Chamber with flow-through source
First Claim
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1. A semiconductor processing chamber comprising:
- a chamber housing at least partially defining an interior region of the semiconductor processing chamber;
a showerhead positioned within the chamber housing, wherein the showerhead at least partially divides the interior region into a remote region and a processing region in which a substrate can be contained; and
an inductively coupled plasma source positioned between the showerhead and the processing region, wherein the inductively coupled plasma source comprises a conductive material within a dielectric material.
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Abstract
Described processing chambers may include a chamber housing at least partially defining an interior region of a semiconductor processing chamber. The chamber may include a showerhead positioned within the chamber housing, and the showerhead may at least partially divide the interior region into a remote region and a processing region in which a substrate can be contained. The chamber may also include an inductively coupled plasma source positioned between the showerhead and the processing region. The inductively coupled plasma source may include a conductive material within a dielectric material.
1681 Citations
19 Claims
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1. A semiconductor processing chamber comprising:
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a chamber housing at least partially defining an interior region of the semiconductor processing chamber; a showerhead positioned within the chamber housing, wherein the showerhead at least partially divides the interior region into a remote region and a processing region in which a substrate can be contained; and an inductively coupled plasma source positioned between the showerhead and the processing region, wherein the inductively coupled plasma source comprises a conductive material within a dielectric material. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14)
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15. An inductively coupled plasma source comprising:
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a first plate defining at least a portion of a first channel and at least a portion of a second channel within the first plate, wherein the first plate comprises a dielectric material; a first conductive material seated within the at least a portion of the first channel; and a second conductive material seated within the at least a portion of the second channel, wherein each of the first conductive material and the second conductive material is characterized by a spiral or coil configuration, and wherein each of the first conductive material and the second conductive material is coupled with an RF source. - View Dependent Claims (16, 17, 18)
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19. A semiconductor processing chamber comprising:
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a chamber housing at least partially defining an interior region of the semiconductor processing chamber, wherein the chamber housing includes a lid assembly including an inlet for receiving precursors into the semiconductor processing chamber; a pedestal within the interior region of the semiconductor processing chamber; a showerhead positioned within the chamber housing, wherein the showerhead is positioned between the lid assembly and the pedestal; an inductively coupled plasma source positioned between the showerhead and the pedestal, wherein the inductively coupled plasma source comprises a conductive material within a dielectric material.
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Specification