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Wire bonding method and apparatus for electromagnetic interference shielding

  • US 9,935,075 B2
  • Filed: 08/16/2016
  • Issued: 04/03/2018
  • Est. Priority Date: 07/29/2016
  • Status: Active Grant
First Claim
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1. An apparatus for protection from electromagnetic interference, comprising:

  • a platform having an upper surface and a lower surface opposite the upper surface and having a ground plane;

    a first microelectronic device coupled to the upper surface of the platform;

    first wire bond wires coupled to the ground plane, the first wire bond wires having a first pitch;

    the first wire bond wires extending away from the upper surface of the platform with upper ends of the first wire bond wires extending above an upper surface of the first microelectronic device;

    the first wire bond wires spaced apart from one another to provide a first fence-like perimeter to provide a first interference shielding cage;

    a first conductive layer coupled to at least a subset of the upper ends of the first wire bond wires for electrical conductivity to provide a first conductive shielding layer to cover the first interference shielding cage;

    a second microelectronic device coupled to the platform and located outside of the first interference shielding cage;

    second wire bond wires coupled to the ground plane with a second pitch;

    the second wire bond wires extending away from the upper surface of the platform with upper ends of the second wire bond wires being above an upper surface of the second microelectronic device and the upper ends of the first wire bond wires;

    the second wire bond wires spaced apart from one another to provide a second fence-like perimeter to provide a second interference shielding cage;

    the first perimeter being within the second perimeter;

    a second conductive layer coupled to at least a subset of the upper ends of the second wire bond wires for electrical conductivity to at least provide a shield cover over the first interference shielding cage; and

    the second conductive layer overlapping the first conductive layer for having the first interference shielding cage within the second interference shielding cage.

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