Semiconductor device and semiconductor module having cooling fins

• US 9,935,034 B2
• Filed: 03/31/2017
• Issued: 04/03/2018
• Est. Priority Date: 09/10/2013
• Status: Active Grant

• Current Assignee: Mitsubishi Electric Corporation
• Original Assignee: Mitsubishi Electric Corporation
• Inventors: Ushijima, Koichi, Hussein, Khalid Hassan, Saito, Shoji
• Primary Examiner(s): Soward, Ida M
• Application Number:
  US15/475,779
• Publication Number:
  US 20170207143A1
• Time in Patent Office: 368 Days
• CPC Class Codes: H01L 2023/4031 Packaged discrete devices, e.g. to-3 housings, diodes
• CPC Class Codes: H01L 2023/4087 Mounting accessories, interposers, clamping or screwing parts
• CPC Class Codes: H01L 23/3672 Foil-like cooling fins or heat sinks being part of lead-frames H01L23/49568
• CPC Class Codes: H01L 23/3677 Wire-like or pin-like cooling fins or heat sinks
• CPC Class Codes: H01L 23/4006 with bolts or screws
• CPC Class Codes: H01L 23/4012 for stacked arrangements of a plurality of semiconductor devices assemblies per se H01L25/00
• CPC Class Codes: H01L 23/4093 Snap-on arrangements, e.g. clips
• CPC Class Codes: H01L 23/473 by flowing liquids H01L23/4332, H01L23/4338 take precedence
• CPC Class Codes: H01L 23/49562 for devices being provided for in H01L29/00
• CPC Class Codes: H01L 25/112 Mixed assemblies
• CPC Class Codes: H01L 25/115 the devices being arranged next to each other
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

A semiconductor module having a plurality of cooling fins and a fixing cooling fin longer than the plurality of cooling fins, the fixing cooling fin having a threaded hole provided in distal end portion thereof, a cooling jacket having a cooling medium passage in which the plurality of cooling fins and the fixing cooling fin are housed, and an opening formed so as to enable a screw to be inserted in the threaded hole, and a screw passed through the opening to be inserted in the threaded hole, the cooling jacket being fixed to the semiconductor module with the screw are provided.

Claims

1. A semiconductor device comprising:

a semiconductor module having a plurality of cooling fins; and

a cooling jacket having a cooling medium passage in which the plurality of cooling fins are housed,

wherein a snap-fitting mechanism for fixing the semiconductor module to the cooling jacket is formed on the semiconductor module and the cooling jacket.

2. The semiconductor device according to claim 1, wherein the snap-fitting mechanism includes:

a hook formed on the semiconductor module so as to extend in the same direction as the plurality of cooling fins; and

a hook groove formed in the cooling jacket so as to have a shape for snap-fit fixing to the hook.

3. The semiconductor device according to claim 2, wherein a base end portion of the hook is tapered.

4. The semiconductor device according to claim 1, wherein the semiconductor module includes:

a first semiconductor module fixed to the cooling jacket at the upper surface side of the same by the snap-fitting mechanism; and

a second semiconductor module fixed to the cooling jacket at the lower surface side of the same by the snap-fitting mechanism.

5. The semiconductor device according to claim 1, comprising a plurality of the semiconductor modules and a plurality of the cooling jackets, wherein the plurality of cooling jackets are connected so as to form one continuous cooling medium passage.