Wire bonding method and apparatus for electromagnetic interference shielding
First Claim
1. An apparatus for protection from electromagnetic interference, comprising:
- a platform having an upper surface and a lower surface opposite the upper surface and having a ground plane;
a first microelectronic device coupled to the upper surface of the platform;
first wire bond wires coupled to the ground plane, the first wire bond wires having a first pitch;
the first wire bond wires extending away from the upper surface of the platform with upper ends of the first wire bond wires extending above an upper surface of the first microelectronic device;
the first wire bond wires spaced apart from one another to provide a first fence-like perimeter to provide a first interference shielding cage;
a first conductive layer coupled to at least a subset of the upper ends of the first wire bond wires for electrical conductivity to provide a first conductive shielding layer to cover the first interference shielding cage;
a second microelectronic device coupled to the platform and located outside of the first interference shielding cage;
second wire bond wires coupled to the ground plane with a second pitch;
the second wire bond wires extending away from the upper surface of the platform with upper ends of the second wire bond wires being above an upper surface of the second microelectronic device and the upper ends of the first wire bond wires;
the second wire bond wires spaced apart from one another to provide a second fence-like perimeter to provide a second interference shielding cage;
the first perimeter being within the second perimeter;
a second conductive layer coupled to at least a subset of the upper ends of the second wire bond wires for electrical conductivity to at least provide a shield cover over the first interference shielding cage; and
the second conductive layer overlapping the first conductive layer for having the first interference shielding cage within the second interference shielding cage.
3 Assignments
0 Petitions
Accused Products
Abstract
Apparatuses relating generally to a microelectronic package having protection from electromagnetic interference are disclosed. In an apparatus thereof, a platform has an upper surface and a lower surface opposite the upper surface and has a ground plane. A microelectronic device is coupled to the upper surface of the platform. Wire bond wires are coupled to the ground plane with a pitch. The wire bond wires extend away from the upper surface of the platform with upper ends of the wire bond wires extending above an upper surface of the microelectronic device. The wire bond wires are spaced apart from one another to provide a fence-like perimeter to provide an interference shielding cage. A conductive layer is coupled to at least a subset of the upper ends of the wire bond wires for electrical conductivity to provide a conductive shielding layer to cover the interference shielding cage.
782 Citations
20 Claims
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1. An apparatus for protection from electromagnetic interference, comprising:
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a platform having an upper surface and a lower surface opposite the upper surface and having a ground plane; a first microelectronic device coupled to the upper surface of the platform; first wire bond wires coupled to the ground plane, the first wire bond wires having a first pitch; the first wire bond wires extending away from the upper surface of the platform with upper ends of the first wire bond wires extending above an upper surface of the first microelectronic device; the first wire bond wires spaced apart from one another to provide a first fence-like perimeter to provide a first interference shielding cage; a first conductive layer coupled to at least a subset of the upper ends of the first wire bond wires for electrical conductivity to provide a first conductive shielding layer to cover the first interference shielding cage; a second microelectronic device coupled to the platform and located outside of the first interference shielding cage; second wire bond wires coupled to the ground plane with a second pitch; the second wire bond wires extending away from the upper surface of the platform with upper ends of the second wire bond wires being above an upper surface of the second microelectronic device and the upper ends of the first wire bond wires; the second wire bond wires spaced apart from one another to provide a second fence-like perimeter to provide a second interference shielding cage; the first perimeter being within the second perimeter; a second conductive layer coupled to at least a subset of the upper ends of the second wire bond wires for electrical conductivity to at least provide a shield cover over the first interference shielding cage; and the second conductive layer overlapping the first conductive layer for having the first interference shielding cage within the second interference shielding cage. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16)
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17. A method for protection from electromagnetic interference, comprising:
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obtaining a platform having an upper surface and a lower surface opposite the upper surface and having a ground plane; coupling a microelectronic device to the upper surface of the platform; bonding wire bond wires to the ground plane, the wire bond wires having a pitch; the wire bond wires extending away from the upper surface of the platform with upper ends of the wire bond wires being above an upper surface of the microelectronic device; the wire bond wires spaced apart from one another to provide a fence-like perimeter to provide an interference shielding cage; depositing a molding layer over the upper surface of the platform; and forming a conductive layer coupled to at least a subset of the upper ends of the wire bond wires to provide a conductive shielding layer for electrical conductivity to cover the interference shielding cage; wherein the microelectronic device is a first microelectronic device, the apparatus further comprising a second microelectronic device coupled to the platform and located outside of the interference shielding cage; wherein the wire bond wires having the pitch are first wire bond wires having a first pitch, wherein the interference shielding cage is a first interference shielding cage having a first perimeter, and wherein the conductive layer is a first conductive layer, the method further comprising; bonding second wire bond wires to the ground plane with a second pitch; the second wire bond wires extending away from the upper surface of the platform with upper ends of the second wire bond wires being above an upper surface of the second microelectronic device and the upper ends of the first wire bond wires; the second wire bond wires spaced apart from one another to provide a second fence-like perimeter to provide a second interference shielding cage; the first perimeter being within the second perimeter; and forming a second conductive layer coupled to at least a subset of the upper ends of the second wire bond wires for electrical conductivity to at least provide a shield cover over the first interference shielding cage and the second interference shielding cage including overlapping the first conductive layer for having the first interference shielding cage within the second interference shielding cage. - View Dependent Claims (18, 19, 20)
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Specification