Vehicle vision system with camera having molded interconnect device
First Claim
1. A camera for a vision system of a vehicle, said camera comprising:
- a housing comprising a front housing portion and a rear housing portion;
wherein said camera is configured to be disposed at a vehicle so as to have a field of view interior or exterior of the vehicle;
wherein said front housing portion houses a lens assembly;
wherein said rear housing portion has a connector portion for electrically connecting circuitry of said camera to an electrical connector of the vehicle when said camera is disposed at the vehicle;
wherein said rear housing portion comprises a first printed circuit board at a first structure and a second printed circuit board at a second structure;
wherein said front housing portion is mated with said rear housing portion to house said first and second printed circuit boards;
wherein said first printed circuit board has a first surface and a second surface opposite said first surface, said second surface of said first printed circuit board contacting said first structure of said rear housing portion;
wherein said second printed circuit board has a first surface and a second surface opposite said first surface, said second surface of said second printed circuit board contacting said second structure of said rear housing portion;
wherein said second printed circuit board has an imager disposed at said first surface of said second printed circuit board, and wherein said imager comprises an imaging array having a plurality of photosensing elements;
wherein said rear housing portion comprises electrically connecting elements established at and between said first structure and said second structure via molded interconnect device (MID) technology;
wherein said electrically connecting elements electrically connect between electrical contacts at said first structure and electrical contacts at said second structure;
wherein said imager is electrically connected to connecting pads at said second surface of said second printed circuit board, and wherein said connecting pads at said second surface of said second printed circuit board electrically connect at said electrical contacts at said second structure; and
wherein said first printed circuit board has first circuitry disposed at said first surface of said first printed circuit board, and wherein said first circuitry is electrically connected to connecting pads at said second surface of said first printed circuit board, and wherein said connecting pads at said second surface of said first printed circuit board electrically connect at said electrical contacts at said first structure.
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Accused Products
Abstract
A camera for a vision system of a vehicle includes a housing having a front housing portion and a rear housing portion. The camera is configured to be disposed at a vehicle so as to have a field of view interior or exterior of the vehicle. The front housing portion houses a lens assembly. The rear housing portion has a connector portion for electrically connecting circuitry of the camera to an electrical connector of the vehicle when the camera is disposed at the vehicle. The circuitry of the camera includes an imager comprising an imaging array having a plurality of photosensing elements. The rear housing portion has circuitry and electrically connecting elements established via molded interconnect device (MID) technology.
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Citations
20 Claims
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1. A camera for a vision system of a vehicle, said camera comprising:
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a housing comprising a front housing portion and a rear housing portion; wherein said camera is configured to be disposed at a vehicle so as to have a field of view interior or exterior of the vehicle; wherein said front housing portion houses a lens assembly; wherein said rear housing portion has a connector portion for electrically connecting circuitry of said camera to an electrical connector of the vehicle when said camera is disposed at the vehicle; wherein said rear housing portion comprises a first printed circuit board at a first structure and a second printed circuit board at a second structure; wherein said front housing portion is mated with said rear housing portion to house said first and second printed circuit boards; wherein said first printed circuit board has a first surface and a second surface opposite said first surface, said second surface of said first printed circuit board contacting said first structure of said rear housing portion; wherein said second printed circuit board has a first surface and a second surface opposite said first surface, said second surface of said second printed circuit board contacting said second structure of said rear housing portion; wherein said second printed circuit board has an imager disposed at said first surface of said second printed circuit board, and wherein said imager comprises an imaging array having a plurality of photosensing elements; wherein said rear housing portion comprises electrically connecting elements established at and between said first structure and said second structure via molded interconnect device (MID) technology; wherein said electrically connecting elements electrically connect between electrical contacts at said first structure and electrical contacts at said second structure; wherein said imager is electrically connected to connecting pads at said second surface of said second printed circuit board, and wherein said connecting pads at said second surface of said second printed circuit board electrically connect at said electrical contacts at said second structure; and wherein said first printed circuit board has first circuitry disposed at said first surface of said first printed circuit board, and wherein said first circuitry is electrically connected to connecting pads at said second surface of said first printed circuit board, and wherein said connecting pads at said second surface of said first printed circuit board electrically connect at said electrical contacts at said first structure. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12)
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13. A camera for a vision system of a vehicle, said camera comprising:
