plating portions; and forming a metal layer on the patterned active metal layer such that the metal layer has first portions formed on the plating portions of the patterned active metal layer, and second portions formed on the non-plating portions of the patterned active metal layer.
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Citations
18 Claims
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1. A cover for an electronic device, comprising:
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a surface; and at least one array of capacitive touch sensor pads formed on the surface as an input to the electronic device, wherein each capacitive touch sensor pad comprises an active metal layer made from an active metal capable of catalytically initiating the forming of a metal layer on the active metal layer. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9)
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10. A method for providing capacitive touch inputs to an electronic device, comprising:
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forming at least one array of capacitive touch sensor pads on a surface of a housing for the electronic device, wherein formation of each capacitive touch sensor pad comprises; forming an active metal layer on the surface, wherein the active metal is capable of catalytically initiating the forming of a metal layer on the active metal layer; and forming the metal layer on the active metal layer ; and connecting the housing to the electronic device. - View Dependent Claims (11, 12, 13, 14, 15, 16, 17, 18)
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Specification