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Electronic component case and electronic component device

  • US 9,933,822 B2
  • Filed: 03/29/2016
  • Issued: 04/03/2018
  • Est. Priority Date: 09/27/2013
  • Status: Active Grant
First Claim
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1. An electronic component case, comprising:

  • a lower case includinga bottom plate,a side wall,an engaging projection formed on an outer face of the side wall, anda substrate positioning projection formed on a periphery of a face of the bottom plate of the side wall side, wherein a cavity hole which is opened in an outer surface side of the bottom plate is formed in an inner part of the substrate positioning projection; and

    an upper case includinga top plate,a side wall in which an engaging hole is formed, anda substrate pushing projection formed on a periphery of a face of the top plate of the side wall side, and corresponding to the substrate positioning projection of the lower case, wherein a cavity hole which is opened in an outer surface side of the top plate is formed in an inner part of the substrate pushing projection, whereinwhen an electronic component is to be housed between the lower case and the upper case, the substrate positioning projection of the lower case is inserted in a datum hole of a substrate of the electronic component, and a part of the substrate of the electronic component in a periphery of the datum hole is pushed by the substrate pushing projection of the upper case, andthe engaging projection of the lower case is engaged to the engaging hole of the upper case.

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