Bypass techniques to protect noise sensitive circuits within integrated circuit chips

• US 9,960,756 B1
• Filed: 12/02/2016
• Issued: 05/01/2018
• Est. Priority Date: 12/02/2016
• Status: Active Grant

• Current Assignee: Silicon Laboratories Incorporated
• Original Assignee: Silicon Laboratories Incorporated
• Inventors: Harwalkar, Navin
• Primary Examiner(s): Hernandez, William
• Application Number:
  US15/367,560
• Time in Patent Office: 515 Days
• Field of Search: 327379, 327551
• CPC Class Codes: H01L 2223/6611 Wire connections
• CPC Class Codes: H01L 2223/6655 Matching arrangements, e.g. arrangement of inductive and capacitive components
• CPC Class Codes: H01L 2224/04042 Bonding areas specifically adapted for wire connectors, e.g. wirebond pads
• CPC Class Codes: H01L 2224/45099 Material
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/49175 Parallel arrangements
• CPC Class Codes: H01L 23/552 Protection against radiation, e.g. light or electromagnetic waves
• CPC Class Codes: H01L 23/64 Impedance arrangements
• CPC Class Codes: H01L 23/66 High-frequency adaptations
• CPC Class Codes: H01L 24/48 of an individual wire connector
• CPC Class Codes: H01L 24/49 of a plurality of wire connectors
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/14 Integrated circuits
• CPC Class Codes: H01L 2924/1421 RF devices
• CPC Class Codes: H01L 2924/30107 Inductance
• CPC Class Codes: H01L 2924/3011 Impedance
• CPC Class Codes: H01L 2924/3025 Electromagnetic shielding
• CPC Class Codes: H03F 1/223 with MOSFET's
• CPC Class Codes: H03F 2200/114 the amplifier comprising means for electro-magnetic interference [EMI] protection
• CPC Class Codes: H03F 2200/294 the amplifier being a low noise amplifier [LNA]
• CPC Class Codes: H03F 2200/372 : Noise reduction and elimination in amplifier
• CPC Class Codes: H03F 2200/451 : the amplifier being a radio frequency amplifier
• CPC Class Codes: H03F 3/195 : in integrated circuits
• CPC Class Codes: H03K 19/00346 : Modifications for eliminating interference or parasitic voltages or currents
• CPC Class Codes: H03K 5/1252 : Suppression or limitation of noise or interference specially adapted for transmission systems H04B15/00, H04L25/08
• CPC Class Codes: H05K 1/0216 : Reduction of cross-talk, noise or electromagnetic interference grounding H05K1/0215
• CPC Class Codes: H05K 1/023 : using auxiliary mounted passive components or auxiliary substances printed passive components H05K1/16
• CPC Class Codes: H05K 1/0243 : Printed circuits associated with mounted high frequency components
• CPC Class Codes: H05K 2203/049 : Wire bonding
• CPC Class Codes: H05K 3/328 : by welding

Abstract

Bypass techniques are provided herein to protect noise sensitive circuits from both internal and external noise sources. According to one embodiment, an integrated circuit (IC) chip may include a noise sensitive circuit coupled between a power supply pad and a first ground pad of the IC chip. In order to protect the first ground pad of the noise sensitive circuit, two distinct bypass paths are provided to route noise current around the noise sensitive circuit. Each bypass path terminates in its own ground pad (e.g., a second ground pad and third ground pad), which is separate from the first ground pad of the noise sensitive circuit.

Claims

1. An integrated circuit (IC) chip, comprising:

a circuit coupled between a power supply pad and a first ground pad of the IC chip;

a first bypass path coupled between the power supply pad and a second ground pad of the IC chip, the first bypass path providing a path for noise current around the circuit; and

a second bypass path coupled between the power supply pad and a third ground pad of the IC chip, the second bypass path providing a path for noise current around the circuit;

wherein the second and third ground pads are separate from the first ground pad.

2. The integrated circuit chip as recited in claim 1, wherein the IC chip further comprises an additional circuit coupled to the circuit, the additional circuit being a source of the noise current, which is generated within the IC chip and routed around the circuit via the first and second bypass paths.

3. The integrated circuit chip as recited in claim 1, wherein the first and second bypass paths each comprise a low impedance circuit, which is configured to present a low impedance to the noise current.

4. The integrated circuit chip as recited in claim 3, wherein the second and third ground pads of the IC chip are configured to be coupled to a ground conductor on a printed circuit board by separate bond wires, and wherein the low impedance provided by the low impedance circuits is at least 10 times less than an impedance of the bond wires.

5. The integrated circuit chip as recited in claim 3, further comprising a high impedance circuit, which is coupled between the first and second bypass paths and coupled in series between the power supply pad and a power supply input of the circuit, wherein the high impedance circuit is configured to present a high impedance to the noise current.

6. The integrated circuit chip as recited in claim 5, wherein the high impedance provided by the high impedance circuit is about 10 times to about 100 times larger than the low impedance provided by the low impedance circuits.

7. The integrated circuit chip as recited in claim 5, wherein the low impedance circuit of the first bypass path comprises a first capacitor coupled between a first node of the high impedance circuit and the second ground pad, and wherein the low impedance circuit of the second bypass path comprises a second capacitor coupled between a second node of the high impedance circuit and the third ground pad.

