Thermoelectric-enhanced, inlet air-cooled thermal conductors

• US 9,949,412 B2
• Filed: 10/26/2015
• Issued: 04/17/2018
• Est. Priority Date: 08/12/2015
• Status: Expired due to Fees

• Current Assignee: International Business Machines Corporation
• Original Assignee: International Business Machines Corporation
• Inventors: Campbell, Levi A., David, Milnes P., Demetriou, Dustin W., Ellsworth, Jr., Michael J., Schmidt, Roger R., Simons, Robert E.
• Primary Examiner(s): Kim, Paul D
• Application Number:
  US14/922,324
• Publication Number:
  US 20170049010A1
• Time in Patent Office: 904 Days
• CPC Class Codes: H05K 7/20436 Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
• CPC Class Codes: H05K 7/20545 Natural convection of gaseous coolant; Heat transfer by conduction from electronic boards
• CPC Class Codes: H05K 7/20709 for server racks or cabinets; for data centers, e.g. 19-inch computer racks
• CPC Class Codes: H05K 7/20727 within server blades for removing heat from heat source
• CPC Class Codes: H05K 7/20754 Air circulating in closed loop within cabinets
• CPC Class Codes: H05K 7/20818 within cabinets for removing heat from server blades
• CPC Class Codes: H05K 7/20836 Thermal management, e.g. server temperature control

Abstract

A method of providing a cooling apparatus for cooling a heat-dissipating component(s) of an electronics enclosure includes: providing a thermal conductor to couple to the heat-dissipating component(s), the thermal conductor including a first conductor portion coupled to the heat-dissipating component, and a second conductor portion to position along an air inlet side of the electronics enclosure, so that in operation, the first conductor portion transfers heat from the component(s) to the second conductor portion; coupling at least one air-cooled heat sink to the second conductor portion to facilitate transfer of heat to airflow ingressing into the enclosure; providing at least one thermoelectric device coupled to the first or second conductor portion to facilitate providing active auxiliary cooling to the thermal conductor; and providing a controller to control operation of the thermoelectric device(s) and to selectively switch operation of the cooling apparatus between active and passive cooling modes.

Claims

1. A method comprising:

providing a cooling apparatus for cooling one or more heat-dissipating components within an electronics enclosure, the electronics enclosure comprising an air inlet side through which an airflow ingresses into the electronics enclosure, the providing of the cooling apparatus comprising;

providing a thermal conductor to couple to the one or more heat-dissipating components within the electronics enclosure, the thermal conductor comprising;

a first conductor portion to couple to the one or more heat-dissipating components to conduct heat therefrom; and

a second conductor portion to position along the air inlet side of the electronics enclosure, wherein in operation, the first conductor portion transfers heat, at least in part, from the one or more heat-dissipating components to the second conductor portion;

coupling at least one air-cooled heat sink to the second conductor portion of the thermal conductor to facilitate transfer of heat from the second conductor portion to the airflow ingressing into the electronics enclosure;

providing at least one thermoelectric device coupled to at least one of the first conductor portion or the second conductor portion of the thermal conductor to selectively provide active auxiliary cooling to the thermal conductor; and

providing a controller to control operation of the at least one thermoelectric device and selectively switch operation of the cooling apparatus between an active cooling mode, where the at least one thermoelectric device is active, and a passive cooling mode, where the at least one thermoelectric device is inactive.

2. The method of claim 1, wherein providing the cooling apparatus further comprises providing multiple air-cooled heat sinks, the at least one air-cooled heat sink being at least one air-cooled heat sink of the multiple air-cooled heat sinks, and wherein providing the multiple air-cooled heat sinks comprises coupling a first air-cooled heat sink and a second air-cooled heat sink opposite sides of the second conductor portion of the thermal conductor at the air inlet side of the electronics enclosure.

3. The method of claim 2, wherein the opposite sides of the second conductor portion of the thermal conductor comprise a first side and a second side, the at least one thermoelectric device is located between the first side of the second conductor portion and the first air-cooled heat sink, and the at least one thermoelectric device comprises a cold side and a hot side when active, the cold side being coupled to the first side of the second conductor portion of the thermoelectric conductor, and the hot side being coupled to the first air-cooled heat sink, and wherein the second air-cooled heat sink is coupled to the second side of the second conductor portion of the thermal conductor.

4. The method of claim 3, wherein the first conductor portion and the second conductor portion of the thermal conductor extend in different directions, and wherein providing the at least one thermoelectric device comprises providing multiple thermoelectric modules, the multiple thermoelectric modules being coupled to the first side of the second conductor portion of the thermal conductor along the air inlet side of the electronics enclosure, and wherein the controller selectively, separately controls operation of each thermoelectric module of the multiple thermoelectric modules.

5. The method of claim 4, wherein the controller controllably provides auxiliary cooling to the thermal conductor by prioritizing activation of one or more thermoelectric modules of the multiple thermoelectric modules disposed closest to the first conductor portion of the thermal conductor when active auxiliary cooling is required.

6. The method of claim 4, further comprising providing temperature sensors associated with the second conductor portion to facilitate determining a temperature differential between the first and second sides thereof, the controller using the temperature differential in controlling operation of at least one thermoelectric module of the multiple thermoelectric modules.

7. The method of claim 4, further comprising providing an insulating layer within the second conductor portion and dividing the second conductor portion into an upper conductor portion and a lower conductor portion, the insulating layer inhibiting transfer of heat from the second side to the first side when the cooling apparatus is in the active cooling mode.

8. The method of claim 1, further comprising providing multiple air-cooled heat sinks, the at least one air-cooled heat sink being at least one air-cooled heat sink of the multiple air-cooled heat sinks, and the at least one thermoelectric device comprises multiple thermoelectric modules, and wherein providing the multiple air-cooled heat sinks comprises providing a first air-cooled heat sink and a second air-cooled heat sink, the first air-cooled heat sink and the second air-cooled heat sink being disposed at opposite sides of the second conductor portion of the thermal conductor, and wherein the opposite sides of the second conductor portion of the thermal conductor comprise a first side and a second side, and one or more thermoelectric modules of the multiple thermoelectric modules are coupled to the first side of the second conductor portion of the thermal conductor, and one or more other thermoelectric modules of the multiple thermoelectric modules are coupled to the second side of the second conductor portion of the thermal conductor.

9. The method of claim 8, wherein the one or more thermoelectric modules and the one or more other thermoelectric modules respectively couple to the first side and second side of the second conductor portion of the thermal conductor closer to an end thereof away from where the first conductor portion meets the second conductor portion within the thermal conductor.

10. The method of claim 1, wherein providing the at least one thermoelectric device comprises providing multiple thermoelectric modules coupled to the first conductor portion of the thermal conductor, and the cooling apparatus further comprises an auxiliary heat sink coupled to the multiple thermoelectric modules, the multiple thermoelectric modules being disposed between the first conductor portion of the thermal conductor and the auxiliary heat sink.

11. The method of claim 1, wherein the thermal conductor comprises at least one of a thermal conduction layer, a heat pipe, or a vapor chamber disposed within at least one of the first conductor portion or the second conductor portion.

12. The method of claim 1, wherein the thermal conductor comprises a thermal conduction layer, the thermal conduction layer comprising at least one of a graphite layer, a CVD diamond layer, a copper layer, or an aluminum layer.