Transfer mold type sensor device

• US 9,964,560 B2
• Filed: 02/05/2014
• Issued: 05/08/2018
• Est. Priority Date: 06/28/2013
• Status: Active Grant

• Current Assignee: Hitachi Astemo Ltd. (Hitachi, Ltd.)
• Original Assignee: Hitachi Automotive Systems Limited (Hitachi, Ltd.)
• Inventors: Yaguchi, Akihiro, Hayashi, Masahide, Ohta, Kazunori, Okamoto, Akihiro
• Primary Examiner(s): Laballe, Clayton E
• Assistant Examiner(s): Fenwick, Warren K
• Application Number:
  US14/901,358
• Publication Number:
  US 20160131678A1
• Time in Patent Office: 1,553 Days
• Field of Search: 73511
• CPC Class Codes: G01C 19/04 Details
• CPC Class Codes: G01C 19/5783 Mountings or housings not specific to any of the devices covered by groups G01C19/5607 - G01C19/5719
• CPC Class Codes: G01P 1/023 for acceleration measuring devices
• CPC Class Codes: G01P 15/02 by making use of inertia forces using solid seismic massesG01P15/14 takes precedence
• CPC Class Codes: G01P 15/0802 Details
• CPC Class Codes: H01L 2224/32145 the bodies being stacked
• CPC Class Codes: H01L 2224/32245 the item being metallic
• CPC Class Codes: H01L 2224/45144 Gold (Au) as principal constituent
• CPC Class Codes: H01L 2224/48145 the bodies being stacked
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 23/3107 the device being completely enclosed
• CPC Class Codes: H01L 23/49531 the additional leads being a wiring board
• CPC Class Codes: H01L 23/49541 Geometry of the lead-frame
• CPC Class Codes: H01L 23/49551 characterised by bent parts
• CPC Class Codes: H01L 23/562 Protection against mechanical damage H01L23/02, H01L23/28 take precedence
• CPC Class Codes: H01L 24/73 Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/181 Encapsulation

Abstract

To provide a high-reliable transfer mold type sensor device in which a combined sensor including a plurality of sensors having a function of detecting physical amounts, a substrate processing a signal from the combined sensor and controlling a signal input/output with an external device, a chip pad mounted with the combined sensor and the substrate, and a lead frame are sealed with a mold resin and a package is formed, the combined sensor is configured to be thicker than the substrate and the chip pad, a principal surface side of the combined sensor is covered with the mold resin and a back surface side thereof contacts the substrate by a joint material, and the combined sensor is arranged on a package neutral surface in a cross-section of a thickness direction of the package including the combined sensor, the substrate, and the chip pad.

Claims

1. A transfer mold type sensor device in which a combined sensor including a plurality of sensors having a function of detecting physical amounts, a substrate processing a signal from the combined sensor and controlling a signal input/output with an external device, a chip pad mounted with the combined sensor and the substrate, and a lead frame are sealed with a mold resin and a package is formed,

wherein the combined sensor is configured to be thicker than the substrate and the chip pad,

a principal surface side of the combined sensor is covered with the mold resin and a back surface side thereof contacts the substrate by a joint material,

the combined sensor is arranged on a package neutral surface in a cross-section of a thickness direction of the package including the combined sensor, the substrate, and the chip pad, and

wherein the combined sensor, the substrate, and the chip pad are laminated in the thickness direction of the package, such that volumes of the mold resin on and below the package neutral surface are almost equalized.

2. A transfer mold type sensor device in which a combined sensor including a plurality of sensors having a function of detecting physical amounts, a substrate processing a signal from the combined sensor and controlling a signal input/output with an external device, a chip pad mounted with the combined sensor and the substrate, and a lead frame are sealed with a mold resin and a package is formed,

wherein the combined sensor is configured to be thicker than the substrate and the chip pad,

a principal surface side of the combined sensor is covered with the mold resin and a back surface side thereof contacts the substrate by a joint material,

the combined sensor is arranged on a package neutral surface in a cross-section of a thickness direction of the package including the combined sensor, the substrate, and the chip pad, and

wherein the lead frame includes an inner lead portion inside the package and an outer lead portion outside the package and the chip pad mounted with the combined sensor and the substrate and a boundary portion of the inner lead portion and the outer lead portion are positioned at different heights in the thickness direction of the package.

3. A transfer mold type sensor device in which a combined sensor including a plurality of sensors having a function of detecting physical amounts, a substrate processing a signal from the combined sensor and controlling a signal input/output with an external device, a chip pad mounted with the combined sensor and the substrate, and a lead frame are sealed with a mold resin and a package is formed,

wherein the combined sensor is configured to be thicker than the substrate and the chip pad,

a principal surface side of the combined sensor is covered with the mold resin and a back surface side thereof contacts the substrate by a joint material,

the combined sensor is arranged on a package neutral surface in a cross-section of a thickness direction of the package including the combined sensor, the substrate, and the chip pad, and

wherein the substrate is composed of a semiconductor chip.

