Semiconductor device and method of manufacturing same
First Claim
1. A semiconductor device, comprising:
- a semiconductor substrate having a first surface and a second surface, which is a surface on a side of the semiconductor substrate opposite to the first surface;
a drain region in the semiconductor substrate proximal to the second surface and having a first conductivity type;
a drift region in the semiconductor substrate between the first surface and the drain region, and having the first conductivity type;
a base region in the semiconductor substrate between the first surface and the drift region, and having a second conductivity type;
a source region in the semiconductor substrate at the first surface, and having the first conductivity type, the base region being sandwiched between the source region and the drift region;
a gate electrode opposite to the base region sandwiched between the drift region and the source region, the gate electrode being insulated from the base region;
a wiring provided over the first surface and electrically coupled to the source region; and
a first conductive film provided over the first surface and electrically coupled to the drain region,wherein the first conductive film is, over the first surface, opposite to the wiring while being insulated therefrom.
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Accused Products
Abstract
To provide a semiconductor device less affected by noise without making a manufacturing process more complicated and increasing a chip area. The device has a semiconductor substrate having first and second surfaces, a first-conductivity-type drain region on the second surface side in the semiconductor substrate, a first-conductivity-type drift region on the first surface side of a substrate region, a second-conductivity-type base region on the first surface side of the drift region, a first-conductivity-type source region on the first surface of the semiconductor substrate sandwiching a base region between the source and drift regions, a gate electrode opposite to and insulated from the base region, a wiring on the first main surface electrically coupled to the source region, and a first conductive film on the first main surface, opposite to and insulated from the wiring, and electrically coupled to the substrate region.
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Citations
19 Claims
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1. A semiconductor device, comprising:
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a semiconductor substrate having a first surface and a second surface, which is a surface on a side of the semiconductor substrate opposite to the first surface; a drain region in the semiconductor substrate proximal to the second surface and having a first conductivity type; a drift region in the semiconductor substrate between the first surface and the drain region, and having the first conductivity type; a base region in the semiconductor substrate between the first surface and the drift region, and having a second conductivity type; a source region in the semiconductor substrate at the first surface, and having the first conductivity type, the base region being sandwiched between the source region and the drift region; a gate electrode opposite to the base region sandwiched between the drift region and the source region, the gate electrode being insulated from the base region; a wiring provided over the first surface and electrically coupled to the source region; and a first conductive film provided over the first surface and electrically coupled to the drain region, wherein the first conductive film is, over the first surface, opposite to the wiring while being insulated therefrom. - View Dependent Claims (2, 3, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19)
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4. A semiconductor device, comprising:
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a semiconductor substrate having a first surface and a second surface, which is a surface on a side of the semiconductor substrate opposite to the first surface; a drain region in the semiconductor substrate proximal to the second surface, and having a first conductivity type; a drift region in the semiconductor substrate between the first surface and the drain region, and having the first conductivity type; a base region in the semiconductor substrate between the first surface and the drift region, and having a second conductivity type; a source region in the semiconductor substrate at the first surface, and having the first conductivity type, the base region being sandwiched between the source region and the drift region; a gate electrode opposite to the base region sandwiched between the drift region and the source region, the gate electrode being insulated from the base region; a wiring provided over the first surface and electrically coupled to the source region; a first conductive film provided over the first surface and electrically coupled to the drain region; a first interlayer insulating film provided between the wiring and the first surface; and a second conductive film placed over the first surface and coupled to the source region, wherein the first conductive film is, over the first surface, opposite to the wiring while being insulated therefrom, wherein the first conductive film is provided in the first interlayer insulating film, and wherein the second conductive film is opposite to the first conductive film while being insulated therefrom. - View Dependent Claims (5, 6, 7, 8)
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Specification