Modular electronic device with improved retention/release features and related assembly methods
First Claim
Patent Images
1. A modular electronic device, comprising:
- a plurality of electronic modules, the plurality of electronic modules including a first electronic module, the first electronic module including a module housing;
a frame defining a plurality of bays, the frame adapted to respectively receive the plurality of electronic modules at the plurality of bays, the plurality of bays including a first bay configured to receive the first electronic module;
a fixed retention member associated with the frame;
a release member associated with the module housing, the release member being movable relative to the retention member between a locked position, wherein the retention member is configured to engage the release member so as to retain the first electronic module within the first bay, and an unlocked position, wherein the release member is disengaged from the retention member;
an electromechanical actuator provided in operative association with the release member for actuating the release member between the locked and unlocked positions; and
an engagement detection circuit configured to provide an indication of whether the release member is located at the locked position relative to the retention member.
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Abstract
An electronic module for a modular electronic device may include improved features for retaining the electronic module relative a frame of the modular electronic device and/or for subsequently removing such module from the frame. In addition, aspects of the present subject matter related to improved methods for assembling an electronic module for use with a modular electronic device.
26 Citations
24 Claims
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1. A modular electronic device, comprising:
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a plurality of electronic modules, the plurality of electronic modules including a first electronic module, the first electronic module including a module housing; a frame defining a plurality of bays, the frame adapted to respectively receive the plurality of electronic modules at the plurality of bays, the plurality of bays including a first bay configured to receive the first electronic module; a fixed retention member associated with the frame; a release member associated with the module housing, the release member being movable relative to the retention member between a locked position, wherein the retention member is configured to engage the release member so as to retain the first electronic module within the first bay, and an unlocked position, wherein the release member is disengaged from the retention member; an electromechanical actuator provided in operative association with the release member for actuating the release member between the locked and unlocked positions; and an engagement detection circuit configured to provide an indication of whether the release member is located at the locked position relative to the retention member. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11)
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12. A method for assembling an electronic module configured for use with a modular electronic device, the method comprising:
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positioning a first shield component on a support surface; positioning a printed circuit board assembly on top of the first shield component such that the printed circuit board assembly is supported above the support surface; installing at least one actuator component of an electromechanical actuator relative to the printed circuit board assembly; and positioning a second shield component relative to the first shield component such that the printed circuit board assembly and the at least one actuator component are positioned between the first and second shield components. - View Dependent Claims (13, 14, 15, 16, 17, 18, 19, 20, 21, 22)
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23. A method for assembling an electronic module configured for use with a modular electronic device, the method comprising:
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positioning a first shield component on a support surface; positioning a printed circuit board assembly on top of the first shield component such that the printed circuit board assembly is supported above the support surface, the printed circuit board assembly including a printed circuit board and at least one internal component of the electronic module mounted to the printed circuit board; and positioning a second shield component relative to the first shield component such that the printed circuit board assembly is encased between the first and second shield components. - View Dependent Claims (24)
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Specification