Environmental sensitive element package and encapsulation method thereof
First Claim
1. An environmental sensitive element package, comprising:
- a first substrate;
a second substrate disposed above the first substrate;
a barrier structure between the first substrate and the second substrate;
an environmental sensitive element disposed on the first substrate and between the first substrate and the second substrate, wherein the barrier structure is distributed outside the environmental sensitive element;
a flexible buffer layer disposed on the environmental sensitive element and made of small molecular compounds, oligomers, or organic-inorganic co-steaming materials; and
an adhesive disposed between the first substrate and the second substrate and encapsulating the environmental sensitive element, the barrier structure, and the flexible buffer layer, wherein an outgassing of the adhesive under 120 degrees Celsius is less than or equal to 5×
10−
7 gram/cm2, wherein an outgassing of the flexible buffer layer under 120 degrees Celsius is less than the outgassing of the adhesive under 120 degrees Celsius, and the outgassing of the flexible buffer layer under 120 degrees Celsius is less than 5×
10−
8 gram/cm2.
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Accused Products
Abstract
A package of environmental sensitive element including a first substrate, a second substrate, a barrier structure between the first substrate and the second substrate, an environmental sensitive element and an adhesive is provided. The second substrate is disposed above the first substrate. The environmental sensitive element is disposed on the first substrate and located between the first substrate and the second substrate. The barrier structure is distributed outside the environmental sensitive element. The adhesive is disposed between the first substrate and the second substrate and encapsulates the environmental sensitive element and the barrier structure, wherein an outgassing of the adhesive under 120 degrees Celsius is less than or equal to 5×10−7 gram/cm2.
53 Citations
14 Claims
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1. An environmental sensitive element package, comprising:
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a first substrate; a second substrate disposed above the first substrate; a barrier structure between the first substrate and the second substrate; an environmental sensitive element disposed on the first substrate and between the first substrate and the second substrate, wherein the barrier structure is distributed outside the environmental sensitive element; a flexible buffer layer disposed on the environmental sensitive element and made of small molecular compounds, oligomers, or organic-inorganic co-steaming materials; and an adhesive disposed between the first substrate and the second substrate and encapsulating the environmental sensitive element, the barrier structure, and the flexible buffer layer, wherein an outgassing of the adhesive under 120 degrees Celsius is less than or equal to 5×
10−
7 gram/cm2, wherein an outgassing of the flexible buffer layer under 120 degrees Celsius is less than the outgassing of the adhesive under 120 degrees Celsius, and the outgassing of the flexible buffer layer under 120 degrees Celsius is less than 5×
10−
8 gram/cm2. - View Dependent Claims (2, 3, 4, 5, 6, 7)
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8. An environmental sensitive element package, comprising:
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a first substrate; a second substrate disposed above the first substrate; a barrier structure between the first substrate and the second substrate; an environmental sensitive element disposed on the first substrate and between the first substrate and the second substrate, wherein the barrier structure is distributed outside the environmental sensitive element; a flexible buffer layer disposed on the environmental sensitive element and made of small molecular compounds, oligomers, or organic-inorganic co-steaming materials; and an adhesive disposed between the first substrate and the second substrate and encapsulating the environmental sensitive element, the barrier structure, and the flexible buffer layer, wherein an outgassing of the adhesive under 120 degrees Celsius is less than or equal to 5×
10−
7 gram/cm2, wherein an outgassing of the flexible buffer layer under 120 degrees Celsius is less than the outgassing of the adhesive under 120 degrees Celsius, and the outgassing of the flexible buffer layer under 120 degrees Celsius is less than 5×
10−
8 gram/cm2, wherein the outgassing of the adhesive increases gradually from a first side of the adhesive near the environmental sensitive element to a second side of the adhesive opposite to the first side of the adhesive. - View Dependent Claims (9, 10, 11, 12, 13, 14)
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Specification