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Micro heat transfer arrays, micro cold plates, and thermal management systems for cooling semiconductor devices, and methods for using and making such arrays, plates, and systems

  • US 9,953,899 B2
  • Filed: 09/30/2016
  • Issued: 04/24/2018
  • Est. Priority Date: 09/30/2015
  • Status: Active Grant
First Claim
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1. A method of cooling a semiconductor device, comprising:

  • (a) providing at least one heat transfer array, comprising a plurality of stacked and adhered layers comprising at least one metal wherein each of the at least one heat transfer array comprises a plurality of microjet structures;

    (b) placing the heat transfer array in physical contact with or in proximity to the semiconductor device to be cooled to form a primary heat transfer region having at least one cooling fluid impingement surface;

    (c) pumping a cooling fluid into at least one inlet of the heat transfer array such that the cooling fluid is jetted onto the impingement surface to extract heat therefrom, then passing the heated cooling fluid to at least one outlet of the heat transfer array, while continuing to extract heat from the heat transfer array, and then onto a heat exchanger where heat is removed from the cooling fluid to produce cooled cooling fluid; and

    (d) circulating the cooled cooling fluid from the heat exchanger back into the at least one inlet of the heat transfer array to repeat a flow cycle to draw heat from the at least one semiconductor device,wherein the plurality of microjet structures function as fins that contact the at least one cooling fluid impingement surface whereby a lowest portion of the plurality of microjet structures are in solid-to-solid contact with the at least one cooling fluid impingement surface while at least one opening exists in the jetting structures above the at least one cooling fluid impingement surface so that jetted fluid is free from enclosing jetting channels within the microjet structures to impinge on the at least one cooling fluid impingement surface.

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