Patch antenna and method for impedance, frequency and pattern tuning

• US 9,941,593 B2
• Filed: 04/30/2013
• Issued: 04/10/2018
• Est. Priority Date: 04/30/2013
• Status: Active Grant

• Current Assignee: Aptiv PLC, The Board of Trustees of Michigan State University (Michigan State University), Tayfun Ozdemir
• Original Assignee: Monarch Antenna, Inc. (Aptiv PLC)
• Inventors: Ozdemir, Tayfun
• Primary Examiner(s): MUNOZ, DANIEL
• Application Number:
  US13/874,021
• Publication Number:
  US 20140320376A1
• Time in Patent Office: 1,806 Days
• Field of Search: 343876
• CPC Class Codes: H01Q 9/0442 with particular tuning means
• CPC Class Codes: Y10T 29/49016 Antenna or wave energy "plumbing" making

Abstract

A patch antenna system comprises a patch antenna having a patch spatially separated from a ground plane, a plurality of shorting pins interposed between the patch and the ground plane to selectively interconnect one or more predetermined fixed locations of the patch to the ground plane. A control module is operably coupled to a discrete RF switch associated with each shorting pin to set the operating frequency characteristic of the patch antenna by selectively connecting the patch to the ground plane through one or more of the plurality of shorting pins.

Claims

1. A patch antenna system comprising:

a patch antenna having a patch, a ground plane, and a dielectric interposed between the patch and the ground plane, said ground plane forming a lower surface opposed from said dielectric;

at least one feed pin electrically coupled to the patch for transmitting and/or receiving signals;

a fixed number of shorting pins disposed in the dielectric and electrically coupled to the patch, said shorting pins irregularly juxtaposed and arranged in a non-uniformly spaced curvilinear fixed array extending away from said feed pin, each of at least a subset of said fixed number of shorting pins extending within an enlarged opening in said ground plane and forming a contact pad surface at a terminus thereof adjacent and electrically isolated from said ground plane, each said contact pad surface disposed substantially coplanar with said adjacent ground plane lower surface;

a fixed number of switches, wherein each switch has first and second Radio Frequency (RF) contact pads electrically connected to the ground plane lower surface and to an adjacent contact pad of an associated shorting pin, respectively, and first and second Direct Current (DC) bias/supply and control contacts electrically connected to a control module,

said control module in communication with said fixed number of switches, and operable to reconfigure the patch antenna by selectively electrically connecting one or more of the fixed number of shorting pins to the ground plane, said control module effecting a complete binary count of a fixed number of switch states of said fixed number of switches to produce a substantially linear and monotonic shift in operating frequency of said patch antenna system throughout the patch antenna system'"'"'s characteristic operating frequency range.

2. The patch antenna system of claim 1, wherein said patch antenna comprises a half-patch including a first surface portion disposed substantially parallel to said ground plane and a second portion disposed substantially normally to said ground plane.

3. The patch antenna system of claim 2, wherein said second surface portion electrically interconnects said first surface portion to an edge of said ground plane.

4. The patch antenna system of claim 2, wherein said second surface portion comprises a solid vertical conducting wall or an array of vias/plated through holes spaced less than 0.05 of the shortest wavelength within a characteristic operational frequency band of said antenna.

5. The patch antenna system of claim 1, wherein said patch antenna comprises a micro-strip antenna.

6. The patch antenna system of claim 1, wherein said shorting pins are arranged in a predetermined pattern encompassed by a fixed surface region of said patch.

7. The patch antenna system of claim 6, wherein the fixed surface region of the patch encompassing the shorting pins is substantially equal to the entire surface area of the patch.

8. The patch antenna system of claim 6, wherein the fixed surface region of the patch encompassing the shorting pins is less than 10% of the entire surface area of the patch.

9. The patch antenna system of claim 1, wherein said shorting pins are elongated, extending along an axis substantially normal to said patch.

10. The patch antenna system of claim 1, wherein said dielectric comprises ambient fluid or air.

11. The patch antenna system of claim 1, wherein said dielectric comprises an electrically insulating solid or semi-solid material.

12. The patch antenna system of claim 1, wherein at least some of said switches are disposed in a pre-packaged monolithic microwave integrated circuit.

13. The patch antenna system of claim 1, wherein at least one of said switches comprises a bare-die having a passive surface bonded either to said ground plane or to an exposed surface of a circuit substrate disposed adjacent said ground plane and wire-bonds interconnecting said switch contacts with said contact pad and said ground plane.

14. The patch antenna system of claim 1, wherein at least one of said switches comprises a bare-die having an active surface facing said ground plane and solder bonds interconnecting said switch contacts with said contact pad and said ground plane.

15. The patch antenna system of claim 1, wherein at least one of said switches comprises a bare-die having a first active surface facing said ground plane with solder bonds interconnecting said switch contacts with said contact pad and said ground plane, and a second active surface facing away from said ground plane forming i/o contacts.

16. The patch antenna system of claim 1, wherein each of said subset of said fixed number of shorting pins extend through said ground plane opening.

17. The patch antenna system of claim 1, wherein said shorting pin contact pads are generally disposed in a co-planer orientation with either a surface of said ground plane or a via contact pad facing away from said patch.

18. The patch antenna system of claim 1, wherein said control module is operable to set an operating frequency characteristic of the patch antenna by selectively electrically connecting one or more of the fixed number of shorting pins to the ground plane.

