Ranging cameras using a common substrate

• US 9,965,856 B2
• Filed: 03/04/2014
• Issued: 05/08/2018
• Est. Priority Date: 10/22/2013
• Status: Active Grant

• Current Assignee: Seegrid Corporation
• Original Assignee: Seegrid Corporation
• Inventors: Weiss, Mitchell
• Primary Examiner(s): Aynalem, Nathnael
• Application Number:
  US14/196,147
• Publication Number:
  US 20150109422A1
• Time in Patent Office: 1,526 Days
• Field of Search: 348 48, 348340
• CPC Class Codes: G06T 7/85 Stereo camera calibration
• CPC Class Codes: H04N 13/204 using stereoscopic image cameras stereoscopic photography G03B35/00
• CPC Class Codes: H04N 13/239 using two 2D image sensors having a relative position equal to or related to the interocular distance H04N13/243 takes precedence
• CPC Class Codes: H04N 2213/001 Constructional or mechanical details
• CPC Class Codes: H04N 23/54 Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
• CPC Class Codes: H04N 23/55 Optical parts specially adapted for electronic image sensors; Mounting thereof

Abstract

A stereo camera system useful in, for example, range finding applications. The system is designed for simple manufacture and long term stability. It includes a thermally stable substrate onto which are mounted multiple imagers. The relative positions of the imagers and corresponding optical elements are maintained in precise alignment.

Claims

1. A stereo ranging system, comprising:

a common substrate comprising a printed circuit board having a thickness of at least ⅛

″

;

at least two semiconductor imagers secured to a flat surface of the common substrate and maintained at predefined locations relative to the flat surface; and

a rail system comprising at least one rail, the rail system configured to receive at least two edges of the common substrate and enable expansion in length and width directions while maintaining the common substrate above a mounting structure to which the rail system is configured to secure.

2. The system of claim 1, wherein the at least two semiconductor imagers includes two cameras, each camera comprising an imager chip and a lens holder that maintains at least one lens relative to the imager chip, wherein each camera is individually secured to the substrate.

3. The system of claim 1, wherein the at least two semiconductor imagers are at least two wafer scale cameras.

4. The system of claim 1, wherein the substrate is configured to resist changes in size and shape in a temperature range of about −

20°

C. to about 50°

C.

5. The system of claim 1, wherein the circuit board is made from fiber reinforced resins.

6. The system of claim 1, wherein the circuit board has a stiffness of at least three times the stiffness of a similar sized FR4 circuit board.

12. The system of claim 1, wherein the printed circuit board is a single layer circuit board having a thickness of at least ⅛

″

.

7. A stereo ranging system, comprising:

a common substrate having a flat surface, the substrate including a stiffening material having substantially the same coefficient of thermal expansion as other materials in the common substrate;

at least two semiconductor imagers secured to the flat surface of the common substrate and maintained at predefined locations relative to the flat surface; and

a rail system comprising at least one rail, the rail system configured to receive at least two edges of the common substrate and enable expansion in length and width directions while maintaining the common substrate above a mounting structure to which the rail system is configured to secure.

8. The system of claim 7, wherein the rail system comprises at least two rails, each rail defining a channel that receives the edges of the common substrate.

9. The system of claim 7, wherein the rail system comprises fasteners configured to secure the at least one rail to the mounting structure.

10. The system of claim 7, wherein the common substrate includes at least one opening configured to receive a pin extending from the mounting service, to assist in maintaining the common substrate within the at least two rails.

11. The system of claim 7, wherein the common substrate is a multilayered circuit board that includes at least two layers having a thickness of at least 1/16″

.