Method of manufacturing a cooler for semiconductor modules

• US 9,934,990 B2
• Filed: 01/31/2017
• Issued: 04/03/2018
• Est. Priority Date: 03/03/2015
• Status: Active Grant

• Current Assignee: Infineon Technologies AG
• Original Assignee: Infineon Technologies AG
• Inventors: Yoo, Inpil, Grassmann, Andreas
• Primary Examiner(s): DIALLO, MAMADOU L
• Application Number:
  US15/420,321
• Publication Number:
  US 20170140946A1
• Time in Patent Office: 427 Days
• CPC Class Codes: H01L 21/4817 for containers, e.g. caps H01L21/4871 takes precedence
• CPC Class Codes: H01L 21/4875 Connection or disconnection of other leads to or from bases or plates
• CPC Class Codes: H01L 21/4882 Assembly of heatsink parts
• CPC Class Codes: H01L 21/54 Providing fillings in containers, e.g. gas fillings
• CPC Class Codes: H01L 21/565 Moulds
• CPC Class Codes: H01L 23/08 the material being an electrical insulator, e.g. glass
• CPC Class Codes: H01L 23/18 Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device
• CPC Class Codes: H01L 23/3107 the device being completely enclosed
• CPC Class Codes: H01L 23/3142 Sealing arrangements between parts, e.g. adhesion promotors
• CPC Class Codes: H01L 23/3672 Foil-like cooling fins or heat sinks being part of lead-frames H01L23/49568
• CPC Class Codes: H01L 23/3737 Organic materials with or without a thermoconductive filler
• CPC Class Codes: H01L 23/44 the complete device being wholly immersed in a fluid other than air H01L23/427 takes precedence
• CPC Class Codes: H01L 23/473 by flowing liquids H01L23/4332, H01L23/4338 take precedence
• CPC Class Codes: H01L 23/49811 Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads H01L23/49827 takes precedence

Abstract

A cooling apparatus is manufactured by: receiving a discrete module by a first singular part, the discrete module including a semiconductor die encapsulated by a mold compound, a plurality of leads electrically connected to the semiconductor die and protruding out of the mold compound, and a first cooling plate at least partly uncovered by the mold compound; attaching a second singular part to a periphery of the first part to form a housing, the housing surrounding a periphery of the discrete module, the second part having a cutout which exposes the first cooling plate and a sealing structure facing a side of the discrete module with the first cooling plate; and filling the sealing structure with a sealing material which forms a water-tight seal around the periphery of the discrete module at the side of the discrete module with the first cooling plate.

Claims

1. A method of manufacturing a cooling apparatus, the method comprising:

receiving a discrete module by a first singular part, the discrete module comprising a semiconductor die encapsulated by a mold compound, a plurality of leads electrically connected to the semiconductor die and protruding out of the mold compound, and a first cooling plate at least partly uncovered by the mold compound;

attaching a second singular part to a periphery of the first part to form a housing, the housing surrounding a periphery of the discrete module, the second part having a cutout which exposes the first cooling plate and a sealing structure facing a side of the discrete module with the first cooling plate; and

filling the sealing structure with a sealing material which forms a water-tight seal around the periphery of the discrete module at the side of the discrete module with the first cooling plate.

2. The method of claim 1, wherein the sealing structure of the second part comprises a groove formed in the second part which surrounds the periphery of the discrete module at the side of the discrete module with the first cooling plate, and wherein the sealing material is injected into the groove through an opening in the second part.

3. The method of claim 2, wherein a part of the second part disposed interiorly from the groove contacts the side of the discrete module with the first cooling plate to prevent the sealing material from leaking onto the first cooling plate when injected into the groove through the opening in the second part.

4. The method of claim 1, further comprising:

attaching a first cover to a periphery of the second part to form a water-tight seal with the second part and an enclosed cavity between the first cover and the second part, the enclosed cavity configured to permit fluid flow over the first cooling plate of the discrete module.

5. The method of claim 1, wherein the discrete module has a second cooling plate at a side opposite the first cooling plate, and wherein the first part has a cutout which exposes the second cooling plate and a sealing structure, the method further comprising:

filling the sealing structure of the first part with additional sealing material which forms a water-tight seal around the periphery of the discrete module at the side of the discrete module with the second cooling plate.

