High-frequency module
First Claim
Patent Images
1. A high-frequency module comprising:
- a first external connection terminal;
a second external connection terminal;
a filter unit connected between the first external connection terminal and the second external connection terminal;
a matching circuit connected between at least one of the first external connection terminal and the second external connection terminal and the filter unit;
an inductor connected between a ground and the filter unit;
a filter substrate including IDT electrodes that define the filter unit and that are provided on a first principal surface of the filter substrate;
a cover layer positioned in an opposing relation to the first principal surface of the filter substrate with a spacing defined therebetween;
a connection electrode projecting from the first principal surface and penetrating through the cover layer; and
a multilayer substrate including the matching circuit mounted thereto or located therein;
whereinthe filter unit includes;
a first series connection terminal connected to the first external connection terminal;
a second series connection terminal connected to the second external connection terminal;
a plurality of series-connected filter elements connected in series between the first series connection terminal and the second series connection terminal through a plurality of connection lines;
a shunt connection terminal connected to the ground through the inductor and connected to one of the plurality of connection lines; and
a shunt-connected filter element connected between one of the plurality of connection lines to which the shunt connection terminal is connected and the shunt connection terminal;
the inductor and the matching circuit are inductively or capacitively coupled to each other;
the first principal surface faces a mount surface of the multilayer substrate;
the filter substrate is connected to the multilayer substrate through the connection electrode;
the matching circuit includes a surface mount circuit element that is mounted to the mount surface of the multilayer substrate;
the inductor is mounted to the mount surface of the multilayer substrate or located inside of the multilayer substrate;
the surface mount circuit element and the inductor are arranged close to each other; and
a shortest distance between the connection lines located on the filter substrate and the inductor is longer than a shortest distance between the surface mount circuit element and the inductor.
1 Assignment
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Accused Products
Abstract
A filter unit of a high-frequency module includes a plurality of SAW resonators connected in series between a first series connection terminal and a second series connection terminal, first shunt connection terminals, a second shunt connection terminal, and a plurality of SAW resonators. A connection line interconnecting the SAW resonators is connected to the first shunt connection terminal through one of the SAW resonators. The first shunt connection terminal is connected to a ground through an inductor. A matching circuit is connected between the second series connection terminal and a second external connection terminal. The matching circuit is inductively or capacitively coupled to the inductor.
11 Citations
15 Claims
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1. A high-frequency module comprising:
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a first external connection terminal; a second external connection terminal; a filter unit connected between the first external connection terminal and the second external connection terminal; a matching circuit connected between at least one of the first external connection terminal and the second external connection terminal and the filter unit; an inductor connected between a ground and the filter unit; a filter substrate including IDT electrodes that define the filter unit and that are provided on a first principal surface of the filter substrate; a cover layer positioned in an opposing relation to the first principal surface of the filter substrate with a spacing defined therebetween; a connection electrode projecting from the first principal surface and penetrating through the cover layer; and a multilayer substrate including the matching circuit mounted thereto or located therein;
whereinthe filter unit includes; a first series connection terminal connected to the first external connection terminal; a second series connection terminal connected to the second external connection terminal; a plurality of series-connected filter elements connected in series between the first series connection terminal and the second series connection terminal through a plurality of connection lines; a shunt connection terminal connected to the ground through the inductor and connected to one of the plurality of connection lines; and a shunt-connected filter element connected between one of the plurality of connection lines to which the shunt connection terminal is connected and the shunt connection terminal; the inductor and the matching circuit are inductively or capacitively coupled to each other; the first principal surface faces a mount surface of the multilayer substrate; the filter substrate is connected to the multilayer substrate through the connection electrode; the matching circuit includes a surface mount circuit element that is mounted to the mount surface of the multilayer substrate; the inductor is mounted to the mount surface of the multilayer substrate or located inside of the multilayer substrate; the surface mount circuit element and the inductor are arranged close to each other; and a shortest distance between the connection lines located on the filter substrate and the inductor is longer than a shortest distance between the surface mount circuit element and the inductor. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9)
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10. A high-frequency module comprising:
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a first external connection terminal; a second external connection terminal; a filter unit connected between the first external connection terminal and the second external connection terminal; a matching circuit connected between at least one of the first external connection terminal and the second external connection terminal and the filter unit; an inductor connected between a ground and the filter unit; a filter substrate including IDT electrodes that define the filter unit and that are provided on a first principal surface of the filter substrate; a cover layer positioned in an opposing relation to the first principal surface of the filter substrate with a spacing defined therebetween; a connection electrode projecting from the first principal surface and penetrating through the cover layer; and a multilayer substrate including the matching circuit mounted thereto or located therein;
