×

System-in-package image sensor

  • US 9,935,144 B1
  • Filed: 11/28/2016
  • Issued: 04/03/2018
  • Est. Priority Date: 11/28/2016
  • Status: Active Grant
First Claim
Patent Images

1. An image sensor package, comprising:

  • a ceramic substrate with a cavity disposed in the ceramic substrate;

    a glass layer adhered to the ceramic substrate and enclosing the cavity in the ceramic substrate;

    an image sensor disposed in the cavity between the glass layer and the ceramic substrate to electrically isolate the image sensor;

    an image sensor processor disposed in the cavity and electrically coupled to the image sensor to receive image data from the image sensor;

    an application-specific integrated circuit disposed in the cavity in the ceramic substrate, and coupled to at least one of the image sensor or the image sensor processor;

    ledges disposed in the cavity of the ceramic substrate; and

    an interposer disposed on the ledges that spans a gap between the ledges, wherein the image sensor, the image sensor processor, and the application-specific integrated circuit are disposed on the interposer.

View all claims
  • 1 Assignment
Timeline View
Assignment View
    ×
    ×