6. The method of claim 5, wherein the sealing structure of the first part comprises a groove formed in the first part which surrounds the periphery of the discrete module at the side of the discrete module with the second cooling plate, and wherein the additional sealing material is injected into the groove through an opening in the first part.

7. The method of claim 6, wherein a part of the first part disposed interiorly from the groove contacts the side of the discrete module with the second cooling plate to prevent the additional sealing material from leaking onto the second cooling plate when injected into the groove through the opening in the first part.

8. The method of claim 5, further comprising:

attaching a second cover to a periphery of the first part to form a water-tight seal with the first part and an enclosed cavity between the second cover and the first part, the enclosed cavity configured to permit fluid flow over the second cooling plate of the discrete module.

9. A method of manufacturing a cooling apparatus, the method comprising:

providing a first discrete module and a second discrete module, each of the discrete modules comprising a semiconductor die encapsulated by a mold compound, a plurality of leads electrically connected to the semiconductor die and protruding out of the mold compound, a first cooling plate at least partly uncovered by the mold compound, and a housing which surrounds a periphery of the mold compound, each of the housings comprising a first singular part which receives the corresponding discrete module and a second singular part attached to a periphery of the first part, the second part having a cutout which exposes the first cooling plate and a sealing structure containing a sealing material which forms a water-tight seal around the periphery of the mold compound at a side of the discrete module with the first cooling plate;

attaching a first cover to a periphery of the second part of the housing of the first discrete module to form a water-tight seal with the second part of the housing of the first discrete module and an enclosed cavity between the first cover and the second part, the enclosed cavity configured to permit fluid flow over the first cooling plate of the first discrete module;

securing a second cover between the first and the second discrete modules, the second cover being attached to a periphery of the second part of the housing of the second discrete module to form a water-tight seal with the second part of the housing of the second discrete module and an enclosed cavity between the second cover and the second part, the enclosed cavity configured to permit fluid flow over the first cooling plate of the second discrete module; and

attaching a third cover to a side of the housing of the second discrete module opposite the second cover.

10. The method of claim 9, wherein the second cover has one or more openings configured to permit fluid flow between the first and the second discrete modules.

11. The method of claim 9, wherein the second cover is attached to a periphery of the first part of the housing of the first discrete module at a side of the housing facing away from the first cover so as to form a water-tight seal with the first part of the housing of the first discrete module and an enclosed cavity between the second cover and the first part, the enclosed cavity configured to permit fluid flow over a second cooling plate of the first discrete module which is disposed at a side of the first discrete module opposite the first cooling plate.

12. The method of claim 9, wherein the third cover forms a water-tight seal with the first part of the housing of the second discrete module and an enclosed cavity between the third cover and the first part, the enclosed cavity configured to permit fluid flow over a second cooling plate of the second discrete module which is disposed at a side of the second discrete module opposite the first cooling plate.

13. The method of claim 9, further comprising:

providing a third discrete module comprising a semiconductor die encapsulated by a mold compound, a plurality of leads electrically connected to the semiconductor die and protruding out of the mold compound, a first cooling plate at least partly uncovered by the mold compound, and a housing which surrounds a periphery of the mold compound, the housing comprising a first singular part which receives the third discrete module and a second singular part attached to a periphery of the first part, the second part having a cutout which exposes the first cooling plate and a sealing structure containing a sealing material which forms a water-tight seal around the periphery of the mold compound at a side of the third discrete module with the first cooling plate;

attaching a fourth cover to a side of the housing of the third discrete module opposite the third cover; and

attaching the third cover to a periphery of the first part of the housing of the third discrete module to form a water-tight seal with the first part of the housing of the third discrete module and an enclosed cavity between the third cover and the first part, the enclosed cavity configured to permit fluid flow over a second cooling plate of the third discrete module which is disposed at a side of the third discrete module opposite the first cooling plate.

14. The method of claim 13, wherein the fourth cover is attached to a periphery of the first part of the housing of the third discrete module at a side of the housing facing away from the third cover so as to form a water-tight seal with the first part of the housing of the third discrete module and an enclosed cavity between the fourth cover and the first part, the enclosed cavity configured to permit fluid flow over a second cooling plate of the third discrete module which is disposed at a side of the third discrete module opposite the first cooling plate.

15. The method of claim 14, wherein the third cover has one or more openings configured to permit fluid flow between the second and the third discrete modules.