Connection using conductive vias

• US 9,942,994 B2
• Filed: 06/25/2015
• Issued: 04/10/2018
• Est. Priority Date: 02/25/2011
• Status: Active Grant

• Current Assignee: Qorvo US, Inc. (Qorvo, Inc.)
• Original Assignee: Qorvo US, Inc. (Qorvo, Inc.)
• Inventors: Morris, Thomas Scott, Madsen, Ulrik Riis, Leahy, Donald Joseph
• Primary Examiner(s): Wilson, Allan R
• Application Number:
  US14/750,384
• Publication Number:
  US 20150296631A1
• Time in Patent Office: 1,020 Days
• Field of Search: 257659, 257660, 257E23114, 257E21502, 438121, 438124
• CPC Class Codes: H01L 21/561 Batch processing
• CPC Class Codes: H01L 23/49827 Via connections through the substrates, e.g. pins going through the substrate, coaxial cables H01L23/49822, H01L23/49833, H01L23/4985, H01L23/49861 take precedence
• CPC Class Codes: H01L 23/552 Protection against radiation, e.g. light or electromagnetic waves
• CPC Class Codes: H01L 24/97 the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/1461 MEMS
• CPC Class Codes: H05K 1/115 Via connections; Lands around holes or via connections H05K1/112 takes precedence
• CPC Class Codes: H05K 2201/0715 provided by an outer layer of PCB
• CPC Class Codes: H05K 3/301 by means of a mounting structure H05K3/325 takes precedence
• CPC Class Codes: H05K 3/4038 Through-connections; Vertical interconnect access [VIA] connections H05K3/403, H05K3/42 take precedence
• CPC Class Codes: H05K 9/0024 Shield cases mounted on a PCB, e.g. cans or caps or conformal shields
• CPC Class Codes: Y10T 29/49165 by forming conductive walled aperture in base

Abstract

In one embodiment, a meta-module having circuitry for two or more modules is formed on a substrate, which is preferably a laminated substrate. The circuitry for the different modules is initially formed on the single meta-module. Each module will have one or more component areas in which the circuitry is formed. A metallic structure is formed on or in the substrate for each component area to be shielded. A single body, such as an overmold body, is then formed over all of the modules on the meta-module. At least a conductive vertical interconnect access structure (vias) associated with each component area to be shielded is then exposed through the body by a cutting, drilling, or similar operation. Next, an electromagnetic shield material is applied to the exterior surface of the body of each of the component areas to be shielded and in contact with the exposed conductive vias.

Claims

1. A method of manufacturing a plurality of electronic modules, comprising:

providing a substrate comprising a substrate body having a plurality of component portions wherein each of the plurality of component portions includes a component area on a surface of the substrate body and a plurality of metallic structures, each of the plurality of metallic structures associated with one of the plurality of component portions;

wherein each of the plurality of metallic structures have;

a first metallic layer that extends along a periphery of the one of the plurality of component portions; and

a first conductive vertical interconnect access structure (via) attached to the first metallic layer at the periphery of the one of the plurality of component portions; and

wherein providing the substrate comprises;

providing a first metal sheet;

forming the first metallic layer in each of the plurality of metallic structures from the first metal sheet; and

providing a first insulating substrate layer of the substrate body on the first metallic layer of each of the plurality of metallic structures;

providing electronic components on the component portions;

providing an overmold over the surface of the substrate body to cover the component portions;

forming channels along the periphery of each of the plurality of component portions, the channels being formed through at least the overmold, wherein the channels expose at least a first section of the first conductive via in each of the plurality of metallic structures; and

applying an electromagnetic shield material over the overmold and in the channels to form electromagnetic shields over each of the component areas wherein the first section of the first conductive via in each of the plurality of metallic structures is directly attached to one of the electromagnetic shields.

2. The method of claim 1, further comprising singulating the plurality of component portions from the substrate body.

3. The method of claim 1, wherein providing the substrate comprises forming the plurality of component portions so that the plurality of component portions are configured as an array of component portions.

4. The method of claim 3, wherein the array of component portions includes columns and rows of component portions.

5. The method of claim 1, wherein providing the substrate further comprises providing the first conductive via on the first metallic layer of each of the plurality of metallic structures.

