Low profile packaging and assembly of a power conversion system in modular form
First Claim
1. A low profile power conversion system module comprising:
- an embedded power substrate, the embedded power substrate being thin planar-shaped;
a first magnetic component disposed on a first surface of the embedded power substrate, the magnetic component being thin planar-shaped;
an electrical component disposed on a second surface opposite the first surface of the embedded power substrate, wherein the electrical component comprises a second magnetic component, a printed circuit board, or packaging containing passive or active components;
an embedded power silicon disposed within the embedded power substrate and between the magnetic component and the electrical component; and
input/output terminals disposed on a side of the embedded power substrate, the input/output terminals configured to supply power and signal to the embedded power silicon, the electrical component, and the magnetic component.
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Accused Products
Abstract
Embedded PCB (printed circuit board) is used for the packaging and assembly of a low profile power conversion system module that can be employed in space constrained environment of small computer/electronic systems. The low profile power conversion system module includes an embedded PCB, a power silicon device embedded within the PCB, a magnetic component which is either embedded within the PCB or disposed on the PCB, and input/output terminals disposed on the side of the embedded PCB. The embedded PCB and the magnetic component are thin planar shaped to save vertical space. The low profile power conversion system module can be placed inside a cavity formed in the system PCB to save even more vertical space.
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Citations
20 Claims
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1. A low profile power conversion system module comprising:
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an embedded power substrate, the embedded power substrate being thin planar-shaped; a first magnetic component disposed on a first surface of the embedded power substrate, the magnetic component being thin planar-shaped; an electrical component disposed on a second surface opposite the first surface of the embedded power substrate, wherein the electrical component comprises a second magnetic component, a printed circuit board, or packaging containing passive or active components; an embedded power silicon disposed within the embedded power substrate and between the magnetic component and the electrical component; and input/output terminals disposed on a side of the embedded power substrate, the input/output terminals configured to supply power and signal to the embedded power silicon, the electrical component, and the magnetic component. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9)
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10. A method for using a low profile power conversion system module, the method comprising:
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providing the low profile power conversion system module, wherein the low profile power conversion system module comprises; an embedded power substrate, the embedded power substrate being thin planar-shaped, a first magnetic component disposed on a first surface of the embedded power substrate, the magnetic component being thin planar-shaped, an electrical component disposed on a second surface opposite the first surface of the embedded power substrate, wherein the electrical component comprises a second magnetic component, a printed circuit board, or packaging containing passive or active components, an embedded power silicon disposed within the embedded power substrate and between the magnetic component and the electrical component, and input/output terminals disposed on a side of the embedded power substrate, the input/output terminals configured to supply power and signal to the embedded power silicon, the electrical component, and the magnetic component; and configuring the low profile power conversion system module on a system PCB (printed circuit board). - View Dependent Claims (11, 12, 13, 14, 15, 16, 17)
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18. A power conversion device comprising:
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an embedded power substrate, the embedded power substrate being thin planar-shaped; a power silicon disposed within the embedded power substrate and surrounded by other components comprising; a magnetic component disposed within the embedded power substrate at one side of the power silicon, and an electrical component disposed within the embedded power substrate at an opposite side of the power silicon; and input/output terminals disposed on the side of the embedded power substrate, the input/output terminals configured to supply power and signal to at least the power silicon and the magnetic component and the electrical component. - View Dependent Claims (19, 20)
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Specification