Packaging optoelectronic components and CMOS circuitry using silicon-on-insulator substrates for photonics applications
First Claim
1. A package structure, comprising:
- a photonics package comprising;
a first integrated circuit chip comprising active circuitry, an insulating layer, an active silicon layer disposed adjacent to the insulating layer, and a BEOL (back-end-of-line) structure formed over the active silicon layer;
an integrated optical waveguide structure patterned from the active silicon layer of the first integrated circuit chip;
an optoelectronics device mounted on the insulating layer of the first integrated circuit chip in alignment with at least a portion of the integrated optical waveguide structure, wherein the optoelectronics device is coupled to the active circuitry of the first integrated circuit chip; and
an interposer bonded to the BEOL structure of the first integrated circuit chip, the interposer comprising at least one substrate having a plurality of conductive through vias and wiring to provide electrical connections to the BEOL structure;
a second integrated circuit chip coupled to the photonics package by flip-chip bonding the interposer of the photonics package to an active surface of the second integrated circuit chip, wherein the second integrated circuit chip comprises a processor coupled to the active circuitry of the first integrated circuit chip;
a package interposer comprising a first side and a second side opposite the first side, wherein the second integrated circuit is mounted to the first side of the package interposer with the photonics package disposed within a hole formed through the package interposer from the first side of the package interposer to the second side of the package interposer; and
an application board, wherein the second side of the package interposer is mounted to the application board.
1 Assignment
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Accused Products
Abstract
Package structures and methods are provided to integrate optoelectronic and CMOS devices using SOI semiconductor substrates for photonics applications. For example, a package structure includes an integrated circuit (IC) chip, and an optoelectronics device and interposer mounted to the IC chip. The IC chip includes a SOI substrate having a buried oxide layer, an active silicon layer disposed adjacent to the buried oxide layer, and a BEOL structure formed over the active silicon layer. An optical waveguide structure is patterned from the active silicon layer of the IC chip. The optoelectronics device is mounted on the buried oxide layer in alignment with a portion of the optical waveguide structure to enable direct or adiabatic coupling between the optoelectronics device and the optical waveguide structure. The interposer is bonded to the BEOL structure, and includes at least one substrate having conductive vias and wiring to provide electrical connections to the BEOL structure.
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Citations
19 Claims
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1. A package structure, comprising:
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a photonics package comprising; a first integrated circuit chip comprising active circuitry, an insulating layer, an active silicon layer disposed adjacent to the insulating layer, and a BEOL (back-end-of-line) structure formed over the active silicon layer; an integrated optical waveguide structure patterned from the active silicon layer of the first integrated circuit chip; an optoelectronics device mounted on the insulating layer of the first integrated circuit chip in alignment with at least a portion of the integrated optical waveguide structure, wherein the optoelectronics device is coupled to the active circuitry of the first integrated circuit chip; and an interposer bonded to the BEOL structure of the first integrated circuit chip, the interposer comprising at least one substrate having a plurality of conductive through vias and wiring to provide electrical connections to the BEOL structure; a second integrated circuit chip coupled to the photonics package by flip-chip bonding the interposer of the photonics package to an active surface of the second integrated circuit chip, wherein the second integrated circuit chip comprises a processor coupled to the active circuitry of the first integrated circuit chip; a package interposer comprising a first side and a second side opposite the first side, wherein the second integrated circuit is mounted to the first side of the package interposer with the photonics package disposed within a hole formed through the package interposer from the first side of the package interposer to the second side of the package interposer; and an application board, wherein the second side of the package interposer is mounted to the application board. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19)
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Specification