6. The method of claim 1, wherein providing the substrate further comprises:

providing a second metal sheet over or below the first insulating substrate layer;

forming a second metallic layer in each of the plurality of metallic structures from the second metal sheet; and

providing a second insulating substrate layer of the substrate body on the second metallic layer of each of the plurality of metallic structures.

7. The method of claim 6, wherein providing the substrate further comprises:

wherein forming the first metallic layer of each of the plurality of metallic structures from the first metal sheet comprises forming the first metallic layer of each of the plurality of metallic structures so that each substantially surrounds an area of the first insulating substrate layer that forms a part of the associated one of the plurality of component portions;

forming a first plurality of conductive vias on the first metallic layer of each of the plurality of metallic structures that substantially surround the area of the first insulating substrate layer that forms the part of the associated one of the plurality of component portions, wherein the first plurality of conductive vias in each of the plurality of metallic structures comprises the first conductive via;

wherein forming the second metallic layer of each of the plurality of metallic structures from the second metal sheet comprises forming the second metallic layer of each of the plurality of metallic structures so that each substantially surrounds an area of the second insulating substrate layer that forms a part of the associated one of the plurality of component portions; and

forming a second plurality of conductive vias on each second metallic layer of each of the plurality of metallic structures that substantially surround the area of the second insulating substrate layer that forms the part of the associated one of the plurality of component portions.

8. The method of claim 7, further comprising:

wherein forming the channels along the periphery of each of the plurality of component portions, further comprises, for each of the plurality of metallic structures, exposing at least the first section of each of the first plurality of conductive vias which includes the first section of the first conductive via; and

wherein applying the electromagnetic shield material over the overmold and in the channels to form the electromagnetic shields over each of the component areas comprises, for each of the plurality of metallic structures, coupling the first section of the first conductive via to one of the electromagnetic shields.

9. The method of claim 8, wherein providing the substrate further comprises:

providing a third metal sheet on the second insulating substrate layer, wherein the second insulating substrate layer includes the surface of the substrate body; and

forming a third metallic layer in each of the plurality of metallic structures on the surface of the substrate body so as to substantially surround the component area.

10. The method of claim 1, wherein each of the plurality of metallic structures is separated from one another.

11. The method of claim 1, wherein the plurality of metallic structures is integrated into a meta-metallic structure.

12. A method of manufacturing a plurality of electronic modules, comprising:

providing a substrate comprising a substrate body having a plurality of component portions wherein each of the plurality of component portions includes a component area on a surface of the substrate body and a plurality of metallic structures, each of the plurality of metallic structures associated with one of the plurality of component portions;

wherein each of the plurality of metallic structures have;

a first metallic layer that extends continuously along a periphery of the one of the plurality of component portions; and

a first conductive vertical interconnect access structure (via) attached to the first metallic layer at the periphery of the one of the plurality of component portions;

providing electronic components on the component portions;

providing an overmold over the surface of the substrate body to cover the component portions;

forming channels along the periphery of each of the plurality of component portions, the channels being formed through at least the overmold, wherein the channels expose at least a first section of the first conductive via in each of the plurality of metallic structures; and

applying an electromagnetic shield material over the overmold and in the channels to form electromagnetic shields over each of the component areas wherein the first section of the first conductive via in each of the plurality of metallic structures is directly attached to one of the electromagnetic shields.

13. A method of manufacturing a plurality of electronic modules, comprising:

providing a substrate comprising;

a substrate body having a plurality of component portions wherein each of the plurality of component portions includes;

a component area on a surface of the substrate body and a plurality of metallic structures, each of the plurality of metallic structures associated with one of the plurality of component portions;

wherein each of the plurality of metallic structures have;

more than two metallic layers that extend along a periphery of the one of the plurality of component portions; and

a first conductive vertical interconnect access structure (via) attached to the more than two metallic layers at the periphery of the one of the plurality of component portions, such that the more than two metallic layers and the first conductive via are configured to provide electromagnetic shielding;

providing electronic components on the component portions;

providing an overmold over the surface of the substrate body to cover the component portions;

forming channels along the periphery of each of the plurality of component portions, the channels being formed through at least the overmold, wherein the channels expose at least a first section of the first conductive via in each of the plurality of metallic structures; and

applying an electromagnetic shield material over the overmold and in the channels to form electromagnetic shields over each of the component areas wherein the first section of the first conductive via in each of the plurality of metallic structures is directly attached to one of the electromagnetic shields.