Features of a flexible connector in a portable computing device

• US 9,955,570 B2
• Filed: 12/18/2015
• Issued: 04/24/2018
• Est. Priority Date: 01/09/2015
• Status: Active Grant

• Current Assignee: Apple Inc.
• Original Assignee: Apple Inc.
• Inventors: Blum, Matthew W., Laliberte, Christine A., Axelowitz, Corey N., Yap, James Y.
• Primary Examiner(s): Tran, Binh
• Application Number:
  US14/975,581
• Publication Number:
  US 20160205766A1
• Time in Patent Office: 858 Days
• Field of Search: 361749, 361752, 361753, 361760, 361764, 361780, 361783, 361784, 361785, 361789, 361796, 361800, 361816, 361818
• CPC Class Codes: H05K 1/0216 Reduction of cross-talk, noise or electromagnetic interference grounding H05K1/0215
• CPC Class Codes: H05K 1/0218 by printed shielding conductors, ground planes or power plane H05K1/0236 takes precedence
• CPC Class Codes: H05K 1/028 Bending or folding regions of flexible printed circuits H05K1/0283 takes precedence
• CPC Class Codes: H05K 1/118 specially for flexible printed circuits, e.g. using folded portions
• CPC Class Codes: H05K 1/14 Structural association of two or more printed circuits providing electric connection to or between printed circuits H05K1/11, H01R12/00
• CPC Class Codes: H05K 1/147 at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit H05K1/148 takes precedence
• CPC Class Codes: H05K 1/181 associated with surface mounted components
• CPC Class Codes: H05K 1/189 characterised by the use of a flexible or folded printed circuit H05K3/326 takes precedence
• CPC Class Codes: H05K 2201/05 Flexible printed circuits [FPCs]
• CPC Class Codes: H05K 2201/056 Folded around rigid support or component
• CPC Class Codes: H05K 2201/0715 provided by an outer layer of PCB
• CPC Class Codes: H05K 5/0247 Electrical details of casings, e.g. terminals, passages for cables or wiring

Abstract

The subject matter of this disclosure relates to a flexible circuit for carrying a signal between electrical components that includes boosting circuitry for mitigating the effects of signal degradation. More particularly the flexible circuit can carry a signal between a main logic board and an input/output board supporting input/output ports of a portable electronic device. The flexible circuit can be configured with bends in order to meet packaging constraints such as avoiding contact with components obstructing a direct path between connectors of the electrical components. Additional bends can also be included in the flexible that facilitate the assembly of the portable electronic device.

Claims

1. A flexible circuit assembly, comprising:

a flexible substrate comprising a power layer and a data layer, the data layer and the power layer defining a first bend and a second bend oriented in a different direction than the first bend;

a first connector at a first end of the flexible substrate, the first connector configured to connect to a first component;

a second connector at a second end of the flexible substrate, the first connector configured to connect to a second component, wherein the first bend and the second bend cooperate to accommodate relative motion, in at least two dimensions, between the first component and the second component; and

a booster assembly integrated with the flexible substrate, the booster assembly capable of amplifying signals passing through the data layer, the booster assembly electrically coupled with the power layer and the data layer, wherein the booster assembly comprises;

a first data layer configured to carry data signals in accordance with a first bandwidth;

a second data layer configured to carry data signals in accordance with a second bandwidth different from the first bandwidth; and

a grounding layer positioned between the first data layer and the second data layer.

2. The flexible circuit assembly as recited in claim 1, wherein the booster assembly comprises a signal boosting component that is shielded by an electromagnetic interference (EMI) shield that is surface mounted to the flexible substrate.

3. The flexible circuit assembly as recited in claim 2, wherein a metal stiffener is mounted to the flexible substrate opposite the EMI shield.

4. The flexible circuit assembly as recited in claim 1, wherein the flexible substrate is split at a location corresponding to at least one of the first bend and the second bend such that the data layer and the power layer are separated by an air gap.

