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3DIC packages with heat dissipation structures

  • US 9,941,251 B2
  • Filed: 02/06/2017
  • Issued: 04/10/2018
  • Est. Priority Date: 08/02/2013
  • Status: Active Grant
First Claim
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1. A package comprising:

  • a first die;

    a second die underlying the first die and in a same first die stack as the first die, wherein the second die comprises;

    a first portion overlapped by the first die; and

    a second portion extending laterally beyond a respective edge of the first die;

    a first Thermal Interface Material (TIM) over and contacting a top surface of the first die;

    a heat dissipating lid comprising a first bottom surface contacting the first TIM;

    a second TIM over and contacting the second portion of the second die; and

    a heat dissipating ring comprising a portion over and contacting the second TIM, wherein the heat dissipating lid and the heat dissipating ring are discrete components, and at least one of the heat dissipating lid or the heat dissipating ring comprises a plurality of fins and a plurality of recesses separating the plurality of fins from each other.

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