Method of manufacturing a radio frequency identification device

• US 9,941,569 B2
• Filed: 06/14/2011
• Issued: 04/10/2018
• Est. Priority Date: 06/14/2010
• Status: Active Grant

• Current Assignee: Avery Dennison Retail Information Services LLC (Avery Dennison Corporation)
• Original Assignee: Avery Dennison Retail Information Services LLC (Avery Dennison Corporation)
• Inventors: Forster, Ian J., Oelsner, Christian K., Revels, Robert, Kingston, Benjamin, Cockerell, Peter, Howard, Normal
• Primary Examiner(s): KELLY, RAFFERTY D
• Application Number:
  US13/160,326
• Publication Number:
  US 20120061473A1
• Time in Patent Office: 2,492 Days
• Field of Search: 235492
• CPC Class Codes: B23K 26/364 for making a groove or trench, e.g. for scribing a break initiation groove
• CPC Class Codes: B32B 2305/10 Fibres of continuous length
• CPC Class Codes: B32B 2307/302 Conductive
• CPC Class Codes: B32B 2317/12 Paper, e.g. cardboard
• CPC Class Codes: B32B 2519/02 RFID tags
• CPC Class Codes: B32B 37/12 characterised by using adhesives
• CPC Class Codes: B32B 38/10 Removing layers, or parts of layers, mechanically or chemically
• CPC Class Codes: B32B 38/145 Printing
• CPC Class Codes: G06K 19/0723 the record carrier comprising an arrangement for non-contact communication, e.g. wireless communication circuits on transponder cards, non-contact smart cards or RFIDs
• CPC Class Codes: G06K 19/07718 the record carrier being manufactured in a continuous process, e.g. using endless rolls
• CPC Class Codes: G06K 19/07749 the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
• CPC Class Codes: G06K 19/0775 arrangements for connecting the integrated circuit to the antenna
• CPC Class Codes: G06K 19/07754 the connection being galvanic
• CPC Class Codes: G06K 19/07786 the antenna being of the HF type, such as a dipole
• CPC Class Codes: H01P 11/003 Manufacturing lines with conductors on a substrate, e.g. strip lines, slot lines
• CPC Class Codes: Y10T 156/1052 with cutting, punching, tearing or severing
• CPC Class Codes: Y10T 29/49016 Antenna or wave energy "plumbing" making
• CPC Class Codes: Y10T 29/49018 with other electrical component
• CPC Class Codes: Y10T 29/49117 Conductor or circuit manufacturing
• CPC Class Codes: Y10T 29/49156 with selective destruction of conductive paths
• CPC Class Codes: Y10T 29/5317 : Laminated device
• CPC Class Codes: Y10T 29/53174 : Means to fasten electrical component to wiring board, base, or substrate
• CPC Class Codes: Y10T 428/24802 : Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
• CPC Class Codes: Y10T 428/24917 : including metal layer
• CPC Class Codes: Y10T 428/2809 : including irradiated or wave energy treated component
• CPC Class Codes: Y10T 428/2817 : Heat sealable

Abstract

The present invention relates to a method of manufacturing an antenna for a radio frequency (RFID) tag. A web of material is provided to at least one cutting station in which a first pattern is generated in the web of material. A further cutting may occur to create additional modifications in order to provide a microchip attachment location and to selectively tune an antenna for a particular end use application. The cutting may be performed by a laser, die cutting, stamping or combinations thereof.

Claims

1. A method of manufacturing an antenna structure for a radio frequency identification (RFID) tag, comprising the steps of:

providing a conductive layer, a two part adhesive layer in which one part is tacky and another part is not tacky, and a carrier layer supporting the conductive layer and the adhesive layer;

cutting a first antenna pattern through the conductive layer wherein the cutting includes performing a partial die cut with one of a rotary die cutter or a laser cutter up to the carrier layer but not through the carrier layer and through the conductive layer and the adhesive layer;

creating a microprocessor attachment portion by further cutting in the first antenna pattern to create a RFID antenna structure;

where the microprocessor attachment portion in the first antenna pattern includes ablating the conductive layer using a computer controlled cutting laser; and

attaching a microprocessor to the microprocessor attachment portion wherein the RFID antenna structure has multiple contact points allowing for one of a direct attachment point for the microprocessor or a strap attachment point each being different points on the RFID antenna structure without changing a design of the RFID antenna structure.

