Interposer frame with polymer matrix and methods of fabrication

• US 9,949,373 B2
• Filed: 01/18/2017
• Issued: 04/17/2018
• Est. Priority Date: 04/09/2014
• Status: Active Grant

• Current Assignee: Zhuhai Access Semiconductor Company Limited
• Original Assignee: Zhuhai Advanced Chip Carriers & Electronic Substrate Solutions Technologies Co. Ltd.
• Inventors: Hurwitz, Dror, Huang, Alex
• Primary Examiner(s): Hossain, Moazzam
• Assistant Examiner(s): Lu, Farun
• Application Number:
  US15/409,221
• Publication Number:
  US 20170127527A1
• Time in Patent Office: 454 Days
• CPC Class Codes: C25D 5/022 using masking means
• CPC Class Codes: H01L 21/568 Temporary substrate used as encapsulation process aid H01L21/4832 and H01L21/566 take precedence
• CPC Class Codes: H01L 2224/04105 Bonding areas formed on an encapsulation of the semiconductor or solid-state body, e.g. bonding areas on chip-scale packages
• CPC Class Codes: H01L 2224/18 High density interconnect [HDI] connectors; Manufacturing methods related thereto
• CPC Class Codes: H01L 24/19 Manufacturing methods of high density interconnect preforms
• CPC Class Codes: H01L 24/20 Structure, shape, material or disposition of high density interconnect preforms
• CPC Class Codes: H01L 24/96 the devices being encapsulated in a common layer, e.g. neo-wafer or pseudo-wafer, said common layer being separable into individual assemblies after connecting
• CPC Class Codes: H01L 24/97 the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/181 Encapsulation
• CPC Class Codes: H01L 2924/3511 Warping
• CPC Class Codes: H05K 1/0313 Organic insulating material
• CPC Class Codes: H05K 1/115 Via connections; Lands around holes or via connections H05K1/112 takes precedence
• CPC Class Codes: H05K 2201/032 Materials
• CPC Class Codes: H05K 2201/09609 Via grid, i.e. two-dimensional array of vias or holes in a single plane interposers H05K2201/10378
• CPC Class Codes: H05K 2201/10242 Metallic cylinders small solder preforms other than balls H05K2203/0415
• CPC Class Codes: H05K 3/0064 onto a polymeric substrate
• CPC Class Codes: H05K 3/007 Manufacture or processing of a substrate for a printed circuit board supported by a temporary or sacrificial carrier H05K1/187, H05K3/20 and H05K3/4682 take precedence
• CPC Class Codes: H05K 3/064 Photoresists

Abstract

An array of chip sockets defined by an organic matrix framework surrounding sockets through the organic matrix framework and further comprising a grid of metal vias through the organic matrix framework. In an embodiment, a panel includes an array of chip sockets, each surrounded and defined by an organic matrix framework including a grid of copper vias through the organic matrix framework. The panel includes at least a first region with sockets having a set of dimensions for receiving one type of chip and a second region with sockets and another set of dimensions for receiving a second type of chip.

Claims

1. A method of fabricating an array of chip sockets surrounded by an organic matrix framework comprising:

obtaining a sacrificial carrier;

laying down a layer of photoresist and patterning with a grid of copper via posts and a chip socket array;

plating copper into the grid and the chip socket array;

removing the photoresist;

laminating with polymer dielectric;

thinning and planarizing to expose ends of the copper via posts and the copper filled chip socket array;

shielding the ends of the copper via posts;

dissolving away the copper from the copper filled chip socket array leaving the chip socket array, and

removing the carrier.

2. The method of claim 1, wherein the via posts are elongated via posts and at least one chip socket is surrounded by an organic matrix frame with an embedded metallic structure comprise at least one elongated via post and at least one feature layer.

3. The method of claim 1 wherein the elongated via post and feature layer comprises a continuous coil.

4. The method of claim 1 wherein at least one socket is surrounded by an organic frame and a multilayer metal structure embedded in the organic frame and comprising a plurality of extended via post layers, such that each pair of adjacent via post layers are separated by a feature layer and the multilayer metal structure comprises a continuous coil.