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Connection using conductive vias

  • US 9,942,994 B2
  • Filed: 06/25/2015
  • Issued: 04/10/2018
  • Est. Priority Date: 02/25/2011
  • Status: Active Grant
First Claim
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1. A method of manufacturing a plurality of electronic modules, comprising:

  • providing a substrate comprising a substrate body having a plurality of component portions wherein each of the plurality of component portions includes a component area on a surface of the substrate body and a plurality of metallic structures, each of the plurality of metallic structures associated with one of the plurality of component portions;

    wherein each of the plurality of metallic structures have;

    a first metallic layer that extends along a periphery of the one of the plurality of component portions; and

    a first conductive vertical interconnect access structure (via) attached to the first metallic layer at the periphery of the one of the plurality of component portions; and

    wherein providing the substrate comprises;

    providing a first metal sheet;

    forming the first metallic layer in each of the plurality of metallic structures from the first metal sheet; and

    providing a first insulating substrate layer of the substrate body on the first metallic layer of each of the plurality of metallic structures;

    providing electronic components on the component portions;

    providing an overmold over the surface of the substrate body to cover the component portions;

    forming channels along the periphery of each of the plurality of component portions, the channels being formed through at least the overmold, wherein the channels expose at least a first section of the first conductive via in each of the plurality of metallic structures; and

    applying an electromagnetic shield material over the overmold and in the channels to form electromagnetic shields over each of the component areas wherein the first section of the first conductive via in each of the plurality of metallic structures is directly attached to one of the electromagnetic shields.

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