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Inverter device

  • US 9,954,459 B2
  • Filed: 02/15/2016
  • Issued: 04/24/2018
  • Est. Priority Date: 02/24/2015
  • Status: Expired due to Fees
First Claim
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1. An inverter apparatus comprising:

  • a plurality of semiconductor power modules arranged to form phase arms each of which includes a set of the semiconductor power modules connected in series between a positive pole and a negative pole of a dc circuit, for one of phases;

    a heat sink section attached to the semiconductor power modules;

    positive and negative connection conductors arranged to serve, respectively, as the positive pole and the negative pole of the de circuit, each of the phase arms for one of the phases being connected between the positive and negative connection conductors;

    a smoothing capacitor connected between the positive and negative connection conductors; and

    output conductors each of which is connected with ac output terminals of the semiconductor power modules of one of the phase arms;

    wherein the semiconductor power modules of the phase arms are arranged so that the semiconductor power modules connected with the positive connection conductor are stacked, the semiconductor power modules connected with the negative connection conductor are stacked, and there is formed an interspace between a heat sink which is included in the heat sink section and attached to the semiconductor power modules connected with the positive connection conductor for the positive pole and a heat sink which is included in the heat sink section and attached to the semiconductor power modules connected with the negative connection conductor for the negative pole;

    the positive and negative connection conductors for the positive and negative poles of the de circuit are extended along each other with an insulator interposed between the positive and negative connection conductors, through the interspace between three heat sinks;

    the positive connection conductor includes a first end fixed to a connection terminal of each of the semiconductor power modules for the positive pole, and a second end taken out through the interspace between the heat sinks, and the negative connection conductor includes a first end fixed to a connection terminal of each of the semiconductor power modules for the negative pole, and a second end taken out through the interspace between the heat sinks;

    the smoothing capacitor is attached to the connection conductors taken out from the interspace; and

    each of the output conductors is connected with the ac output terminal of the semiconductor power modules of a corresponding one of the phase arms, in a region near the connection terminals of the semiconductor power modules, in a state in which portions of the output conductors extend along each other in a direction substantially perpendicular to a direction in which portions of the connection conductors extend.

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