Work pieces and methods of laser drilling through holes in substrates using an exit sacrificial cover layer
First Claim
1. A method of forming a through hole in a substrate by drilling, the method comprising:
- affixing an exit sacrificial cover layer to a laser beam exit surface of the substrate, wherein the exit sacrificial cover layer has a different composition than the substrate;
positioning a laser beam in a predetermined location relative to the substrate and corresponding to a desired location for the through hole;
forming the through hole by repeatedly pulsing the laser beam into an entrance surface of the substrate and through a bulk of the substrate; and
forming a hole in the exit sacrificial cover layer by repeatedly pulsing the laser beam into the through hole formed in the substrate such that the laser beam passes through the laser beam exit surface of the substrate and into the exit sacrificial cover layer,wherein a thickness of the exit sacrificial cover layer is greater than about 100 μ
m.
1 Assignment
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Accused Products
Abstract
Work pieces and methods of forming through holes in substrates are disclosed. In one embodiment, a method of forming a through hole in a substrate by drilling includes affixing an exit sacrificial cover layer to a laser beam exit surface of the substrate, positioning a laser beam in a predetermined location relative to the substrate and corresponding to a desired location for the through hole, and forming the through hole by repeatedly pulsing the laser beam into an entrance surface of the substrate and through a bulk of the substrate. The method further includes forming a hole in the exit sacrificial cover layer by repeatedly pulsing the laser beam into the through hole formed in the substrate such that the laser beam passes through the laser beam exit surface of the substrate and into the exit sacrificial cover layer.
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Citations
18 Claims
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1. A method of forming a through hole in a substrate by drilling, the method comprising:
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affixing an exit sacrificial cover layer to a laser beam exit surface of the substrate, wherein the exit sacrificial cover layer has a different composition than the substrate; positioning a laser beam in a predetermined location relative to the substrate and corresponding to a desired location for the through hole; forming the through hole by repeatedly pulsing the laser beam into an entrance surface of the substrate and through a bulk of the substrate; and forming a hole in the exit sacrificial cover layer by repeatedly pulsing the laser beam into the through hole formed in the substrate such that the laser beam passes through the laser beam exit surface of the substrate and into the exit sacrificial cover layer, wherein a thickness of the exit sacrificial cover layer is greater than about 100 μ
m. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16)
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17. A method of forming a through hole in a substrate by drilling, the method comprising:
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affixing an exit sacrificial cover layer to a laser beam exit surface of the substrate wherein the exit sacrificial cover layer has a different composition than the substrate; positioning a laser beam in a predetermined location relative to the substrate and corresponding to a desired location for the through hole; forming the through hole by repeatedly pulsing the laser beam into an entrance surface of the substrate and through a bulk of the substrate; and forming a hole in the exit sacrificial cover layer by repeatedly pulsing the laser beam into the through hole formed in the substrate such that the laser beam passes through the laser beam exit surface of the substrate and into the exit sacrificial cover layer, wherein the exit sacrificial cover layer is a glass layer.
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18. A method of forming a through hole in a substrate by drilling, the method comprising:
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affixing an exit sacrificial cover layer to a laser beam exit surface of the substrate wherein the exit sacrificial cover layer has a different composition than the substrate; positioning a laser beam in a predetermined location relative to the substrate and corresponding to a desired location for the through hole; forming the through hole by repeatedly pulsing the laser beam into an entrance surface of the substrate and through a bulk of the substrate; forming a hole in the exit sacrificial cover layer by repeatedly pulsing the laser beam into the through hole formed in the substrate such that the laser beam passes through the laser beam exit surface of the substrate and into the exit sacrificial cover layer; and applying a fluid to at least one of the exit sacrificial cover layer and the laser beam exit surface of the substrate before attaching the exit sacrificial cover layer to the laser beam exit surface of the substrate.
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Specification