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Three dimensional imaging utilizing stacked imager devices and associated methods

  • US 9,939,251 B2
  • Filed: 03/12/2014
  • Issued: 04/10/2018
  • Est. Priority Date: 03/15/2013
  • Status: Active Grant
First Claim
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1. An imaging system capable of deriving three dimensional information from a three dimensional subject, comprising:

  • a first imager array having a first light incident surface;

    a second imager array having a second light incident surface, the second imager array being coupled to the first imager array at a surface that is opposite the first light incident surface, the second light incident surface being oriented toward the first imager array and at least substantially uniformly spaced at a distance of from 2 microns to 150 microns from the first light incident surface;

    a system lens positioned to direct incident light along an optical pathway onto the first light incident surface, wherein the first imager array is operable to detect a first portion of the light passing along the optical pathway and to pass through a second portion of the light, wherein the second imager array is operable to detect at least a part of the second portion of light, and wherein the first portion of light and the second portion of light have at least one wavelength of from 500 nm to 1100 nm; and

    a computation module configured to receive first image data collected by the first imager array from the first portion of light and second image data collected by the second imager array from the second portion of light, wherein the computation module is operable to calculate distance data from the imaging system to the three dimensional subject based on a difference in at least one dimension of a first image pattern indicated by the first image data and the corresponding dimension of a second image pattern indicated by the second image data.

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