Micro heat transfer arrays, micro cold plates, and thermal management systems for cooling semiconductor devices, and methods for using and making such arrays, plates, and systems
First Claim
Patent Images
1. A method of cooling a semiconductor device, comprising:
- (a) providing at least one heat transfer array, comprising a plurality of stacked and adhered layers comprising at least one metal wherein each of the at least one heat transfer array comprises a plurality of microjet structures;
(b) placing the heat transfer array in physical contact with or in proximity to the semiconductor device to be cooled to form a primary heat transfer region having at least one cooling fluid impingement surface;
(c) pumping a cooling fluid into at least one inlet of the heat transfer array such that the cooling fluid is jetted onto the impingement surface to extract heat therefrom, then passing the heated cooling fluid to at least one outlet of the heat transfer array, while continuing to extract heat from the heat transfer array, and then onto a heat exchanger where heat is removed from the cooling fluid to produce cooled cooling fluid; and
(d) circulating the cooled cooling fluid from the heat exchanger back into the at least one inlet of the heat transfer array to repeat a flow cycle to draw heat from the at least one semiconductor device,wherein the plurality of microjet structures function as fins that contact the at least one cooling fluid impingement surface whereby a lowest portion of the plurality of microjet structures are in solid-to-solid contact with the at least one cooling fluid impingement surface while at least one opening exists in the jetting structures above the at least one cooling fluid impingement surface so that jetted fluid is free from enclosing jetting channels within the microjet structures to impinge on the at least one cooling fluid impingement surface.
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Abstract
Embodiments of the present invention are directed to heat transfer arrays, cold plates including heat transfer arrays along with inlets and outlets, and thermal management systems including cold-plates, pumps and heat exchangers. These devices and systems may be used to provide cooling of semiconductor devices and particularly such devices that produce high heat concentrations. The heat transfer arrays may include microjets, microchannels, fins, and even integrated microjets and fins.
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Citations
36 Claims
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1. A method of cooling a semiconductor device, comprising:
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(a) providing at least one heat transfer array, comprising a plurality of stacked and adhered layers comprising at least one metal wherein each of the at least one heat transfer array comprises a plurality of microjet structures; (b) placing the heat transfer array in physical contact with or in proximity to the semiconductor device to be cooled to form a primary heat transfer region having at least one cooling fluid impingement surface; (c) pumping a cooling fluid into at least one inlet of the heat transfer array such that the cooling fluid is jetted onto the impingement surface to extract heat therefrom, then passing the heated cooling fluid to at least one outlet of the heat transfer array, while continuing to extract heat from the heat transfer array, and then onto a heat exchanger where heat is removed from the cooling fluid to produce cooled cooling fluid; and (d) circulating the cooled cooling fluid from the heat exchanger back into the at least one inlet of the heat transfer array to repeat a flow cycle to draw heat from the at least one semiconductor device, wherein the plurality of microjet structures function as fins that contact the at least one cooling fluid impingement surface whereby a lowest portion of the plurality of microjet structures are in solid-to-solid contact with the at least one cooling fluid impingement surface while at least one opening exists in the jetting structures above the at least one cooling fluid impingement surface so that jetted fluid is free from enclosing jetting channels within the microjet structures to impinge on the at least one cooling fluid impingement surface. - View Dependent Claims (2, 3, 4)
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5. A thermal management system for a semiconductor device comprising:
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(1) at least one micro cold plate, comprising; (a) at least one fluid inlet header or manifold; (b) at least one fluid outlet header or manifold; (c) a hybrid microjet and microchannel heat transfer array, comprising; (I) a plurality of microjet structures for directing a heat transfer fluid from the at least one fluid inlet header or manifold onto at least one surface of a primary heat exchange region selected from the group consisting of; a. a surface of a heat source or a plurality of separated surfaces of a heat source; b. at least one surface in proximity to one or more heat source surfaces wherein a separation distance between the at least one surface onto which jetting occurs and a surface or a plurality of separate surfaces of a heat source is selected from the group consisting of;
(i) <
=200 um, (ii) <
=100 um, (iii) <
=50 um, (iv) <
=20 um, and (v) <