2. The method of claim 1, wherein the microprocessor attachment portion ablated by the laser cutter is generally t-shaped to define a gap that separates a first antenna contact end from a second antenna contact end.

3. The method of claim 2, including a further step of removing at least a matrix portion from the first antenna pattern after the step of cutting a first antenna pattern.

4. The method of claim 1, where tracing is done by a positioned supplementary second laser cutter on a supplementary laser cutting path while continuously ablating the conductive layer and the adhesive layer to alter the shape of the RFID antenna structure to create a modified antenna structure.

5. A method of manufacturing a radio frequency identification (RFID) tag comprising the steps of:

providing a carrier layer;

placing a conductive material on the carrier layer such that the conductive layer is attached to the carrier layer by an adhesive layer wherein a plurality of patterned registration marks is provided on top of one of the adhesive or carrier layer;

cutting portions of the conductive material with a computer controlled laser to form an RFID antenna structure to create an RFID tag such that the plurality of registration marks are provided to assist in the cutting of a pattern for the RFID antenna structure which the laser uses while continuously ablating the conductive material and the adhesive layer;

selectively cutting with the laser additional portions of the RFID tag to create a modified RFID tag and forming at least one of a logo, indicia, name or combinations thereof;

creating a microprocessor attachment portion by further cutting in the antenna structure;

removing the modified RFID tag from the carrier layer;

tracing by a second laser cutter on a cutting path the conductive layer and the adhesive layer to alter the shape of the RFID antenna structure to create a modified antenna structure;

and

attaching a microprocessor directly to the RFID antenna structure to create a standard RFID tag.

6. The method of claim 5, wherein the microprocessor is directly attached to the RFID antenna structure at a microprocessor attachment portion of the RFID antenna structure.

7. The method of claim 5, wherein the antenna structure has a microprocessor attachment portion that is generally t-shaped that defines a gap that separates a first antenna contact end from a second antenna contact end.

8. The method of claim 7, wherein the microprocessor is attached directly to the RFID antenna structure at the first antenna contact end and the second antenna contact end.

9. The method of claim 5, wherein the microprocessor is attached directly to the RFID antenna structure through the use of at least one of ultrasonic welding, crimping, adhesive bonding or combinations thereof.

10. The method of claim 5, wherein the step of selectively cutting portions of the antenna is practiced prior to the step of attaching the microprocessor.

11. A method of manufacturing a radio frequency identification (RFID) tag, comprising the steps of:

providing a conductive layer having a metal foil layer bonded to a carrier layer in areas where an antenna pattern is to be formed, the metal foil layer is bonded to the carrier layer by an adhesive layer;

cutting a first antenna pattern in the conductive layer;

cutting a second pattern in the first antenna pattern to create a RFID antenna structure wherein the cutting includes performing a partial die cut up to the carrier layer through the conductive layer and the adhesive layer and the conductive layer and RFID antenna structure are manufactured in a continuous roll to roll process;

selectively cutting with portions of one of the first and second patterns in the RFID antenna structure to create a modified RFID tag;

creating a microprocessor attachment portion by further cutting in the antenna structure and attaching a microprocessor such that none of the conductive layer is present in the microprocessor attachment portion;

where the microprocessor attachment portion in the first antenna pattern includes ablating the conductive layer using a computer controlled cutting laser;

tracing by a laser cutter on a laser cutting path the conductive layer and the adhesive layer to alter the shape of the RFID antenna structure to create a modified antenna structure; and

removing the modified RFID tag from the carrier layer.

12. The method of claim 11, wherein a microprocessor attachment portion is formed in the antenna pattern is generally t-shaped void and defines a gap that separates a first antenna contact end from a second antenna contact end.

13. The method of claim 12, wherein the microprocessor is directly attached the microprocessor attachment portion of the RFID antenna structure at the first antenna contact end and the second antenna contact end.

14. The method of claim 11, wherein the step of selectively cutting portions of the RFID antenna structure to create a modified RFID tag includes ablating the conductive layer using a computer controlled cutting laser.

15. The method of claim 11, wherein the microprocessor is attached directly to the RFID antenna structure through at least one of ultrasonic welds, electrically conductive adhesive, mechanical crimping or combinations thereof.

16. The method of claim 11, wherein the cutting of the basic antenna pattern through the conductive layer includes performing a partial cut with one of a rotary die cutter or cold foil process.