19. The patch antenna system of claim 1, wherein the switch contacts electrically connected to said ground plane are disposed adjacent an associated ground plane opening.

20. An RF communication device comprising:

a transmitter and/or receiver circuit assembly having a substrate and a fixed number of electrical/electronic components and conductors carried thereon;

a patch antenna surface mounted on said substrate, said patch antenna having a patch, a ground plane, and a dielectric interposed between the patch and the ground plane, said ground plane forming a lower surface opposed from said dielectric;

at least one feed pin electrically coupled to the patch for transmitting and/or receiving signals from/to said circuit assembly;

a fixed number of shorting pins disposed in the dielectric and electrically coupled to the patch, said shorting pins irregularly juxtaposed and arranged in a non-uniformly spaced curvilinear array extending away from said feed pin, each of at least a subset of said fixed number of shorting pins extending within an enlarged opening in said ground plane and forming a contact pad surface at a terminus thereof adjacent and electrically isolated from said ground plane, each said contact pad surface disposed substantially coplanar with said adjacent ground plane lower surface;

a fixed number of switches, wherein each switch has first and second Radio Frequency (RF) contact pads electrically connected to the ground plane lower surface and to an adjacent contact pad of an associated shorting pin, respectively, and first and second Direct Current (DC) bias/supply and control contacts electrically connected to a control module,

said control module in communication with said fixed number of switches, and operable to reconfigure the patch antenna by selectively electrically connecting one or more of the fixed number of shorting pins to the ground plane, said control module effecting a complete binary count of a fixed number of switch states of said fixed number of switches to produce a substantially linear and monotonic shift in operating frequency of said patch antenna system throughout the patch antenna system'"'"'s characteristic operating frequency range.

21. The RF communication device of claim 20, wherein said substrate comprises said dielectric.

22. The RF communication device of claim 20, wherein said substrate comprises a multi-layer PCB.

23. The RF communication device of claim 20, wherein said patch is carried on the uppermost surface of the top PCB layer and the ground plane is carried on the lowermost surface of the bottom PCB layer.

24. A method of fabricating a patch antenna system comprising the steps of:

providing a patch antenna having a patch, a ground plane, and a dielectric interposed between the patch and the ground plane, wherein said ground plane forms a lower surface opposed from said dielectric;

providing at least one feed pin electrically coupled to the patch for transmitting and/or receiving signals;

providing a fixed number of shorting pins disposed in the dielectric and electrically coupled to the patch, said shorting pins irregularly juxtaposed and arranged in a non-uniformly spaced curvilinear fixed array extending away from said feed pin, each of at least a subset of said fixed number of shorting pins extending within an enlarged opening in said ground plane and forming a contact pad surface at a terminus thereof adjacent and electrically isolated from said ground plane, each said contact pad surface disposed substantially coplanar with said adjacent ground plane lower surface; and

providing a fixed number of switches, wherein each switch includes first and second Radio Frequency (RF) contact pads electrically connected to the ground plane lower surface and to an adjacent contact pad of an associated shorting pin, respectively, and first and second Direct Current (DC) bias/supply and control contacts electrically connected to a control module,

wherein said control module in communication with said fixed number of switches, and operable to reconfigure the patch antenna by selectively electrically connecting one or more of the fixed number of shorting pins to the ground plane, said control module effecting a complete binary count of a fixed number of switch states of said fixed number of switches to produce a substantially linear and monotonic shift in operating frequency of said patch antenna system throughout the patch antenna system'"'"'s characteristic operating frequency range.

25. The method of claim 24, further comprising the steps of:

forming a through passage in said ground plane in concentric alignment with the terminus of an associated shorting pin; and

extending each shorting pin through its associated through passage, wherein said shorting pin contact pad is substantially coplanar with said ground plane.

26. The method of claim 24, further comprising the step of pre-packaging at least a fixed number of said switches in a monolithic microwave integrated circuit which is bonded to the ground plane of the patch antenna employing a flip-chip/solder bump method, and which also encompasses wiring interconnecting the control contacts of the switches to a control module.

27. The method of claim 24, further comprising the steps of configuring at least one of said switches as a bare-die, and wire-bonding or solder-bonding via a flip-chip method first and second RF contact pads to the ground plane lower surface and to an adjacent contact pad of an associated shorting pin, respectively, and first and second DC bias and control contacts to DC signal traces realized on a second PCB with two sides, whose ground plane side is electrically bonded to and partially covering the ground plane of the patch antenna up to the point where the switches are located housing conductive traces on its opposing side facing away from the antenna, carrying DC control signals from the control module.

28. The method of claim 24, further comprising the steps of configuring at least one of said switches as a bare-die having an active surface facing said ground plane, and solder bonding said switch contacts with said contact pad and said ground plane.

29. The method of claim 24, further comprising the steps of configuring at least one of said switches as a bare-die having a first active surface facing said ground plane with solder bonds interconnecting said switch contacts with said contact pad and said ground plane, and a second active surface facing away from said ground plane forming i/o contacts.

30. The method of claim 24, further comprising the step of configuring each of said subset of said fixed number of shorting pins to extend through associated ground plane openings.

31. The method of claim 24, further comprising the step of positioning said shorting pin contact pads in a generally co-planer orientation with either a surface of said ground plane or a via contact pad facing away from said patch.

32. The method of claim 24, further comprising the step of positioning the switch contacts electrically connected to said ground plane adjacent an associated ground plane opening.