=10 um;c. at least one surface of a solid material separated from a surface or a plurality of separate surfaces of a heat source by a gap that is occupied by at least one highly conductive transfer material that may be a different solid, a semi-liquid, or a liquid wherein a thickness of the gap is selected from the group consisting of;
(i) <
=200 um, (ii) <
=100 um, (iii) <
=50 um, (iv) <
=20 um, and (v) <
=10 um); andd. at least one surface of a solid that is in intimate contact with a surface or a plurality of separate surfaces of a heat source; and (II) a plurality of post jetting microchannel flow paths to direct the heat transfer fluid from the primary heat exchange region to the at least one outlet header or manifold, wherein the at least one surface of the primary heat exchange region onto which jetting occurs is closer, in the jetting direction, to the surface or the plurality of separate surfaces of the heat source than are the microchannel flow paths; (2) at least one flow path to move heated fluid, directly or indirectly, from the fluid outlet header or manifold of the at least one micro cold plate to a heat exchanger; (3) at least one flow path to move cooled fluid, directly or indirectly, from the heat exchanger back into the inlet header or manifold of the at least one micro cold plate; and (4) at least one pump functionally configured to direct the fluid through the at least one cold plate to the heat exchanger and back to the at least one cold plate, wherein the heat transfer array is configured to withdraw heat from a semiconductor device, and wherein the plurality of microjet structures function as fins that contact the at least one surface of the at least one primary heat exchange region whereby lowest portions of the plurality of microjet structures are in solid-to-solid contact with the at least one surface of the primary heat exchange region while at least one opening exists in each jetting structure above the at least one surface of the primary heat exchange region such that fluid can be jetted free from enclosing jetting channels within the microjet structures to impinge on the at least one surface of the primary heat exchange region. - View Dependent Claims (6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24, 25, 26, 27, 28, 29, 30, 31, 32)
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33. A thermal management system for a semiconductor device comprising:
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(1) at least one micro cold plate, comprising; (a) at least one fluid inlet header or manifold; (b) at least one fluid outlet header or manifold; (c) a hybrid microjet and microchannel heat transfer array, comprising; (I) a plurality of microjet structures for directing a heat transfer fluid from the at least one fluid inlet header or manifold onto at least one surface of a primary heat exchange region selected from the group consisting of; a. a surface of a heat source or a plurality of separated surfaces of a heat source; b. at least one surface in proximity to one or more heat source surfaces wherein a separation distance between the at least one surface onto which jetting occurs and a surface or a plurality of separate surfaces of a heat source is selected from the group consisting of;
(i) <
=200 um, (ii) <
=100 um, (iii) <
=50 um, (iv) <
=20 um, and (v) <
=10 um;c. at least one surface of a solid material separated from a surface or a plurality of separate surfaces of a heat source by a gap that is occupied by at least one highly conductive transfer material that may be a different solid, a semi-liquid, or a liquid wherein a thickness of the gap is selected from the group consisting of;
(i) <
=200 um, (ii) <
=100 um, (iii) <
=50 um, (iv) <
=20 um, and (v) <
=10 um); andd. at least one surface of a solid that is in intimate contact with a surface or a plurality of separate surfaces of a heat source; and (II) a plurality of post letting microchannel flow paths to direct the heat transfer fluid from the primary heat exchange region to the at least one outlet header or manifold, wherein the at least one surface of the primary heat exchange region onto which jetting occurs is closer, in the jetting direction, to the surface or the plurality of separate surfaces of the heat source than are the microchannel flow paths; (2) at least one flow path to move heated fluid, directly or indirectly, from the fluid outlet header or manifold of the at least one micro cold plate to a heat exchanger; (3) at least one flow path to move cooled fluid, directly or indirectly, from the heat exchanger back into the inlet header or manifold of the at least one micro cold plate; and (4) at least one pump functionally configured to direct the fluid through the at least one cold plate to the heat exchanger and back to the at least one cold plate, wherein the heat transfer array is configured to withdraw heat from a semiconductor device, wherein the at least one surface of the primary heat exchange region comprises a plurality of jetting well surfaces with each jetting well surface surrounded by walls that direct fluid away from the jetting well surfaces into the microchannel flow paths, and wherein each of the plurality of jetting well surfaces is configured to directly receive jetted fluid from a single microjet structure, wherein the plurality of microjet structures have elongated cross-sectional configurations (i.e. in a plane perpendicular to a jetting direction) with a length to width aspect ratio selected from the group consisting of;
(i) <
=10 to 1, (ii) <
=5 to 1, (iii) <
=3 to 1, or (iv) <
=2 to 1.
