Stack die package

• US 9,966,330 B2
• Filed: 03/14/2013
• Issued: 05/08/2018
• Est. Priority Date: 03/14/2013
• Status: Active Grant

• Current Assignee: Vishay Siliconix
• Original Assignee: Vishay Siliconix
• Inventors: Terrill, Kyle, Kuo, Frank, Mao, Sen
• Primary Examiner(s): Pizarro, Marcos D
• Assistant Examiner(s): Crite, Antonio
• Application Number:
  US13/829,623
• Publication Number:
  US 20140264804A1
• Time in Patent Office: 1,881 Days
• Field of Search: 257666, 257668, 257686, 257701, 257734, 257762, 257737, 257735, 257288, 257E21006, 257E21177, 257E21324, 257E21499, 257E21503, 257E21508, 257E21511, 257E21523
• CPC Class Codes: H01L 21/561 Batch processing
• CPC Class Codes: H01L 2224/371 with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
• CPC Class Codes: H01L 2224/37147 Copper [Cu] as principal constituent
• CPC Class Codes: H01L 2224/3754 Coating
• CPC Class Codes: H01L 2224/40095 Kinked
• CPC Class Codes: H01L 2224/40245 the item being metallic
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48465 the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
• CPC Class Codes: H01L 2224/49111 the connectors connecting two common bonding areas, e.g. Litz or braid wires
• CPC Class Codes: H01L 2224/73221 Strap and wire connectors
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2224/83801 Soldering or alloying
• CPC Class Codes: H01L 2224/8385 using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester
• CPC Class Codes: H01L 2224/84801 Soldering or alloying
• CPC Class Codes: H01L 2224/8485 using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester
• CPC Class Codes: H01L 23/051 another lead being formed by a cover plate parallel to the base plate, e.g. sandwich type
• CPC Class Codes: H01L 23/49513 having bonding material between chip and die pad
• CPC Class Codes: H01L 23/4952 the additional leads being a bump or a wire
• CPC Class Codes: H01L 23/49541 Geometry of the lead-frame
• CPC Class Codes: H01L 23/49568 specifically adapted to facilitate heat dissipation
• CPC Class Codes: H01L 23/49575 : Assemblies of semiconductor devices on lead frames
• CPC Class Codes: H01L 24/34 : Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
• CPC Class Codes: H01L 24/36 : Structure, shape, material or disposition of the strap connectors prior to the connecting process
• CPC Class Codes: H01L 24/37 : of an individual strap connector
• CPC Class Codes: H01L 24/40 : of an individual strap connector
• CPC Class Codes: H01L 24/41 : of a plurality of strap connectors
• CPC Class Codes: H01L 24/73 : Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
• CPC Class Codes: H01L 24/97 : the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 2924/00 : Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 : Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/12042 : LASER
• CPC Class Codes: H01L 2924/1306 : Field-effect transistor [FET]
• CPC Class Codes: H01L 2924/13091 : Metal-Oxide-Semiconductor Field-Effect Transistor [MOSFET]
• CPC Class Codes: H01L 2924/181 : Encapsulation

Abstract

In one embodiment, a stack die package can include a lead frame and a first die including a gate and a source that are located on a first surface of the first die and a drain that is located on a second surface of the first die that is opposite the first surface. The gate and source are flip chip coupled to the lead frame. The stack die package can include a second die including a gate and a drain that are located on a first surface of the second die and a source that is located on a second surface of the second die that is opposite the first surface. The source of the second die is facing the drain of the first die.

Claims

1. A stack die package comprising:

a lead frame;

a first die comprising a gate and a source that are located on a first surface of said first die and a drain that is located on a second surface of said first die that is opposite said first surface, said gate and source are flip chip coupled to said lead frame, said first die comprising split gate technology;

a second die comprising a gate and a drain that are located on a first surface of said second die and a source that is located on a second surface of said second die that is opposite said first surface, said source of said second die is facing said drain of said first die;

a clip coupled to said lead frame and said drain of said second die; and

a molding material covering said first die, second die, and clip while a portion of an upper surface of said clip is free of said molding material, said portion of said upper surface of said clip is free of plating material and is exposed in final package.

2. The stack die package of claim 1, further comprising:

a second clip coupled to said lead frame and said source of said second die.

3. The stack die package of claim 1, further comprising:

a second clip coupled to said lead frame and said drain of said first die.

4. The stack die package of claim 1, further comprising:

a second clip coupled to said lead frame and said gate of said second die.

5. The stack die package of claim 4, further comprising:

a third clip coupled to said lead frame, said drain of said first die, and said source of said second die.

6. The stack die package of claim 4, further comprising:

a third clip coupled to said lead frame and said source of said second die.

7. The stack die package of claim 4, further comprising:

a third clip coupled to said lead frame and said drain of said first die.

8. A stack die package comprising:

a lead frame;

a first die comprising a gate and a source that are located on a first surface of said first die and a drain that is located on a second surface of said first die that is opposite said first surface, said gate and source are flip chip coupled to said lead frame, said first die comprising split gate technology;

a second die comprising a gate and a source that are located on a first surface of said second die and a drain that is located on a second surface of said second die that is opposite said first surface, said source of said second die is facing said drain of said first die;

a clip coupled to said lead frame and said drain of said second die; and

a molding material covering said first die, second die, and clip while a portion of an upper surface of said clip is free of said molding material, said portion of said upper surface of said clip is free of plating material and is exposed in final package.

9. The stack die package of claim 8, further comprising:

a second clip coupled to said lead frame and said source of said second die.

10. The stack die package of claim 8, further comprising:

a second clip coupled to said lead frame and said drain of said first die.

11. The stack die package of claim 8, further comprising:

a second clip coupled to said lead frame and said gate of said second die.

12. The stack die package of claim 11, further comprising:

a third clip coupled to said lead frame, said drain of said first die, and said source of said second die.

13. The stack die package of claim 11, further comprising:

a third clip coupled to said lead frame and said source of said second die.

14. The stack die package of claim 11, further comprising:

a third clip coupled to said lead frame and said drain of said first die.

15. A stack die package comprising:

a lead frame;

a first die comprising a gate and a source that are located on a first surface of said first die and a drain that is located on a second surface of said first die that is opposite said first surface, said gate and source are flip chip coupled to said lead frame, said first die comprising split gate technology;

a second die comprising a gate and a drain that are located on a first surface of said second die and a source that is located on a second surface of said second die that is opposite said first surface, said source of said second die is facing said drain of said first die, said second die comprising Laterally Diffused Metal Oxide Semiconductor (LDMOS) technology;

a clip coupled to said lead frame and said drain of said second die; and

a molding material covering said first die, second die, and clip while a portion of an upper surface of said clip is free of said molding material, said portion of said upper surface of said clip is free of plating material and is exposed in final package.

16. The stack die package of claim 15, further comprising:

a second clip coupled to said lead frame and said source of said second die.

17. The stack die package of claim 15, further comprising:

a second clip coupled to said lead frame and said drain of said first die.

18. The stack die package of claim 15, further comprising:

a second clip coupled to said lead frame and said gate of said second die.

19. The stack die package of claim 18, further comprising:

a third clip coupled to said lead frame, said drain of said first die, and said source of said second die.

20. The stack die package of claim 18, further comprising:

a third clip coupled to said lead frame and said source of said second die.