3DIC packages with heat dissipation structures

• US 9,941,251 B2
• Filed: 02/06/2017
• Issued: 04/10/2018
• Est. Priority Date: 08/02/2013
• Status: Active Grant

• Current Assignee: Taiwan Semiconductor Manufacturing Company Limited
• Original Assignee: Taiwan Semiconductor Manufacturing Company Limited
• Inventors: Hung, Wensen, Huang, Szu-Po, Chen, Kim Hong, Jeng, Shin-Puu
• Primary Examiner(s): GREEN, TELLY D
• Application Number:
  US15/425,399
• Publication Number:
  US 20170148767A1
• Time in Patent Office: 428 Days
• Field of Search: 257713, 257707, 257706, 257678, 257686, 257E23085, 257720, 438106, 438122, 438121
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/32245 the item being metallic
• CPC Class Codes: H01L 2224/73204 the bump connector being embedded into the layer connector
• CPC Class Codes: H01L 2224/73253 Bump and layer connectors
• CPC Class Codes: H01L 2224/92225 the second connecting process involving a layer connector
• CPC Class Codes: H01L 2225/06513 Bump or bump-like direct electrical connections between devices, e.g. flip-chip connection, solder bumps
• CPC Class Codes: H01L 2225/06517 Bump or bump-like direct electrical connections from device to substrate
• CPC Class Codes: H01L 2225/0652 Bump or bump-like direct electrical connections from substrate to substrate
• CPC Class Codes: H01L 2225/06541 Conductive via connections through the device, e.g. vertical interconnects, through silicon via [TSV]
• CPC Class Codes: H01L 2225/06568 the devices decreasing in size, e.g. pyramidical stack
• CPC Class Codes: H01L 2225/06589 Thermal management, e.g. cooling
• CPC Class Codes: H01L 23/34 Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements thermal treatment apparatus H01L21/00
• CPC Class Codes: H01L 23/3672 Foil-like cooling fins or heat sinks being part of lead-frames H01L23/49568
• CPC Class Codes: H01L 23/3675 characterised by the shape of the housing
• CPC Class Codes: H01L 23/42 Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
• CPC Class Codes: H01L 24/16 of an individual bump connector
• CPC Class Codes: H01L 24/32 of an individual layer connector
• CPC Class Codes: H01L 24/73 Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
• CPC Class Codes: H01L 24/92 Specific sequence of method steps
• CPC Class Codes: H01L 25/0652 : the devices being arranged next and on each other, i.e. mixed assemblies
• CPC Class Codes: H01L 25/0657 : Stacked arrangements of devices
• CPC Class Codes: H01L 25/50 : Multistep manufacturing processes of assemblies consisting of devices, each device being of a type provided for in group H01L27/00 or H01L29/00 H01L21/50 takes precedence
• CPC Class Codes: H01L 2924/00 : Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 : Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 2924/15311 : being a ball array, e.g. BGA

Abstract

A package includes a first die and a second die underlying the first die and in a same first die stack as the first die. The second die includes a first portion overlapped by the first die, and a second portion extending laterally beyond a respective edge of the first die. The package further includes a first Thermal Interface Material (TIM) over and contacting a top surface of the first die, a heat dissipating lid having a first bottom surface contacting the first TIM, a second TIM over and contacting the second portion of the second die, and a heat dissipating ring having a portion over and contacting the second TIM. The heat dissipating lid and the heat dissipating ring are discrete components, and at least one of the heat dissipating lid or the heat dissipating ring has a plurality of fins and a plurality of recesses separating the plurality of fins from each other.

Claims

1. A package comprising:

a first die;

a second die underlying the first die and in a same first die stack as the first die, wherein the second die comprises;

a first portion overlapped by the first die; and

a second portion extending laterally beyond a respective edge of the first die;

a first Thermal Interface Material (TIM) over and contacting a top surface of the first die;

a heat dissipating lid comprising a first bottom surface contacting the first TIM;

a second TIM over and contacting the second portion of the second die; and

a heat dissipating ring comprising a portion over and contacting the second TIM, wherein the heat dissipating lid and the heat dissipating ring are discrete components, and at least one of the heat dissipating lid or the heat dissipating ring comprises a plurality of fins and a plurality of recesses separating the plurality of fins from each other.

2. The package of claim 1, wherein the heat dissipating lid comprises the plurality of fins and the plurality of recesses.

