Electronic component case and electronic component device

• US 9,933,822 B2
• Filed: 03/29/2016
• Issued: 04/03/2018
• Est. Priority Date: 09/27/2013
• Status: Active Grant

• Current Assignee: Shinko Electric Industries Company Limited (Fujitsu Limited)
• Original Assignee: Shinko Electric Industries Company Limited (Fujitsu Limited)
• Inventors: Tan, Minshong, Aoki, Syuzo, Oda, Takuya
• Primary Examiner(s): Smith, Courtney
• Assistant Examiner(s): Morrison, Rashen E
• Application Number:
  US15/083,396
• Publication Number:
  US 20160209888A1
• Time in Patent Office: 735 Days
• Field of Search: None
• CPC Class Codes: G06F 1/181 Enclosures for portable computers G06F1/1613
• CPC Class Codes: G06F 1/183 Internal mounting support structures, e.g. for printed circuit boards, internal connecting means for buses G06F13/409
• CPC Class Codes: H05K 5/0008 assembled by screws

Abstract

An electronic component case includes, a lower case including a bottom plate, a side wall having a protruding portion, an engaging projection formed on an outer face of the side wall, and a screw hole formed in the side wall in a region where the protruding portion is provided, and an upper case including a top plate, a side wall in which an engaging hole is formed, and a notched hole formed in the side wall on the top plate side. The protruding portion of the lower case is engaged to the notched hole of the upper case, and the screw hole is exposed in the notched hole. The engaging projection of the lower case is engaged in the engaging hole of the upper case.

Claims

1. An electronic component case, comprising:

a lower case including

a bottom plate,

a side wall,

an engaging projection formed on an outer face of the side wall, and

a substrate positioning projection formed on a periphery of a face of the bottom plate of the side wall side, wherein a cavity hole which is opened in an outer surface side of the bottom plate is formed in an inner part of the substrate positioning projection; and

an upper case including

a top plate,

a side wall in which an engaging hole is formed, and

a substrate pushing projection formed on a periphery of a face of the top plate of the side wall side, and corresponding to the substrate positioning projection of the lower case, wherein a cavity hole which is opened in an outer surface side of the top plate is formed in an inner part of the substrate pushing projection, wherein

when an electronic component is to be housed between the lower case and the upper case, the substrate positioning projection of the lower case is inserted in a datum hole of a substrate of the electronic component, and a part of the substrate of the electronic component in a periphery of the datum hole is pushed by the substrate pushing projection of the upper case, and

the engaging projection of the lower case is engaged to the engaging hole of the upper case.

2. An electronic component device, comprising:

a lower case including

a bottom plate,

a side wall,

an engaging projection formed on an outer face of the side wall, and

a substrate positioning projection formed on a periphery of a face of the bottom plate of the side wall side, wherein a cavity hole which is opened in an outer surface side of the bottom plate is formed in an inner part of the substrate positioning projection,

an upper case including

a top plate,

a side wall in which an engaging hole is formed, and

a substrate pushing projection formed on a periphery of a face of the top plate of the side wall side, and corresponding to the substrate positioning projection of the lower case, a cavity hole which is opened in an outer surface side of the top plate is formed in an inner part of the substrate pushing projection, and

an electronic component housed between the lower case and the upper case, wherein

when the electronic component is housed between the lower case and the upper case, the substrate positioning projection of the lower case is inserted in a datum hole of a substrate of the electronic component, and a part of the substrate of the electronic component in a periphery of the datum hole is pushed by the substrate pushing projection of the upper case, and

the engaging projection of the lower case is engaged to the engaging hole of the upper case.

3. An electronic component case, comprising:

a lower case including

a bottom plate,

a side wall,

an engaging projection formed on an outer face of the side wall, and

a substrate positioning projection formed on a periphery of a face of the bottom plate of the side wall side; and

an upper case including

a top plate,

a side wall in which an engaging hole is formed, and

a substrate positioning projection formed on a periphery of a face of the top plate of the side wall side, and corresponding to the substrate positioning projection of the lower case, wherein

when an electronic component is to be housed between the lower case and the upper case, the substrate positioning projection of the lower case is inserted in a datum hole of a substrate of the electronic component, and a part of the substrate of the electronic component in a periphery of the datum hole is pushed by the substrate pushing projection of the upper case, and

the engaging projection of the lower case is engaged to the engaging hole of the upper case,

wherein

the substrate positioning projection of the lower case has a large diameter portion located to a lower side and a small diameter portion located to an upper side,

the substrate pushing projection of the upper case has a concave portion formed from a tip to an inner part of the substrate pushing projection, and

the small diameter portion of the substrate positioning projection is inserted in the datum hole of the substrate of the electronic component, and a tip of the small diameter portion is arranged in the concave portion of the substrate pushing projection.

4. An electronic component device, comprising:

a lower case including

a bottom plate,

a side wall,

an engaging projection formed on an outer face of the side wall, and

a substrate positioning projection formed on a periphery of a face of the bottom plate of the side wall side, and

an upper case including

a top plate,

a side wall in which an engaging hole is formed, and

a substrate pushing projection formed on a periphery of a face of the top plate of the side wall side, and corresponding to the substrate positioning projection of the lower case, and

an electronic component housed between the lower case and the upper case, wherein

when the electronic component is housed between the lower case and the upper case, the substrate positioning projection of the lower case is inserted in a datum hole of a substrate of the electronic component, and a part of the substrate of the electronic component in a periphery of the datum hole is pushed by the substrate pushing projection of the upper case, and

the engaging projection of the lower case is engaged to the engaging hole of the upper case,

wherein

the substrate positioning projection of the lower case has a large diameter portion located to a lower side and a small diameter portion located to an upper side,

the substrate pushing projection of the upper case has a concave portion formed from a tip to an inner part of the substrate pushing projection, and

the small diameter portion of the substrate positioning projection is inserted in the datum hole of the substrate of the electronic component, and a tip of the small diameter portion is arranged in the concave portion of the substrate pushing projection.