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34. A thermal management system for a semiconductor device comprising:
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(1) at least one micro cold plate, comprising; (a) at least one fluid inlet header or manifold; (b) at least one fluid outlet header or manifold; (c) a hybrid microjet and microchannel heat transfer array, comprising; (I) a plurality of microjet structures for directing a heat transfer fluid from the at least one fluid inlet header or manifold onto at least one surface of a primary heat exchange region selected from the group consisting of; a. a surface of a heat source or a plurality of separated surfaces of a heat source; b. at least one surface in proximity to one or more heat source surfaces wherein a separation distance between the at least one surface onto which jetting occurs and a surface or a plurality of separate surfaces of a heat source is selected from the group consisting of;
(i) <
=200 um, (ii) <
=100 um, (iii) <
=50 um, (iv) <
=20 um, and (v) <
=10 um;c. at least one surface of a solid material separated from a surface or a plurality of separate surfaces of a heat source by a gap that is occupied by at least one highly conductive transfer material that may be a different solid, a semi-liquid, or a liquid wherein a thickness of the gap is selected from the group consisting of;
(i) <
=200 um, (ii) <
=100 um, (iii) <
=50 um, (iv) <
=20 um, and (v) <
=10 um); andd. at least one surface of a solid that is in intimate contact with a surface or a plurality of separate surfaces of a heat source; and (II) a plurality of post jetting microchannel flow paths to direct the heat transfer fluid from the primary heat exchange region to the at least one outlet header or manifold, wherein the at least one surface of the primary heat exchange region onto which jetting occurs is closer, in the jetting direction, to the surface or the plurality of separate surfaces of the heat source than are the microchannel flow paths; (2) at least one flow path to move heated fluid, directly or indirectly, from the from the fluid outlet header or manifold of the at least one micro cold plate to a heat exchanger; (3) at least one flow path to move cooled fluid, directly or indirectly, from the heat exchanger back into the inlet header or manifold of the at least one micro cold plate; and (4) at least one pump functionally configured to direct the fluid through the at least one cold plate to the heat exchanger and back to the at least one cold plate, wherein the heat transfer array is configured to withdraw heat from a semiconductor device, and wherein the majority of the heat exchange from a solid to the fluid occurs via a surface of a first metal and wherein selected portions of the heat transfer array are formed from a second metal of higher thermal conductive than the first metal such that heat conductivity as a whole is improved relative to the heat conductivity if the second metal were replaced with the first metal.
