Semiconductor device and method for manufacturing same
First Claim
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1. A semiconductor device comprising:
- a single lead frame that includesone surface and a rear surface opposite to the one surface, and further includesa first heat sink, an island, and a control terminal, the island and the control terminal being separated from the first heat sink;
a first semiconductor chip that includesa first main electrode arranged at a facing surface of the first semiconductor chip facing the rear surface, and further includesa control electrode and a second main electrode, the second main electrode paired with the first main electrode, the control electrode and the second main electrode being arranged at a surface of the first semiconductor chip opposite to the facing surface, the first main electrode being connected to the first heat sink;
a second heat sink arranged opposed to the surface of the first semiconductor chip at which the control electrode is arranged, the second heat sink being connected to the second main electrode;
a second semiconductor chip fixed to the island at the rear surface to control driving of the first semiconductor chip, the second semiconductor chip being connected to the control electrode through a first bonding wire, and connected to the control terminal through a second bonding wire;
a passive component mounted on a passive component mounting portion of the control terminal through a bonding material; and
a resin molding that includes a surface at the first heat sink side, and a surface at the second heat sink side in a lamination direction of the first heat sink, the second heat sink, and the first semiconductor chip, the resin molding integrally sealing the first semiconductor chip, the second semiconductor chip, the passive component, at least a part of the first heat sink and the second heat sink, the first bonding wire, the second bonding wire, the island, and a part of the control terminal including the passive component mounting portion, wherein;
a part of the single lead frame is bent with respect to a remaining part of the single lead frame such that a surface of the island on which the second semiconductor chip is mounted is located closer to the first heat sink side surface of the resin molding at the rear surface than a surface of the first heat sink on which the first semiconductor chip is mounted and the passive component mounting portion of the control terminal; and
the passive component is mounted on the passive component mounting portion of the control terminal at the one surface.
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Accused Products
Abstract
A lead frame has a first sink, an island, and a control terminal. The lead frame is bent, and at a rear surface, the island is positioned closer to one surface of a resin molded body than the first sink and a passive component mounting portion of the control terminal. A passive component is mounted on the passive component mounting portion of the control terminal through a bonding material, the passive component mounting portion being a part of one surface.
6 Citations
7 Claims
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1. A semiconductor device comprising:
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a single lead frame that includes one surface and a rear surface opposite to the one surface, and further includes a first heat sink, an island, and a control terminal, the island and the control terminal being separated from the first heat sink; a first semiconductor chip that includes a first main electrode arranged at a facing surface of the first semiconductor chip facing the rear surface, and further includes a control electrode and a second main electrode, the second main electrode paired with the first main electrode, the control electrode and the second main electrode being arranged at a surface of the first semiconductor chip opposite to the facing surface, the first main electrode being connected to the first heat sink; a second heat sink arranged opposed to the surface of the first semiconductor chip at which the control electrode is arranged, the second heat sink being connected to the second main electrode; a second semiconductor chip fixed to the island at the rear surface to control driving of the first semiconductor chip, the second semiconductor chip being connected to the control electrode through a first bonding wire, and connected to the control terminal through a second bonding wire; a passive component mounted on a passive component mounting portion of the control terminal through a bonding material; and a resin molding that includes a surface at the first heat sink side, and a surface at the second heat sink side in a lamination direction of the first heat sink, the second heat sink, and the first semiconductor chip, the resin molding integrally sealing the first semiconductor chip, the second semiconductor chip, the passive component, at least a part of the first heat sink and the second heat sink, the first bonding wire, the second bonding wire, the island, and a part of the control terminal including the passive component mounting portion, wherein; a part of the single lead frame is bent with respect to a remaining part of the single lead frame such that a surface of the island on which the second semiconductor chip is mounted is located closer to the first heat sink side surface of the resin molding at the rear surface than a surface of the first heat sink on which the first semiconductor chip is mounted and the passive component mounting portion of the control terminal; and the passive component is mounted on the passive component mounting portion of the control terminal at the one surface. - View Dependent Claims (2, 3, 4)
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5. A method for manufacturing a semiconductor device, the semiconductor device including:
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a lead frame that includes one surface and a rear surface opposite to the one surface, and further includes a first heat sink, an island, and a control terminal, the island and the control terminal being separated from the first heat sink; a first semiconductor chip that includes a first main electrode arranged at a facing surface of the first semiconductor chip facing the rear surface, and further includes a control electrode and a second main electrode, the second main electrode paired with the first main electrode, the control electrode and the second main electrode being arranged at a surface of the first semiconductor chip opposite to the facing surface, the first main electrode being connected to the first heat sink through solder; a second heat sink arranged opposed to the surface of the first semiconductor chip at which the control electrode is arranged, the second heat sink being connected to the second main electrode through solder; a second semiconductor chip fixed to the island at the rear surface to control driving of the first semiconductor chip, the second semiconductor chip connected to the control electrode through a first bonding wire, and connected to the control terminal through a second bonding wire; a passive component mounted on a passive component mounting portion of the control terminal through a bonding material; and a resin molding that includes a front surface at the first heat sink side, and a rear surface at the second heat sink side in a lamination direction of the first heat sink, the second heat sink, and the first semiconductor chip, the resin molding integrally sealing the first semiconductor chip, the second semiconductor chip, the passive component, at least a part of the first heat sink and the second heat sink, the first bonding wire, the second bonding wire, the island, and a part of the control terminal including the passive component mounting portion, the method comprising; using the lead frame, which is bent, such that a surface of the island on which the second semiconductor chip is mounted is located closer to the first heat sink side front surface of the resin molding at the rear surface than a surface of the first heat sink on which the first semiconductor chip is mounted and the passive component mounting portion of the control terminal; forming a connection body that integrates the lead frame and the first semiconductor chip by reflow of the solder between the first heat sink and the first semiconductor chip, and fixing the second semiconductor chip at the island; connecting the control electrode and the second semiconductor chip through the first bonding wire after fixing the second semiconductor chip, and further connecting the second semiconductor chip and the control terminal through the second bonding wire; reversing the connection body and positioning the reversed connection body at the second heat sink after connecting the second semiconductor chip through the first bonding wire and the second bonding wire, carrying out reflow of the solder between the second heat sink and the connection body, and mounting the passive component on the passive component mounting portion of the control terminal at the one surface through the bonding material; and molding the resin molding after mounting the passive component. - View Dependent Claims (6, 7)
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Specification