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Systems and methods for controlling release of transferable semiconductor structures

  • US 9,947,584 B2
  • Filed: 02/10/2017
  • Issued: 04/17/2018
  • Est. Priority Date: 06/18/2014
  • Status: Active Grant
First Claim
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1. An array of micro devices, the array comprising:

  • a silicon (111) source substrate having a plurality of anchor portions in the silicon (111) source substrate that are laterally separated by etched portions in the silicon (111) source substrate;

    a plurality of releasable micro objects, each located over an etched portion; and

    a plurality of tethers, wherein each tether of the plurality of tethers connects a releasable micro object to an anchor portion, wherein the anchor portion to which the tether connects laterally separates adjacent releasable micro objects,wherein the releasable micro objects are formed at least in part on the source substrate.

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