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35. A thermal management system for a semiconductor device comprising:
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(1) at least one micro cold plate, comprising; (a) at least one fluid inlet header or manifold; (b) at least one fluid outlet header or manifold; (c) a hybrid microjet and microchannel heat transfer array, comprising; (I) a plurality of microjet structures for directing a heat transfer fluid from the at least one fluid inlet header or manifold onto at least one surface of a primary heat exchange region selected from the group consisting of; a. a surface of a heat source or a plurality of separated surfaces of a heat source; b. at least one surface in proximity to one or more heat source surfaces wherein a separation distance between the at least one surface onto which jetting occurs and a surface or a plurality of separate surfaces of a heat source is selected from the group consisting of;
(i) <
=200 um, (ii) <
=100 um, (iii) <
=50 um, (iv) <
=20 um, and (v) <
=10 um;c. at least one surface of a solid material separated from a surface or a plurality of separate surfaces of a heat source by a gap that is occupied by at least one highly conductive transfer material that may be a different solid, a semi-liquid, or a liquid wherein a thickness of the gap is selected from the group consisting of;
(i) <
=200 um, (ii) <
=100 um, (iii) <
=50 um, (iv) <
=20 um, and (v) <
=10 um); andd. at least one surface of a solid that is in intimate contact with a surface or a plurality of separate surfaces of a heat source; and (II) a plurality of post jetting microchannel flow paths to direct the heat transfer fluid from the primary heat exchange region to the at least one outlet header or manifold, wherein the at least one surface of the primary heat exchange region onto which jetting occurs is closer, in the jetting direction, to the surface or the plurality of separate surfaces of the heat source than are the microchannel flow paths; (2) at least one flow path to move heated fluid, directly or indirectly, from the from the fluid outlet header or manifold of the at least one micro cold plate to a heat exchanger; (3) at least one flow path to move cooled fluid, directly or indirectly, from the heat exchanger back into the inlet header or manifold of the at least one micro cold plate; and (4) at least one pump functionally configured to direct the fluid through the at least one cold plate to the heat exchanger and back to the at least one cold plate, wherein the heat transfer array is configured to withdraw heat from a semiconductor device, and wherein regions of the at least one surface of the primary heat exchange region onto which jetted fluid impinges are strengthened with a material different from that used to form the side walls of the jetting structures.
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36. A thermal management system for a semiconductor device comprising:
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(1) at least one micro cold plate, comprising; (a) at least one fluid inlet header or manifold; (b) at least one fluid outlet header or manifold; (c) a hybrid microjet and microchannel heat transfer array, comprising; (I) a plurality of microjet structures for directing a heat transfer fluid from the at least one fluid inlet header or manifold onto at least one surface of a primary heat exchange region selected from the group consisting of; a. a surface of a heat source or a plurality of separated surfaces of a heat source; b. at least one surface in proximity to one or more heat source surfaces wherein a separation distance between the at least one surface onto which jetting occurs and a surface or a plurality of separate surfaces of a heat source is selected from the group consisting of;
(i) <
=200 um, (ii) <
=100 um, (iii) <
=50 um, (iv) <
=20 um, and (v) <
=10 um;c. at least one surface of a solid material separated from a surface or a plurality of separate surfaces of a heat source by a gap that is occupied by at least one highly conductive transfer material that may be a different solid, a semi-liquid, or a liquid wherein a thickness of the gap is selected from the group consisting of;
(i) <
=200 um, (ii) <
=100 um, (iii) <
=50 um, (iv) <
=20 um, and (v) <
=10 um); andd. at least one surface of a solid that is in intimate contact with a surface or a plurality of separate surfaces of a heat source; and (II) a plurality of post jetting microchannel flow paths to direct the heat transfer fluid from the primary heat exchange region to the at least one outlet header or manifold, wherein the at least one surface of the primary heat exchange region onto which jetting occurs is closer, in the jetting direction, to the surface or the plurality of separate surfaces of the heat source than are the microchannel flow paths; (2) at least one flow path to move heated fluid, directly or indirectly, from the from the fluid outlet header or manifold of the at least one micro cold plate to a heat exchanger; (3) at least one flow path to move cooled fluid, directly or indirectly, from the heat exchanger back into the inlet header or manifold of the at least one micro cold plate; and (4) at least one pump functionally configured to direct the fluid through the at least one cold plate to the heat exchanger and back to the at least one cold plate, wherein the heat transfer array is configured to withdraw heat from a semiconductor device, and wherein the at least one surface of the primary heat exchange region comprises a plurality of jetting well surfaces surrounded by solid material that comprises a core material surrounded at least partially by a shell material wherein the core material has a higher thermal conductivity than does the shell material and also has a lower yield strength.
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Specification