whereinthe filter unit includes; a first series connection terminal connected to the first external connection terminal; a second series connection terminal connected to the second external connection terminal; a plurality of series-connected filter elements connected in series between the first series connection terminal and the second series connection terminal through a plurality of connection lines; a shunt connection terminal connected to the ground through the inductor and connected to one of the plurality of connection lines; and a shunt-connected filter element connected between one of the plurality of connection lines to which the shunt connection terminal is connected and the shunt connection terminal; the inductor and the matching circuit are inductively or capacitively coupled to each other; the first principal surface faces a mount surface of the multilayer substrate; the filter substrate is connected to the multilayer substrate through the connection electrode; the matching circuit includes a surface mount circuit element that is mounted to a mount surface of the multilayer substrate; the inductor is located inside the cover layer; and the surface mount circuit element and the inductor are arranged close to each other. - View Dependent Claims (11)
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12. A high-frequency module comprising:
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a first external connection terminal; a second external connection terminal; a filter unit connected between the first external connection terminal and the second external connection terminal; a matching circuit connected between at least one of the first external connection terminal and the second external connection terminal and the filter unit; an inductor connected between a ground and the filter unit; a filter substrate including IDT electrodes that define the filter unit and that are provided on a first principal surface of the filter substrate; a cover layer positioned in an opposing relation to the first principal surface of the filter substrate with a spacing defined therebetween; a connection electrode projecting from the first principal surface and penetrating through the cover layer; and a multilayer substrate including the matching circuit mounted thereto or located therein;
whereinthe filter unit includes; a first series connection terminal connected to the first external connection terminal; a second series connection terminal connected to the second external connection terminal; a plurality of series-connected filter elements connected in series between the first series connection terminal and the second series connection terminal through a plurality of connection lines; a shunt connection terminal connected to the ground through the inductor and connected to one of the plurality of connection lines; and a shunt-connected filter element connected between one of the plurality of connection lines to which the shunt connection terminal is connected and the shunt connection terminal; the inductor and the matching circuit are inductively or capacitively coupled to each other; the first principal surface faces a mount surface of the multilayer substrate; the filter substrate is connected to the multilayer substrate through the connection electrode; the matching circuit includes a surface mount circuit element that is mounted to the mount surface of the multilayer substrate; the inductor is mounted to the mount surface of the multilayer substrate or located inside of the multilayer substrate; the surface mount circuit element and the inductor are arranged close to each other; and a shortest distance between the connection lines located on the filter substrate and the surface mount circuit element is longer than a shortest distance between the surface mount circuit element and the inductor.
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13. A high-frequency module comprising:
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a first external connection terminal; a second external connection terminal; a filter unit connected between the first external connection terminal and the second external connection terminal; a matching circuit connected between at least one of the first external connection terminal and the second external connection terminal and the filter unit; an inductor connected between a ground and the filter unit; a filter substrate including IDT electrodes that define the filter unit and that are provided on a first principal surface of the filter substrate; a cover layer positioned in an opposing relation to the first principal surface of the filter substrate with a spacing defined therebetween; a connection electrode projecting from the first principal surface and penetrating through the cover layer; and a multilayer substrate including the matching circuit mounted thereto or located therein;
whereinthe filter unit includes; a first series connection terminal connected to the first external connection terminal; a second series connection terminal connected to the second external connection terminal; a plurality of series-connected filter elements connected in series between the first series connection terminal and the second series connection terminal through a plurality of connection lines; a shunt connection terminal connected to the ground through the inductor and connected to one of the plurality of connection lines; and a shunt-connected filter element connected between one of the plurality of connection lines to which the shunt connection terminal is connected and the shunt connection terminal; the inductor and the matching circuit are inductively or capacitively coupled to each other; the first principal surface faces a mount surface of the multilayer substrate; the filter substrate is connected to the multilayer substrate through the connection electrode; the matching circuit includes a surface mount circuit element that is mounted to the mount surface of the multilayer substrate; the inductor is mounted to the mount surface of the multilayer substrate or located inside of the multilayer substrate; the surface mount circuit element and the inductor are arranged close to each other; and the inductor generates a magnetic field perpendicular or substantially perpendicular to magnetic fields that are generated from the connection lines located on the filter substrate.
