System-in-package image sensor

• US 9,935,144 B1
• Filed: 11/28/2016
• Issued: 04/03/2018
• Est. Priority Date: 11/28/2016
• Status: Active Grant

• Current Assignee: Omnivision Technologies Incorporated (Will Semiconductor Co., Ltd. Shanghai)
• Original Assignee: Omnivision Technologies Incorporated (Will Semiconductor Co., Ltd. Shanghai)
• Inventors: Lin, Wei-Feng, Huang, Chi-Chih, Li, En-Chi
• Primary Examiner(s): Ha, Nathan W
• Application Number:
  US15/362,408
• Time in Patent Office: 491 Days
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 27/14618 Containers
• CPC Class Codes: H01L 27/14627 Microlenses
• CPC Class Codes: H01L 27/14634 Assemblies, i.e. Hybrid structures
• CPC Class Codes: H01L 27/14636 Interconnect structures
• CPC Class Codes: H01L 27/1469 Assemblies, i.e. hybrid integration
• CPC Class Codes: H01L 2924/19105 in a side-by-side arrangement on a common die mounting substrate

Abstract

An image sensor package includes a ceramic substrate with a cavity disposed in the ceramic substrate. A glass layer is adhered to the ceramic substrate and encloses the cavity in the ceramic substrate. An image sensor is disposed in the cavity between the glass layer and the ceramic substrate to electrically isolate the image sensor. An image sensor processor is disposed in the cavity and electrically coupled to the image sensor to receive image data from the image sensor.

Claims

1. An image sensor package, comprising:

a ceramic substrate with a cavity disposed in the ceramic substrate;

a glass layer adhered to the ceramic substrate and enclosing the cavity in the ceramic substrate;

an image sensor disposed in the cavity between the glass layer and the ceramic substrate to electrically isolate the image sensor;

an image sensor processor disposed in the cavity and electrically coupled to the image sensor to receive image data from the image sensor;

an application-specific integrated circuit disposed in the cavity in the ceramic substrate, and coupled to at least one of the image sensor or the image sensor processor;

ledges disposed in the cavity of the ceramic substrate; and

an interposer disposed on the ledges that spans a gap between the ledges, wherein the image sensor, the image sensor processor, and the application-specific integrated circuit are disposed on the interposer.

2. The image sensor package of claim 1, wherein the glass layer is disposed proximate to an illuminated side of the image sensor, and wherein the glass layer is glued to elevated portions of the ceramic substrate.

3. The image sensor package of the claim 2, wherein the image sensor includes a plurality of microlenses disposed on an illuminated surface of the image sensor and disposed between the glass layer and the image sensor.

4. The image sensor package of claim 1, wherein the image sensor and the image sensor processor are disposed between the glass layer and the interposer, and wherein the application-specific integrated circuit is disposed between the ceramic substrate and the interposer.

5. The image sensor package of claim 4, wherein the interposer includes electrical interconnects to couple the image sensor to the image sensor processor and the application-specific integrated circuit, and wherein the interposer is attached to the ledges.

6. The image sensor package of claim 1, wherein the image sensor package is included in a car that is at least in part autonomous.

7. An image sensor package, comprising:

a ceramic substrate with a cavity disposed in the ceramic substrate;

a glass layer adhered to the ceramic substrate and enclosing the cavity in the ceramic substrate;

an image sensor disposed in the cavity between the glass layer and the ceramic substrate to electrically isolate the image sensor;

an image sensor processor disposed in the cavity and electrically coupled to the image sensor to receive image data from the image sensor; and

ledges disposed in the cavity of the ceramic substrate, wherein the image sensor is disposed on the ledges and spans a gap between the ledges, and wherein the image sensor processor is disposed on the ceramic substrate between the image sensor and the ceramic substrate, and wherein the image sensor is disposed between the image sensor processor and the glass layer.

8. The image sensor package of claim 7, further comprising contact pads disposed on the ceramic substrate, wherein the image sensor and the image sensor processor are wire bonded to the contact pads.