Electronic/photonic chip integration and bonding
First Claim
1. An optical waveguide device comprising:
- one or more photonic chips, the one or more photonic chips including;
a first portion of a photonic chip comprising an array of first components, each of the first components having an optical input and an electrical output; and
a second portion of a photonic chip comprising;
an array of second components each having an electrical input and an optical output, anda plurality of output waveguides each connected to the optical output of a respective second component,the second components and the output waveguides being within one plane parallel to a surface of the second portion of a photonic chip;
the optical waveguide device further comprising a complementary metal oxide semiconductor (CMOS) integrated circuit, the CMOS integrated circuit forming an electrical bridge between the electrical outputs of the first components and respective electrical inputs of the second components;
wherein the CMOS integrated circuit is configured;
to receive a first electrical signal corresponding to modulation carried by light received by a first one of the first components,to process the first electrical signal to form a first processed electrical signal, the processing comprising reshaping and/or retiming of the electrical signal, andto provide the first processed electrical signal to a first one of the second components,wherein the CMOS integrated circuit has a perimeter having;
a first side, anda second side, different from the first side,wherein each of a plurality of electrical contacts on the first side is connected to the electrical output of a respective first component of the array of first components, and no electrical contact on the first side is connected to a modulator,wherein each of a plurality of electrical contacts on the second side is connected to the electrical input of a respective second component of the array of second components, and no electrical contact on the second side is connected to a photodetector,wherein the second components are modulators, each having an input waveguide and an output waveguide, there being one or more electrical paths between the first components and the modulators andwherein at least one of the electrical paths extends over;
an input waveguide;
an output waveguide;
ora modulator.
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0 Petitions
Accused Products
Abstract
An optical waveguide device comprising: one or more photonic chips, the one or more photonic chips including: a first portion of a photonic chip comprising an array of first components, each of the first components having an optical input and an electrical output; and a second portion of a photonic chip comprising an array of second components, each of the second components configured to receive an electrical input; the optical waveguide device further comprising: an integrated circuit; the integrated circuit forming an electrical bridge between the electrical outputs of the first components and respective electrical inputs of the second components; wherein the integrated circuit is directly mounted onto the one or more photonic chips; and/or wherein the integrated circuit is located between the first portion of a photonic chip and the second portion of a photonic chip.
33 Citations
21 Claims
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1. An optical waveguide device comprising:
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one or more photonic chips, the one or more photonic chips including; a first portion of a photonic chip comprising an array of first components, each of the first components having an optical input and an electrical output; and a second portion of a photonic chip comprising; an array of second components each having an electrical input and an optical output, and a plurality of output waveguides each connected to the optical output of a respective second component, the second components and the output waveguides being within one plane parallel to a surface of the second portion of a photonic chip; the optical waveguide device further comprising a complementary metal oxide semiconductor (CMOS) integrated circuit, the CMOS integrated circuit forming an electrical bridge between the electrical outputs of the first components and respective electrical inputs of the second components; wherein the CMOS integrated circuit is configured; to receive a first electrical signal corresponding to modulation carried by light received by a first one of the first components, to process the first electrical signal to form a first processed electrical signal, the processing comprising reshaping and/or retiming of the electrical signal, and to provide the first processed electrical signal to a first one of the second components, wherein the CMOS integrated circuit has a perimeter having; a first side, and a second side, different from the first side, wherein each of a plurality of electrical contacts on the first side is connected to the electrical output of a respective first component of the array of first components, and no electrical contact on the first side is connected to a modulator, wherein each of a plurality of electrical contacts on the second side is connected to the electrical input of a respective second component of the array of second components, and no electrical contact on the second side is connected to a photodetector, wherein the second components are modulators, each having an input waveguide and an output waveguide, there being one or more electrical paths between the first components and the modulators and wherein at least one of the electrical paths extends over; an input waveguide; an output waveguide;
ora modulator. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21)
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Specification