5. The flexible circuit assembly as recited in claim 1, wherein the data layer and the power layer further define a third bend, wherein the first bend and the third bend combine to position the first connector over a portion of the flexible substrate.

6. The flexible circuit assembly as recited in claim 1, further comprising:

a first shield layer and a second shield layer that combines with the first shield layer to surround the first data layer, the second data layer, and the grounding layer; and

an electromagnetic interference (EMI) shield that combines with first shield layer to surround and protect a signal boosting component of the booster assembly; and

an electrically conductive gasket that provides an electrical grounding pathway for the EMI shield.

7. An electronic device, comprising:

a device housing that defines an internal volume that carries electrical components;

a port arranged along an exterior surface of the device housing, the port configured to receive data signals and system power; and

a flexible circuit assembly disposed in the internal volume, the flexible circuit assembly configured to route the data signals and the system power received at the data port to the electrical components, the flexible circuit assembly comprising;

a flexible substrate having a first shield layer, and

a booster assembly comprising a signal boosting component that is surface mounted to the flexible substrate, the booster assembly amplifying signal strength of the data signals travelling through the flexible substrate, the booster assembly comprising;

a signal boosting component configured to amplify the signal strength of the data signals,

an electromagnetic interference (EMI) shield that combines with the first shield layer to surround and protect the signal boosting component, and

an electrically conductive gasket that provides an electrical grounding pathway between the EMI shield and the device housing.

8. The electronic device as recited in claim 7, wherein the flexible substrate comprises a data layer and a power layer.

9. The electronic device as recited in claim 8, wherein the flexible substrate further comprises a a second shield layer that combines with the first shield layer to shield the data layer and the power layer from electromagnetic interference (EMI) and provide a grounding pathway for the signal boosting component.

10. The electronic device as recited in claim 7, wherein the power and data layers of one portion of the flexible substrate are separated at a bend region of the flexible substrate.

11. A flexible circuit assembly, comprising:

a flexible substrate comprising a data layer and a power layer;

an electrical assembly that is surface mounted to an exterior surface of the flexible substrate and in electrical contact with the data layer and the power layer, the electrical assembly including a signal boosting component covered by an electromagnetic interference (EMI) shield, the signal boosting component configured to amplify signals routed through the data layer;

electrical connectors connected to opposite ends of the flexible substrate, the electrical connectors capable of electrically connecting to electrical components and pass the signals that are amplified by the signal boosting component; and

an electrically conductive gasket secured to an exterior surface of the EMI shield and providing a grounding path for electricity within the EMI shield to travel from the EMI shield to an electrical ground.

12. The flexible circuit assembly as recited in claim 11, wherein the EMI shield is surface mounted to and electrically grounded through the flexible substrate.

13. The flexible circuit assembly as recited in claim 11, further comprising a multiplexing component that separates at least one of the signals routed through the data layer into multiple signals.

14. The flexible circuit assembly as recited in claim 13, wherein each signal that is separated corresponds to a different type of standard data port.

15. The flexible circuit assembly as recited in claim 11, wherein the electrical assembly is powered by power supplied through the power layer.

16. The flexible circuit assembly as recited in claim 11, wherein the data layer is a high speed data layer that processes signals in accordance with a first bandwidth, and wherein the flexible substrate further comprises:

a grounding layer positioned between the power layer and the high speed data layer;

a low speed data layer positioned between the power layer and the high speed data layer, the low speed data layer configured to process the signals in accordance with a second bandwidth that is different from the first bandwidth.

17. The flexible circuit assembly as recited in claim 11, wherein the flexible substrate includes at least two overlapping bend regions that accommodate relative motion of components electrically connected by the substrate.

18. The flexible circuit assembly as recited in claim 11, wherein the electrical connectors include a first connector configured connect to first component and a second connector configured to connect to a second component, and wherein the flexible substrate defines a first bend and a second bend that cooperates with the first bend to accommodate relative motion, in at least two dimensions, between the first component and the second component.