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Vehicle vision system with camera having molded interconnect device

  • US 9,961,241 B2
  • Filed: 07/31/2015
  • Issued: 05/01/2018
  • Est. Priority Date: 08/04/2014
  • Status: Active Grant
First Claim
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1. A camera for a vision system of a vehicle, said camera comprising:

  • a housing comprising a front housing portion and a rear housing portion;

    wherein said camera is configured to be disposed at a vehicle so as to have a field of view interior or exterior of the vehicle;

    wherein said front housing portion houses a lens assembly;

    wherein said rear housing portion has a connector portion for electrically connecting circuitry of said camera to an electrical connector of the vehicle when said camera is disposed at the vehicle;

    wherein said rear housing portion comprises a first printed circuit board at a first structure and a second printed circuit board at a second structure;

    wherein said front housing portion is mated with said rear housing portion to house said first and second printed circuit boards;

    wherein said first printed circuit board has a first surface and a second surface opposite said first surface, said second surface of said first printed circuit board contacting said first structure of said rear housing portion;

    wherein said second printed circuit board has a first surface and a second surface opposite said first surface, said second surface of said second printed circuit board contacting said second structure of said rear housing portion;

    wherein said second printed circuit board has an imager disposed at said first surface of said second printed circuit board, and wherein said imager comprises an imaging array having a plurality of photosensing elements;

    wherein said rear housing portion comprises electrically connecting elements established at and between said first structure and said second structure via molded interconnect device (MID) technology;

    wherein said electrically connecting elements electrically connect between electrical contacts at said first structure and electrical contacts at said second structure;

    wherein said imager is electrically connected to connecting pads at said second surface of said second printed circuit board, and wherein said connecting pads at said second surface of said second printed circuit board electrically connect at said electrical contacts at said second structure; and

    wherein said first printed circuit board has first circuitry disposed at said first surface of said first printed circuit board, and wherein said first circuitry is electrically connected to connecting pads at said second surface of said first printed circuit board, and wherein said connecting pads at said second surface of said first printed circuit board electrically connect at said electrical contacts at said first structure.

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