Light emitting device and method for manufacturing the same

• US 9,966,504 B2
• Filed: 07/17/2017
• Issued: 05/08/2018
• Est. Priority Date: 03/15/2007
• Status: Active Grant

• Current Assignee: Sharp Kabushiki Kaisha (Hon Hai Precision Industry Co., Ltd.)
• Original Assignee: Sharp Kabushiki Kaisha (Hon Hai Precision Industry Co., Ltd.)
• Inventors: Konishi, Masahiro, Agatani, Makoto, Hata, Toshio
• Primary Examiner(s): Williams, Joseph L
• Application Number:
  US15/651,492
• Publication Number:
  US 20170317244A1
• Time in Patent Office: 295 Days
• CPC Class Codes: F21K 9/20 Light sources comprising attachment means
• CPC Class Codes: F21K 9/232 specially adapted for generating an essentially omnidirectional light distribution, e.g. with a glass bulb
• CPC Class Codes: F21V 23/002 Arrangements of cables or conductors inside a lighting device, e.g. means for guiding along parts of the housing or in a pivoting arm
• CPC Class Codes: F21Y 2105/10 comprising a two-dimensional array of point-like light-generating elements
• CPC Class Codes: F21Y 2115/10 Light-emitting diodes [LED]
• CPC Class Codes: H01L 2224/45124 Aluminium (Al) as principal constituent
• CPC Class Codes: H01L 2224/45144 Gold (Au) as principal constituent
• CPC Class Codes: H01L 2224/45147 Copper (Cu) as principal constituent
• CPC Class Codes: H01L 2224/45169 Platinum (Pt) as principal constituent
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48465 the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 24/45 of an individual wire connector
• CPC Class Codes: H01L 25/0753 the devices being arranged next to each other
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01015 Phosphorus [P]
• CPC Class Codes: H01L 2924/01047 Silver [Ag]
• CPC Class Codes: H01L 2924/01068 Erbium [Er]
• CPC Class Codes: H01L 2924/01087 : Francium [Fr]
• CPC Class Codes: H01L 2924/09701 : Low temperature co-fired ceramic [LTCC]
• CPC Class Codes: H01L 2924/12041 : LED
• CPC Class Codes: H01L 2924/181 : Encapsulation
• CPC Class Codes: H01L 2924/3011 : Impedance
• CPC Class Codes: H01L 2924/3025 : Electromagnetic shielding
• CPC Class Codes: H01L 33/32 : containing nitrogen
• CPC Class Codes: H01L 33/36 : characterised by the electrodes
• CPC Class Codes: H01L 33/38 : with a particular shape
• CPC Class Codes: H01L 33/502 : Wavelength conversion materials
• CPC Class Codes: H01L 33/56 : Materials, e.g. epoxy or silicone resin
• CPC Class Codes: H01L 33/60 : Reflective elements
• CPC Class Codes: H01L 33/62 : Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
• CPC Class Codes: H01L 33/641 : characterized by the materials

Abstract

By using a light emitting device including an insulating substrate and a light emitting unit formed on the insulating substrate, the light emitting unit including: a plurality of linear wiring patterns disposed on the insulating substrate in parallel with one another, a plurality of light emitting elements that are mounted between the wiring patterns while being electrically connected to the wiring patterns, and a sealing member for sealing the light emitting elements, as well as a method for manufacturing thereof, it becomes possible to provide a light emitting device that achieves sufficient electrical insulation and has simple manufacturing processes so that it can be manufactured at a low cost, and a method for manufacturing the same.

Claims

1. A light emitting device comprising:

a substrate having a top surface and a bottom surface opposite from the top surface, the substrate including a lighting area and a peripheral area surrounding the lighting area in the top surface of said substrate;

a positive electrode land for external connection on the top surface and a negative electrode land for external connection on the top surface, said positive and negative electrode lands being provided on the peripheral area of said substrate;

a light emitting unit formed on the lighting area of said substrate, including a plurality of light emitting elements, and a sealing member for sealing and covering the plurality of light emitting elements, the sealing member being located within the lighting area,

wherein the sealing member includes a first sealing member layer containing a first fluorescent material and a second sealing member layer that contains a second fluorescent material that is different from the first fluorescent material.

2. The light emitting device of claim 1, wherein the shape of the upper face of sealing member is hexagonal shape, a round shape or a rectangular shape.

3. The light emitting device of claim 1, wherein the shape of the upper face of the substrate is a round shape or a rectangular shape.

4. The light emitting device of claim 1, wherein the substrate includes a positive polarity mark adjacent to the positive electrode land.

5. The light emitting device of claim 4, wherein the substrate includes a negative polarity mark adjacent to the negative electrode land.

6. The light emitting device of claim 1, wherein the substrate includes a negative polarity mark adjacent to the negative electrode land.

7. The light emitting device of claim 1, further comprising wiring patterns, wherein

wiring patterns include a cathode wiring pattern and an anode wiring pattern disposed on the top surface of said substrate and connected to said positive and negative electrode lands, respectively.

8. The light emitting device of claim 7, wherein

the positive electrode land is connected to the anode wiring pattern through lead-out wiring patterns, and the negative electrode land is connected to the cathode wiring pattern through lead-out wiring patterns, and wherein

lead-out wiring patterns include a first lead-out wiring pattern that is formed between the positive electrode land and the anode wiring pattern, and a second lead-out wiring pattern that is formed between the negative electrode land and the cathode wiring pattern.

9. The light emitting device of claim 1, wherein the second sealing member layer is formed on the first sealing member layer.

10. The light emitting device of claim 9, wherein the second sealing member covers at least one portion of the first sealing member layer.