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14. A high-frequency module comprising:
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a first external connection terminal; a second external connection terminal; a filter unit connected between the first external connection terminal and the second external connection terminal; a matching circuit connected between at least one of the first external connection terminal and the second external connection terminal and the filter unit; an inductor connected between a ground and the filter unit; a filter substrate including IDT electrodes that define the filter unit and that are provided on a first principal surface of the filter substrate; a cover layer positioned in an opposing relation to the first principal surface of the filter substrate with a spacing defined therebetween; a connection electrode projecting from the first principal surface and penetrating through the cover layer; and a multilayer substrate including the matching circuit mounted thereto or located therein;
whereinthe filter unit includes; a first series connection terminal connected to the first external connection terminal; a second series connection terminal connected to the second external connection terminal; a plurality of series-connected filter elements connected in series between the first series connection terminal and the second series connection terminal through a plurality of connection lines; a shunt connection terminal connected to the ground through the inductor and connected to one of the plurality of connection lines; and a shunt-connected filter element connected between one of the plurality of connection lines to which the shunt connection terminal is connected and the shunt connection terminal; the inductor and the matching circuit are inductively or capacitively coupled to each other; the first principal surface faces a mount surface of the multilayer substrate; the filter substrate is connected to the multilayer substrate through the connection electrode; the matching circuit includes a surface mount circuit element that is mounted to the mount surface of the multilayer substrate; the inductor is mounted to the mount surface of the multilayer substrate or located inside of the multilayer substrate; the surface mount circuit element and the inductor are arranged close to each other; and the inductor is arranged close to a predetermined side of the filter substrate, the predetermined side being different from a side of the filter substrate positioned closest to the connection lines in the filter substrate.
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15. A high-frequency module comprising:
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a first external connection terminal; a second external connection terminal; a filter unit connected between the first external connection terminal and the second external connection terminal; a matching circuit connected between at least one of the first external connection terminal and the second external connection terminal and the filter unit; an inductor connected between a ground and the filter unit; a filter substrate including IDT electrodes that define the filter unit and that are provided on a first principal surface of the filter substrate; a cover layer positioned in an opposing relation to the first principal surface of the filter substrate with a spacing defined therebetween; a connection electrode projecting from the first principal surface and penetrating through the cover layer; and a multilayer substrate including the matching circuit mounted thereto or located therein;
whereinthe filter unit includes; a first series connection terminal connected to the first external connection terminal; a second series connection terminal connected to the second external connection terminal; a plurality of series-connected filter elements connected in series between the first series connection terminal and the second series connection terminal through a plurality of connection lines; a shunt connection terminal connected to the ground through the inductor and connected to one of the plurality of connection lines; and a shunt-connected filter element connected between one of the plurality of connection lines to which the shunt connection terminal is connected and the shunt connection terminal; the inductor and the matching circuit are inductively or capacitively coupled to each other; the first principal surface faces a mount surface of the multilayer substrate; the filter substrate is connected to the multilayer substrate through the connection electrode; the matching circuit includes a surface mount circuit element that is mounted to the mount surface of the multilayer substrate; the inductor is mounted to the mount surface of the multilayer substrate or located inside of the multilayer substrate; the surface mount circuit element and the inductor are arranged close to each other; the matching circuit includes; a rectangular or substantially rectangular parallelepiped casing; and a spiral conductor located inside the casing and having a rectangular or substantially rectangular outer peripheral shape when looking at the high-frequency module in a plan view; and the matching circuit is arranged such that a long side of the casing is close to the inductor.
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Specification
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Current AssigneeMurata Manufacturing Co Limited
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Original AssigneeMurata Manufacturing Co Limited
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InventorsTakeuchi, Morio, Mizoguchi, Shinya
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Primary Examiner(s)Pascal, Robert J
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Assistant Examiner(s)SALAZAR JR, JORGE L
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Application NumberUS15/016,865Publication NumberTime in Patent Office788 DaysField of Search333133, 333187, 333188, 333193-196US Class CurrentCPC Class CodesH03H 9/0009 using surface acoustic wave...H03H 9/0061 the balanced terminals bein...H03H 9/1042 the enclosure being defined...H03H 9/52 Electric coupling meansH03H 9/605 consisting of a ladder conf...H03H 9/64 using surface acoustic wavesH03H 9/6433 Coupled resonator filtersH03H 9/6483 Ladder SAW filtersH03H 9/725 Duplexers