4. A transfer mold type sensor device in which a combined sensor including a plurality of sensors having a function of detecting physical amounts, a substrate processing a signal from the combined sensor and controlling a signal input/output with an external device, a chip pad mounted with the combined sensor and the substrate, and a lead frame are sealed with a mold resin and a package is formed,

wherein the combined sensor is configured to be thicker than the substrate and the chip pad,

a principal surface side of the combined sensor is covered with the mold resin and a back surface side thereof contacts the substrate by a joint material,

the combined sensor is arranged on a package neutral surface in a cross-section of a thickness direction of the package including the combined sensor, the substrate, and the chip pad, and

wherein the substrate is composed of a printed wiring board provided with a semiconductor chip and a wiring pattern and the semiconductor chip is laminated on the printed wiring board by the joint material.

5. A transfer mold type sensor device in which a combined sensor including a plurality of sensors having a function of detecting physical amounts, a substrate processing a signal from the combined sensor and controlling a signal input/output with an external device, a chip pad mounted with the combined sensor and the substrate, and a lead frame are sealed with a mold resin and a package is formed,

wherein the combined sensor is configured to be thicker than the substrate and the chip pad,

a principal surface side of the combined sensor is covered with the mold resin and a back surface side thereof contacts the substrate by a joint material,

the combined sensor is arranged on a package neutral surface in a cross-section of a thickness direction of the package including the combined sensor, the substrate, and the chip pad, and

wherein a sensor having high sensitivity to deformation of the package among a plurality of sensors configuring the combined sensor is arranged on the package neutral surface in the cross-section of the thickness direction of the package including at least the combined sensor, the substrate, and the chip pad.

6. A transfer mold type sensor device, in which a combined sensor including a plurality of sensors having a function of detecting physical amounts, a substrate processing a signal from the combined sensor and controlling a signal input/output with an external device, a chip pad mounted with the combined sensor and the substrate, and a lead frame are sealed with a mold resin and a package is formed,

wherein the combined sensor is configured to be thicker than the substrate and the chip pad,

a principal surface side of the combined sensor is covered with the mold resin and a back surface side thereof contacts the substrate by a joint material,

the combined sensor is arranged on a package neutral surface in a cross-section of a thickness direction of the package including the combined sensor, the substrate, and the chip pad, and

wherein a sensor having high sensitivity to deformation of the package among a plurality of sensors configuring the combined sensor is arranged in a region where a change rate of package warpage deformation caused by a thermal load applied to the package is small.

7. A transfer mold type sensor device in which a combined sensor including a plurality of sensors having a function of detecting physical amounts, a substrate processing a signal from the combined sensor and controlling a signal input/output with an external device, a chip pad mounted with the combined sensor and the substrate, and a lead frame are sealed with a mold resin and a package is formed,

wherein the combined sensor is configured to be thicker than the substrate and the chip pad,

a principal surface side of the combined sensor is covered with the mold resin and a back surface side thereof contacts the substrate by a joint material,

the combined sensor is arranged on a package neutral surface in a cross-section of a thickness direction of the package including the combined sensor, the substrate, and the chip pad, and

wherein a linear expansion coefficient of the mold resin is set in a range of 7 to 11×

10-6/°

C.

8. The transfer mold type sensor device according to claim 7, wherein a sensor having high sensitivity to deformation of the package among a plurality of sensors configuring the combined sensor is arranged on the package neutral surface in the cross-section of the thickness direction of the package including at least the combined sensor, the substrate, and the chip pad.

9. The transfer mold type sensor device according to claim 7, wherein a sensor having high sensitivity to deformation of the package among a plurality of sensors configuring the combined sensor is arranged in a region where a change rate of package warpage deformation caused by a thermal load applied to the package is small.

10. A transfer mold type sensor device in which a combined sensor including a plurality of sensors having a function of detecting physical amounts, a substrate processing a signal from the combined sensor and controlling a signal input/output with an external device, a chip pad mounted with the combined sensor and the substrate, and a lead frame are sealed with a mold resin and a package is formed,

wherein the combined sensor is configured to be thicker than the substrate and the chip pad,

a principal surface side of the combined sensor is covered with the mold resin and a back surface side thereof contacts the substrate by a joint material,

the combined sensor is arranged on a package neutral surface in a cross-section of a thickness direction of the package including the combined sensor, the substrate, and the chip pad, and

wherein a glass transition temperature of the mold resin is equal to or higher than a temperature of the upper limit of a thermal load range applied to the package.

11. A transfer mold type sensor device in which a combined sensor including a plurality of sensors having a function of detecting physical amounts, a substrate processing a signal from the combined sensor and controlling a signal input/output with an external device, a chip pad mounted with the combined sensor and the substrate, and a lead frame are sealed with a mold resin and a package is formed,

wherein the combined sensor is configured to be thicker than the substrate and the chip pad,

a principal surface side of the combined sensor is covered with the mold resin and a back surface side thereof contacts the substrate by a joint material,

the combined sensor is arranged on a package neutral surface in a cross-section of a thickness direction of the package including the combined sensor, the substrate, and the chip pad, and

wherein the combined sensor includes a plurality of acceleration sensors and an angular velocity sensor.