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Environmental sensitive element package and encapsulation method thereof

  • US 9,935,289 B2
  • Filed: 01/22/2016
  • Issued: 04/03/2018
  • Est. Priority Date: 09/10/2010
  • Status: Active Grant
First Claim
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1. An environmental sensitive element package, comprising:

  • a first substrate;

    a second substrate disposed above the first substrate;

    a barrier structure between the first substrate and the second substrate;

    an environmental sensitive element disposed on the first substrate and between the first substrate and the second substrate, wherein the barrier structure is distributed outside the environmental sensitive element;

    a flexible buffer layer disposed on the environmental sensitive element and made of small molecular compounds, oligomers, or organic-inorganic co-steaming materials; and

    an adhesive disposed between the first substrate and the second substrate and encapsulating the environmental sensitive element, the barrier structure, and the flexible buffer layer, wherein an outgassing of the adhesive under 120 degrees Celsius is less than or equal to 5×

    10

    7
    gram/cm2, wherein an outgassing of the flexible buffer layer under 120 degrees Celsius is less than the outgassing of the adhesive under 120 degrees Celsius, and the outgassing of the flexible buffer layer under 120 degrees Celsius is less than 5×

    10

    8
    gram/cm2.

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