×

Package substrate and package structure using the same

  • US 9,953,956 B2
  • Filed: 03/18/2016
  • Issued: 04/24/2018
  • Est. Priority Date: 03/18/2015
  • Status: Active Grant
First Claim
Patent Images

1. A package substrate, comprising:

  • a base layer having a first surface and a second surface opposite to the first surface;

    a plurality of through holes penetrating through the base layer;

    a first metal layer disposed on the first surface and comprising an encircling portion and a plurality of upper pads arranged separately, wherein the encircling portion surrounds the upper pads to form a closed-loop trench between the encircling portion and the upper pads, and at least one gap between the upper pads intercommunicates with the closed-loop trench; and

    a second metal layer disposed on the second surface comprising a plurality of bottom pads arranged separately, wherein the bottom pads are electrically connected to the upper pads via the through holes respectively;

    wherein the through holes are positioned under the upper pads and the encircling portion of the first metal layer is electrically floating.

View all claims
  • 3 Assignments
Timeline View
Assignment View
    ×
    ×