Method for producing an electronic assembly

• US 9,961,779 B2
• Filed: 12/10/2013
• Issued: 05/01/2018
• Est. Priority Date: 12/20/2012
• Status: Active Grant

• Current Assignee: Continental Teves AG & Co. OHG (Continental AG)
• Original Assignee: Continental Teves AG & Co. OHG (Continental AG)
• Inventors: Biebricher, Lothar, Schulmeister, Michael, Schillinger, Jakob, Huber, Dietmar, Fischer, Thomas, Gnthner, Stefan, Baumung, Waldemar
• Primary Examiner(s): Semenenko, Yuriy
• Application Number:
  US14/652,507
• Publication Number:
  US 20150351252A1
• Time in Patent Office: 1,603 Days
• CPC Class Codes: H01L 2224/0401 Bonding areas specifically adapted for bump connectors, e.g. under bump metallisation [UBM]
• CPC Class Codes: H01L 2224/04042 Bonding areas specifically adapted for wire connectors, e.g. wirebond pads
• CPC Class Codes: H01L 2224/16145 the bodies being stacked
• CPC Class Codes: H01L 2224/291 with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
• CPC Class Codes: H01L 2224/2919 with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
• CPC Class Codes: H01L 2224/32245 the item being metallic
• CPC Class Codes: H01L 2224/45015 being circular
• CPC Class Codes: H01L 2224/45099 Material
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48137 the bodies being arranged next to each other, e.g. on a common substrate
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/49171 Fan-out arrangements
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 23/3121 a substrate forming part of the encapsulation
• CPC Class Codes: H01L 23/3128 the substrate having spherical bumps for external connection
• CPC Class Codes: H01L 23/3135 Double encapsulation or coating and encapsulation
• CPC Class Codes: H01L 23/495 Lead-frames or other flat leads H01L23/498 takes precedence; lead frame interconnections between components H01L23/52
• CPC Class Codes: H01L 23/552 Protection against radiation, e.g. light or electromagnetic waves
• CPC Class Codes: H01L 23/562 Protection against mechanical damage H01L23/02, H01L23/28 take precedence
• CPC Class Codes: H01L 24/16 : of an individual bump connector
• CPC Class Codes: H01L 24/29 : of an individual layer connector
• CPC Class Codes: H01L 24/32 : of an individual layer connector
• CPC Class Codes: H01L 24/48 : of an individual wire connector
• CPC Class Codes: H01L 24/49 : of a plurality of wire connectors
• CPC Class Codes: H01L 24/73 : Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
• CPC Class Codes: H01L 2924/00012 : Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/014 : Solder alloys
• CPC Class Codes: H01L 2924/1433 : Application-specific integrated circuit [ASIC]
• CPC Class Codes: H01L 2924/1461 : MEMS
• CPC Class Codes: H01L 2924/181 : Encapsulation
• CPC Class Codes: H01L 2924/19105 : in a side-by-side arrangement on a common die mounting substrate
• CPC Class Codes: H01L 2924/207 : Diameter ranges
• CPC Class Codes: H05K 1/186 : manufactured by mounting on or connecting to patterned circuits before or during embedding
• CPC Class Codes: H05K 3/30 : Assembling printed circuits with electric components, e.g. with resistor
• CPC Class Codes: Y10T 29/49147 : Assembling terminal to base

Abstract

A method for producing an electronic assembly in which an electronic component supported on a wiring support is encapsulated with an encapsulation material, the method including: —arranging the electronic component on the wiring support in such a manner that a stress applied onto the electronic component by the encapsulation material falls below a predetermined value; and —encapsulating the electronic component with the encapsulation material.

Claims

1. A method for producing an electronic assembly, in which an electronic component supported on a wiring carrier is encapsulated using an encapsulation material, comprising:

arranging the electronic component on the wiring carrier at a position of the wiring carrier at which movements of the encapsulation material caused by changes in temperature of the encapsulation material during an encapsulating process cancel each other out such that a stress introduction through the encapsulation material onto the electronic component during the encapsulating process falls below a predetermined value, and

encapsulating the electronic component using the encapsulation material, wherein the electronic component is an analysis circuit for analyzing measurement signals from at least two encoder elements, which are arranged symmetrically around the analysis circuit.

2. The method as claimed in claim 1, wherein the encapsulation material has a coefficient of thermal expansion which is in the range of a coefficient of thermal expansion of the electronic component.

3. The method as claimed in claim 2, wherein the encapsulation material comprises a curable resin.

4. The method as claimed in claim 3, wherein the curable resin is an epoxy resin.

5. The method as claimed in claim 1, wherein, for the encapsulation of the electronic component using the encapsulation material, a shape is selected, in the case of which the movement of the encapsulation material in at least one direction falls below a predetermined value.

6. The method as claimed in claim 5, wherein the shape is selected such that a wall thickness of the encapsulation material on at least one wall of the electronic component falls below a predetermined value.

7. The method as claimed in claim 1, wherein the wiring carrier comprises a terminal for electrically contacting the electronic component with a printed circuit board and an electrical shielding layer, comprising arranging the electronic component on the wiring carrier such that the electronic component is accommodated, viewed in at least one direction of the electrical assembly, between the electrical shielding layer and the terminal.

8. An electronic assembly, which is produced using the method as claimed in claim 1, comprising:

the electronic component supported on the wiring carrier, which is encapsulated using the encapsulation material,

wherein the electronic component is arranged on the wiring carrier at the position of the wiring carrier at which the movements of the encapsulation material cancel each other out such that the stress introduction through the encapsulation material onto the electronic component falls below the predetermined value.

9. A method for producing an electronic assembly, in which an electronic component supported on a wiring carrier is encapsulated using an encapsulation material, comprising;

arranging the electronic component on the wiring carrier at a position of the wiring carrier at which movements of the encapsulation material caused by changes in temperature of the encapsulation material during an encapsulating process cancel each other out such that a stress introduction through the encapsulation material onto the electronic component during the encapsulating process falls below a predetermined value,

encapsulating the electronic component using the encapsulation material, and

enveloping the electronic component with a mechanical decoupling layer before the encapsulating process.