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a housing comprising a front housing portion and a rear housing portion; wherein said camera is configured to be disposed at a vehicle so as to have a field of view interior or exterior of the vehicle; wherein said front housing portion houses a lens assembly; wherein said rear housing portion has a connector portion for electrically connecting circuitry of said camera to an electrical connector of the vehicle when said camera is disposed at the vehicle; wherein said rear housing portion comprises a first printed circuit board at a first structure and a second printed circuit board at a second structure; wherein said front housing portion is mated with said rear housing portion to house said first and second printed circuit boards; wherein said first printed circuit board has a first surface and a second surface opposite said first surface, said second surface of said first printed circuit board contacting said first structure of said rear housing portion; wherein said second printed circuit board has a first surface and a second surface opposite said first surface, said second surface of said second printed circuit board contacting said second structure of said rear housing portion; wherein said second printed circuit board has an imager disposed at said first surface of said second printed circuit board, and wherein said imager comprises an imaging array having a plurality of photosensing elements; wherein said rear housing portion comprises electrically connecting elements established at and between said first structure and said second structure via molded interconnect device (MID) technology; wherein said electrically connecting elements electrically connect between electrical contacts at said first structure and electrical contacts at said second structure; wherein said imager is electrically connected to connecting pads at said second surface of said second printed circuit board, and wherein said connecting pads at said second surface of said second printed circuit board electrically connect at said electrical contacts at said second structure; and wherein said first printed circuit board has first circuitry disposed at said first surface of said first printed circuit board, and wherein said first circuitry is electrically connected to connecting pads at said second surface of said first printed circuit board, and wherein said connecting pads at said second surface of said first printed circuit board electrically connect at said electrical contacts at said first structure; wherein said electrically connecting elements are applied by MID technology at an inner surface of said rear housing portion; wherein said front housing portion has electrically connecting elements established via molded interconnect device (MID) technology; and wherein said electrically connecting elements of said front housing portion electrically connect to said electrically connecting elements of said rear housing portion when said front and rear housing portions are mated together. - View Dependent Claims (14, 15, 16, 17)
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18. A camera for a vision system of a vehicle, said camera comprising:
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a housing comprising a front housing portion and a rear housing portion; wherein said camera is configured to be disposed at a vehicle so as to have a field of view interior or exterior of the vehicle; wherein said front housing portion houses a lens assembly; wherein said rear housing portion has a connector portion for electrically connecting circuitry of said camera to an electrical connector of the vehicle when said camera is disposed at the vehicle; wherein said rear housing portion comprises a first printed circuit board at a first structure and a second printed circuit board at a second structure; wherein said front housing portion is mated with said rear housing portion to house said first and second printed circuit boards; wherein said first printed circuit board has a first surface and a second surface opposite said first surface, said second surface of said first printed circuit board contacting said first structure of said rear housing portion; wherein said second printed circuit board has a first surface and a second surface opposite said first surface, said second surface of said second printed circuit board contacting said second structure of said rear housing portion; wherein said second printed circuit board has an imager disposed at said first surface of said second printed circuit board, and wherein said imager comprises an imaging array having a plurality of photosensing elements; wherein said rear housing portion comprises electrically connecting elements established at and between said first structure and said second structure via molded interconnect device (MID) technology; wherein said electrically connecting elements electrically connect between electrical contacts at said first structure and electrical contacts at said second structure; wherein said imager is electrically connected to connecting pads at said second surface of said second printed circuit board, and wherein said connecting pads at said second surface of said second printed circuit board electrically connect at said electrical contacts at said second structure; and wherein said first printed circuit board has first circuitry disposed at said first surface of said first printed circuit board, and wherein said first circuitry is electrically connected to connecting pads at said second surface of said first printed circuit board, and wherein said connecting pads at said second surface of said first printed circuit board electrically connect at said electrical contacts at said first structure; wherein said electrically connecting elements are applied by MID technology at an inner surface of said rear housing portion; and wherein circuitry of said first and second printed circuit boards disposed in said rear housing portion is electrically connected to said electrically connecting elements of said rear housing portion when said first and second printed circuit boards are disposed in said rear housing portion and contact said electrical contacts at the respective ones of said first structure and said second structure. - View Dependent Claims (19, 20)
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Specification