8. The integrated circuit chip as recited in claim 7, wherein the high impedance circuit is coupled between the first and second capacitors, and comprises a resistor or an inductor.

9. The integrated circuit chip as recited in claim 7, wherein the low impedance circuit of the first bypass path further comprises a first inductor coupled in series with the first capacitor to form a first LC resonant circuit, and wherein the low impedance circuit of the second bypass path further comprises a second inductor coupled in series with the second capacitor to form a second LC resonant circuit.

10. The integrated circuit chip as recited in claim 9, wherein the high impedance circuit is coupled between the first and second LC resonant circuits, and wherein the high impedance circuit comprises a third inductor coupled in parallel with a third capacitor to form a third LC resonant circuit.

11. An electronic system, comprising:

a printed circuit board having at least one power conductor and at least one ground conductor;

at least one integrated circuit (IC) chip mounted onto the printed circuit board, wherein the at least one IC chip comprises;

a power supply pad coupled to the at least one power conductor;

a first ground pad, a second ground pad and a third ground pad, each separately coupled to the at least one ground conductor;

a circuit coupled between the power supply pad and the first ground pad;

a first bypass path coupled between the power supply pad and the second ground pad, the first bypass path providing a path for noise current around the circuit to the second ground pad; and

a second bypass path coupled between the power supply pad and the third ground pad, the second bypass path providing a path for noise current around the circuit to the third ground pad.

12. The electronic system as recited in claim 11, wherein the IC chip further comprises an additional circuit coupled to the circuit, the additional circuit being a source of noise current within the IC chip.

13. The electronic system as recited in claim 12, wherein the additional circuit comprises a voltage regulator coupled between the power supply pad and a power supply input of the circuit, and wherein the voltage regulator generates at least a portion of the noise current.

14. The electronic system as recited in claim 12, wherein the first bypass path is coupled between an output of the additional circuit and the second ground pad, and wherein the second bypass path is coupled between the power supply input of the circuit and the third ground pad.

15. The electronic system as recited in claim 14, wherein the first and second bypass paths each comprise a low impedance circuit, which is configured to present a low impedance to the noise current.

16. The electronic system as recited in claim 15, wherein the IC chip further comprises a high impedance circuit, which is coupled between the first and second bypass paths, coupled in series between the output of the additional circuit and the power supply input of the circuit, and configured to present a high impedance to the noise current.

17. The electronic system as recited in claim 16, wherein the high impedance provided by the high impedance circuit is about 10 times to about 100 times larger than the low impedance provided by the low impedance circuits.

18. The electronic system as recited in claim 16, wherein the second and third ground pads are coupled to the at least one ground conductor of the printed circuit board by separate bond wires, and wherein the low impedance provided by the low impedance circuits is at least 10 times less than an impedance of the bond wires.

19. The electronic system as recited in claim 16, wherein the low impedance circuit of the first bypass path comprises a first capacitor coupled between a first node of the high impedance circuit and the second ground pad, and wherein the low impedance circuit of the second bypass path comprises a second capacitor coupled between a second node of the high impedance circuit and the third ground pad, and wherein the high impedance circuit is coupled between the first and second capacitors, and comprises a resistor or an inductor.

20. The electronic system as recited in claim 19, wherein the low impedance circuit of the first bypass path further comprises a first inductor coupled in series with the first capacitor to form a first LC resonant circuit, and wherein the low impedance circuit of the second bypass path further comprises a second inductor coupled in series with the second capacitor to form a second LC resonant circuit.

21. The electronic system as recited in claim 20, wherein the high impedance circuit is coupled between the first and second LC resonant circuits, and wherein the high impedance circuit comprises a third inductor coupled in parallel with a third capacitor to form a third LC resonant circuit.

22. The electronic system as recited in claim 11, wherein the IC chip comprises a radio frequency (RF) or analog front end, and wherein the circuit comprises a single-ended amplifier.

23. The electronic system as recited in claim 22, wherein the circuit comprises a single-ended Low Noise Amplifier (LNA).

24. A method to bypass noise in an integrated circuit (IC) chip, comprising:

operating an integrated circuit (IC) chip, the IC chip including a circuit coupled between a power supply pad and a first ground pad of the IC chip, a first bypass path coupled between the power supply pad and a second ground pad of the IC chip, and a second bypass path coupled between the power supply pad and a third ground pad of the IC chip;

receiving noise current associated with operation of the IC chip; and

bypassing the noise current around the circuit using the first bypass path and the second bypass path.

25. The method as recited in claim 24, further comprising operating an additional circuit coupled to the circuit within the IC chip, the additional circuit being a source of the noise current.

26. The method as recited in claim 24, wherein the first and second bypass paths each comprise a low impedance circuit, which is configured to present a low impedance to the noise current.

27. The method as recited in claim 26, wherein the second and third ground pads of the IC chip are configured to be coupled to a ground conductor on a printed circuit board by separate bond wires, and wherein the low impedance provided by the low impedance circuits is at least 10 times less than an impedance of the bond wires.

28. The method as recited in claim 26, wherein the IC chip further comprises a high impedance circuit coupled between the first and second bypass paths and coupled in series between the power supply pad and a power supply input of the circuit, wherein the high impedance circuit is configured to present a high impedance to the noise current.

29. The method as recited in claim 28, wherein the high impedance provided by the high impedance circuit is about 10 times to about 100 times larger than the low impedance provided by the low impedance circuits.