3. The package of claim 2 further comprising an adhesive film, wherein a bottom surface of the heat dissipating lid and a top surface of the heat dissipating ring are adhered to opposite surfaces of the adhesive film.

4. The package of claim 3, wherein one of the plurality of recesses extends to a level lower than the adhesive film.

5. The package of claim 1, wherein top surfaces of the heat dissipating lid and the heat dissipating ring are coplanar with each other.

6. The package of claim 1, wherein the heat dissipating lid comprises the plurality of recesses, and the plurality of recesses comprises:

a first plurality of recesses extending to a first depth into the heat dissipating lid; and

a second plurality of recesses extending to a second depth into the heat dissipating lid, wherein the second depth is greater than the first depth.

7. The package of claim 6, wherein the first plurality of recesses overlaps the heat dissipating ring.

8. The package of claim 1, wherein the heat dissipating ring comprises the plurality of recesses, and the plurality of recesses comprises:

a first plurality of recesses extending to a first depth into the heat dissipating ring; and

a second plurality of recesses extending to a second depth into the heat dissipating ring, wherein the second depth is greater than the first depth.

9. A package comprising:

a die stack comprising a plurality of dies;

a die underlying and bonded to the die stack, wherein the die comprises;

a first portion overlapped by the die stack; and

a second portion not overlapped by the die stack;

a first Thermal Interface Material (TIM) over and contacting a top surface of the die stack;

a heat dissipating lid;

a second TIM over and contacting the second portion of the die; and

a heat dissipating ring having a portion encircling the heat dissipating lid, wherein a top surface of the heat dissipating lid and a top surface of the heat dissipating ring are coplanar with each other, and both the heat dissipating lid and the heat dissipating ring comprise fins and recesses separating the fins from each other.

10. The package of claim 9 further comprising an adhesive film, wherein the heat dissipating lid comprises:

a first portion over and contacting the first TIM; and

a second portion overlapping the second portion of the die, wherein the second portion of the heat dissipating lid is joined to a top surface of the heat dissipating ring through the adhesive film.

11. The package of claim 10, wherein the recesses in the heat dissipating lid comprises:

a first plurality of recesses overlapping the adhesive film; and

a second plurality of recesses vertically misaligned from, and extending to a level lower than, the adhesive film.

12. The package of claim 9, wherein the die comprises:

a high-power-consuming circuit; and

a low-power-consuming circuit consuming less power than the high-power-consuming circuit, wherein the high-power-consuming circuit is at least partially located in the second portion of the die.

13. The package of claim 9, wherein the heat dissipating lid and the heat dissipating ring are physically discrete components.

14. The package of claim 9 further comprising:

a package substrate underlying and bonded to the die; and

an additional adhesive film adhering a bottom surface of the heat dissipating ring to the package substrate.

15. The package of claim 14, wherein the recesses in the heat dissipating ring comprises:

a first plurality of recesses overlapping the additional adhesive film; and

a second plurality of recesses vertically misaligned from the additional adhesive film, wherein the second plurality of recesses is shallower than the first plurality of recesses.

16. A package comprising:

a package substrate;

a die overlying and bonded to the package substrate;

a heat dissipating lid overlapping the die;

a first Thermal Interface Material (TIM) over and contacting a top surface of the die; and

a heat dissipating ring encircling the heat dissipating lid, wherein the heat dissipating ring is joined to the die through the first TIM, and the heat dissipating ring comprises first fins and first recesses separating the first fins from each other, and bottoms of the first recesses are lower than the heat dissipating lid.

17. The package of claim 16 further comprising:

a second TIM; and

a die stack comprising a plurality of dies, wherein the die stack is over and bonded to the die, and a bottom surface of the heat dissipating lid is adhered to a top surface of the die stack through the second TIM.

18. The package of claim 17, wherein the heat dissipating lid comprises second fins and second recesses separating the second fins from each other, and the second recesses comprise:

deep recesses overlapping the die stack; and

shallow recesses shallower than the deep recesses, wherein the shallow recesses overlap a portion of the die not overlapped by the die stack.

19. The package of claim 17, wherein the die comprises:

a high-power-consuming circuit; and

a low-power-consuming circuit consuming less power than the high-power-consuming circuit, wherein the high-power-consuming circuit is at least partially located in a portion of the die not overlapped by the die stack.

20. The package of claim 16 further comprising an adhesive film contacting a bottom surface of the heat dissipating lid and a top surface of the heat dissipating ring.